Flexible / Dampening Conformal Coatings

Bectron® -- PL 1102
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Type: High Dielectric
  • Cure / Technology: Single Component
  • Composition: Unfilled
  • Form / Shape: Liquid
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Type: Thermally Conductive; High Dielectric; Airbus standards
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Cryogenically Serviceable Epoxy Urethane System -- EP30DP-NV
from Master Bond, Inc.

Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as... [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy; Polyurethane
  • Form / Shape: Liquid
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Type: Thermally Conductive; Electrically Conductive; NASA Low Outgassing
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component  ; Addition Cure
Electrically Insulative, Two Component Epoxy System -- EP30M3LV-NV
from Master Bond, Inc.

Master Bond Polymer System EP30M3LV is a low viscosity, two component epoxy compound for high performance, chemical resistant casting and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix ratio. This... [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Liquid
Epoxy Has Low Thermal Expansion Coefficient -- EP30LTE
from Master Bond, Inc.

Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, coating, sealing and casting. This new two component epoxy resin compound cures readily at ambient or more... [See More]

  • Type: High Dielectric; Optical
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med
from Master Bond, Inc.

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

  • Type: Thermally Conductive; High Dielectric; ISO 10993-5
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Fast Curing, Non-Yellowing Two Component Epoxy -- EP30-4
from Master Bond, Inc.

Master Bond Polymer Adhesive EP30-4 is a unique low viscosity, two component epoxy adhesive for bonding, coating, and sealing formulated to cure at room temperature or more rapidly at elevated temperatures, with a two (2) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not... [See More]

  • Type: High Dielectric; Optical
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Liquid
Flexibilized and Toughened Low Viscosity Epoxy -- EP21FL
from Master Bond, Inc.

Master Bond Polymer System EP21FL is a low to moderate viscosity, two component epoxy resin system for high performance casting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This compound... [See More]

  • Chemical System: Epoxy
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Features: Flexible; Dissimilar Substrates
Flexibilized, Abrasion Resistant Epoxy -- EP30D-7
from Master Bond, Inc.

Master Bond Polymer System EP30D-7 is a versatile two component flexibilized epoxy featuring superior strength, toughness and abrasion resistance for high performance bonding, sealing, coating, potting and encapsulation applications. It contains the recognized advantageous performance... [See More]

  • Type: High Dielectric; Optical
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy; Polyurethane
  • Form / Shape: Liquid
Flexible, Electrically Conductive Two Component Epoxy -- EP79FL
from Master Bond, Inc.

EP79FL is a silver coated nickel filled polymer system that forms high strength bonds that are resistant to extreme cryogenic temperatures. It is electrically conductive and has a volume resistivity of <0.005 ohm-cm. As a silver coated nickel filled system, it is much more cost effective than... [See More]

  • Type: Thermally Conductive; Electrically Conductive
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
High Temperature Resistant, Two Component Epoxy -- EP30HT
from Master Bond, Inc.

Master Bond Polymer Adhesive EP30HT is a medium viscosity, two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not contain any... [See More]

  • Type: High Dielectric; Optical
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Liquid
Highly Flexible Epoxy Features Low Exotherm -- EP37-3FLF
from Master Bond, Inc.

Master Bond Polymer System EP37-3FLF is a very flexible, low viscosity, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. It features a forgiving one-to-one mix ratio by weight or volume. As an adhesive, it forms very flexible... [See More]

  • Type: High Dielectric
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Liquid Epoxy EP30F Resists Abrasion and Chemicals -- EP30F
from Master Bond, Inc.

Master Bond Polymer System EP30F is a new fast curing liquid epoxy resin compound for high perform-ance abrasion and chemical resistant seamless floors. This easy-to-use two component epoxy resin system offers a uniquely attractive combination of application and performance properties including... [See More]

  • Type: High Dielectric; Optical
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Liquid
Low Outgassing Two Component Epoxy -- EP30-2
from Master Bond, Inc.

Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly at elevated temperatures with a 100/10 mix ratio by weight. This resin system is 100% reactive and does... [See More]

  • Type: High Dielectric; Optical
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Liquid
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP
from Master Bond, Inc.

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]

  • Type: High Dielectric; Electrically Conductive
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Optically Clear, Low Viscosity, Two Component Epoxy -- EP30
from Master Bond, Inc.

Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]

  • Type: Optical
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Liquid
Tough Epoxy Polysulfide Adhesive Resists High Temperatures -- EP21TPHT
from Master Bond, Inc.

Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F which gives it a higher resistance to elevated temperatures than most polysulfide systems. [See More]

  • Type: Thermally Conductive; High Dielectric
  • Composition: Unfilled
  • Chemical System: Epoxy; Polyphenylene Sulfide
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Two Component, Room Temperature Curing Epoxy For Bonding, Coating, Sealing And Potting -- EP88FL
from Master Bond, Inc.

Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting. [See More]

  • Type: Thermally Conductive; High Dielectric; Optical; Cryogenically serviceable
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Type: Thermally Conductive; Electrically Conductive
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component  
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Type: High Dielectric
  • Composition: Filled
  • Chemical System: Polyurethane
  • Cure / Technology: Thermoset; Two Component