Electrically Conductive Conformal Coatings

Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Type: Thermally Conductive; Electrically Conductive; NASA Low Outgassing
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component  ; Addition Cure
Flexible, Electrically Conductive Two Component Epoxy -- EP79FL
from Master Bond, Inc.

EP79FL is a silver coated nickel filled polymer system that forms high strength bonds that are resistant to extreme cryogenic temperatures. It is electrically conductive and has a volume resistivity of <0.005 ohm-cm. As a silver coated nickel filled system, it is much more cost effective than... [See More]

  • Type: Thermally Conductive; Electrically Conductive
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP
from Master Bond, Inc.

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]

  • Type: High Dielectric; Electrically Conductive
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Low Outgassing, Thermally Conductive Epoxy -- EP37-3FLFAO
from Master Bond, Inc.

Master Bond Polymer System EP37-3FLFAO is a two component system for high performance potting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures with a convenient one-to-one (1:1) mix ratio by weight or volume. It has an unusual blend of... [See More]

  • Type: High Dielectric; Electrically Conductive
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Nickel Filled Electrically Conductive Epoxy System -- EP76M
from Master Bond, Inc.

Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]

  • Type: Thermally Conductive; Electrically Conductive
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
One Component Liquid Epoxy Resin EP36CLV -- EP36CLV
from Master Bond, Inc.

Master Bond EP36CLV is a unique one component, high performance epoxy for bonding, sealing, potting and coating featuring electrical insulation, high temperature resistance and exceptionally low viscosity. It varies appreciably from other heat resistant epoxies in that it has far more toughness and... [See More]

  • Type: High Dielectric; Electrically Conductive
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Conformal EMI Shielding Material -- LOCTITE ABLESTIK EMI 8660S
from Henkel Corporation - Electronics

With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting devices require effective isolation to... [See More]

  • Type: Electrically Conductive
  • Form / Shape: Liquid
  • Cure / Technology: Single Component
  • Features: EMI/RFI Shielding
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Type: Thermally Conductive; Electrically Conductive
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component  
Optically Clear UV Adhesive -- ANA-97290
from Protavic America, Inc.

ANA-97290 is a clear Ultraviolet/ Visible light curing adhesive. It has very low shrinkage during cure for alignment sensitive parts. It is recommended for small electrical/electronic casting and encapsulating applications that require a unique combination of excellent wetting, flow, good thermal... [See More]

  • Type: Electrically Conductive
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
  • Composition: Unfilled
  • Form / Shape: Gel (optional feature); Liquid