Unfilled Conformal Coatings

Bectron® -- PL 1102
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Composition: Unfilled
  • Cure / Technology: Single Component
  • Type: High Dielectric
  • Form / Shape: Liquid
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type: Thermally Conductive; High Dielectric; Airbus standards
  • Cure / Technology: Thermoset; Single Component
Epoxy Features Exceptional Chemical and Heat Resistance -- EP35SP
from Master Bond, Inc.

EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]

  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type: Thermally Conductive; High Dielectric
  • Cure / Technology: Thermoset; Two Component  
Epoxy Features Very Low Coefficient of Thermal Expansion -- EP30LTE-2
from Master Bond, Inc.

Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]

  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type: High Dielectric; NASA Low Outgassing
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type: Thermally Conductive; High Dielectric; Airbus Standards
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med
from Master Bond, Inc.

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type: Thermally Conductive; High Dielectric; ISO 10993-5
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Fast Curing, Optically Clear, Two Part Epoxy -- EP39-2
from Master Bond, Inc.

Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]

  • Composition: Unfilled
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial
High Temperature Resistant Epoxy Compound -- EP45HT
from Master Bond, Inc.

Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]

  • Composition: Unfilled
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial
High Temperature Resistant, One Component Epoxy System -- EP13
from Master Bond, Inc.

Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]

  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Single Component
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP
from Master Bond, Inc.

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]

  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type: High Dielectric; Electrically Conductive
  • Cure / Technology: Thermoset; Two Component  
Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type: High Dielectric; Optical
  • Cure / Technology: Thermoset; Two Component  
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2
from Master Bond, Inc.

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]

  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type: Thermally Conductive; High Dielectric; Optical; NASA Low Outgassing
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Aremco-Seal™ -- 617
from Aremco Products, Inc.

Glass coating for producing hermetic seals [See More]

  • Composition: Unfilled
  • Chemical System: Glass
  • Type: High Dielectric
  • Cure / Technology: Thermoset
Electric Heater Cement -- No. 6
from Sauereisen, Inc.

Sauereisen Electric Heater Cement No. 6 is a versatile high-temperature cement used for refractory coatings, lining furnaces, embedding electric heating elements, coating resistors, molding and insulating. No. 6 is supplied in Powder form and needs only be mixed with water to apply. [See More]

  • Composition: Unfilled
  • Chemical System: Ceramic
  • Type: Thermally Conductive; High Dielectric
  • Form / Shape: Powder
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Composition: Unfilled
  • Chemical System: Silicone
  • Type: Thermally Conductive; Electrically Conductive
  • Cure / Technology: Thermoset; Two Component  
Epoxy Adhesive -- ANE-26144
from Protavic America, Inc.

Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]

  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Option of one or two component
Filled Epoxy Cast -- PNE-30270
from Protavic America, Inc.

A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]

  • Composition: Unfilled
  • Chemical System: Epoxy
  • Type: Thermally Conductive; High Dielectric
  • Cure / Technology: Thermoset; Single Component
Optically Clear UV Adhesive -- ANA-97290
from Protavic America, Inc.

ANA-97290 is a clear Ultraviolet/ Visible light curing adhesive. It has very low shrinkage during cure for alignment sensitive parts. It is recommended for small electrical/electronic casting and encapsulating applications that require a unique combination of excellent wetting, flow, good thermal... [See More]

  • Composition: Unfilled
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
  • Type: Electrically Conductive
  • Form / Shape: Gel (optional feature); Liquid
Polyurethane Adhesive -- PNU-56200
from Protavic America, Inc.

PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]

  • Composition: Unfilled
  • Chemical System: Polyurethane
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component