Optical Grade / Material Conformal Coatings

Epoxy Has Low Thermal Expansion Coefficient -- EP30LTE
from Master Bond, Inc.

Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, coating, sealing and casting. This new two component epoxy resin compound cures readily at ambient or more... [See More]

  • Type: High Dielectric; Optical
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Fast Curing, Non-Yellowing Two Component Epoxy -- EP30-4
from Master Bond, Inc.

Master Bond Polymer Adhesive EP30-4 is a unique low viscosity, two component epoxy adhesive for bonding, coating, and sealing formulated to cure at room temperature or more rapidly at elevated temperatures, with a two (2) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not... [See More]

  • Type: High Dielectric; Optical
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Liquid
Flexibilized, Abrasion Resistant Epoxy -- EP30D-7
from Master Bond, Inc.

Master Bond Polymer System EP30D-7 is a versatile two component flexibilized epoxy featuring superior strength, toughness and abrasion resistance for high performance bonding, sealing, coating, potting and encapsulation applications. It contains the recognized advantageous performance... [See More]

  • Type: High Dielectric; Optical
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy; Polyurethane
  • Form / Shape: Liquid
High Strength UV Curable Adhesive -- UV15
from Master Bond, Inc.

Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Type: High Dielectric; Optical
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Chemical System: Epoxy
  • Form / Shape: Liquid
High Strength, Chemically Resistant UV Curable System -- UV18S
from Master Bond, Inc.

Master Bond UV18S is a new one component, high strength UV curable system with superb chemical resistance & flexibility for coating, sealing and bonding. It is a 100% reactive, mobile liquid at ambient temperatures which does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Type: High Dielectric; Optical
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Features: Impregnating Resin; Non-corrosive; Thermal Insulation; Dissimilar Substrates
High Strength, Non-Yellowing UV Curable -- UV15-7NV
from Master Bond, Inc.

Master Bond Polymer system UV15-7NV is a new one component, optically clear, non yellowing UV curable polymer system for high performance bonding, sealing and coating. It is 100% reactive and does not contain any solvents or other volatiles. When exposed to a source of UV light of adequate wave... [See More]

  • Type: High Dielectric; Optical
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Features: Non-corrosive; Thermal Insulation; Dissimilar Substrates
High Strength, UV Curable Epoxy System -- UV16
from Master Bond, Inc.

Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Type: High Dielectric; Optical
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Chemical System: Epoxy
  • Form / Shape: Liquid
High Temperature Resistant, Two Component Epoxy -- EP30HT
from Master Bond, Inc.

Master Bond Polymer Adhesive EP30HT is a medium viscosity, two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not contain any... [See More]

  • Type: High Dielectric; Optical
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Liquid
High Tensile Strength Epoxy Adhesive Utilizes Renewable Biomaterial -- EP70CN
from Master Bond, Inc.

Master Bond EP70CN is a two component, epoxy system for bonding, sealing, coating and potting featuring a natural curing agent. [See More]

  • Type: Thermally Conductive; High Dielectric; Optical
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Liquid Epoxy EP30F Resists Abrasion and Chemicals -- EP30F
from Master Bond, Inc.

Master Bond Polymer System EP30F is a new fast curing liquid epoxy resin compound for high perform-ance abrasion and chemical resistant seamless floors. This easy-to-use two component epoxy resin system offers a uniquely attractive combination of application and performance properties including... [See More]

  • Type: High Dielectric; Optical
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Liquid
Low Outgassing Two Component Epoxy -- EP30-2
from Master Bond, Inc.

Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly at elevated temperatures with a 100/10 mix ratio by weight. This resin system is 100% reactive and does... [See More]

  • Type: High Dielectric; Optical
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Liquid
Low Stress, NASA Low Outgassing Silicone Adhesive -- MasterSil 920-LO
from Master Bond, Inc.

MasterSil 920-LO is an ideal material for the encapsulation of sensitive electronic and optical components, especially when low stress is a critical requirement. This neutral curing, non-corrosive, RTV silicone has very good flow properties and outstanding electrical insulation values, which enhance... [See More]

  • Type: High Dielectric; Optical; NASA Low Outgassing
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Type: High Dielectric; Optical
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2
from Master Bond, Inc.

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]

  • Type: Thermally Conductive; High Dielectric; Optical; NASA Low Outgassing
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Low Viscosity, Flexibilized Two Component Epoxy -- EP30FL
from Master Bond, Inc.

Master Bond Polymer System EP30FL is a low viscosity, flexibilized, two component epoxy resin system for high performance potting, casting, encapsulation as well as bonding and sealing. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1)... [See More]

  • Type: High Dielectric; Optical
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Liquid
Low Viscosity, Non-Yellowing Two Component Epoxy -- EP112LS
from Master Bond, Inc.

EP112LS is optically clear, features reliable non-yellowing properties and has a refractive index of 1.55. This electrically insulative system is resistant to chemicals including water, oils, fuels, acids and bases. Featuring a mixed viscosity of 50-200 cps, EP112LS is serviceable over the... [See More]

  • Type: High Dielectric; Optical
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Low Viscosity, Two Component Epoxy -- EP30-1
from Master Bond, Inc.

Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This... [See More]

  • Type: High Dielectric; Optical
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Liquid
Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance -- EP30NS
from Master Bond, Inc.

Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]

  • Type: Thermally Conductive; High Dielectric; Optical; NASA Low Outgassing
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Nanosilica Filled, Optically Clear Epoxy Adhesive -- EP113
from Master Bond, Inc.

Formulated for potting, coating and sealing applications, EP113 is a two component, nanosilica filled epoxy. The nano particles enhance the dimensional stability and the already exceptionally low shrinkage upon curing. This low viscosity system bonds well to a wide variety of substrates including... [See More]

  • Type: High Dielectric; Optical
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
One Component, Higher Viscosity Uv Curable System For Bonding, Sealing And Coating -- UV10TK40M
from Master Bond, Inc.

Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]

  • Type: Thermally Conductive; High Dielectric; Optical
  • Composition: Unfilled
  • Chemical System: UV curable
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; UV curing system
One Component, UV Curable Adhesive System -- UV10
from Master Bond, Inc.

Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]

  • Type: High Dielectric; Optical
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Features: Impregnating Resin; Non-corrosive; Thermal Insulation; Dissimilar Substrates
Optically Clear, Low Viscosity, Two Component Epoxy -- EP30
from Master Bond, Inc.

Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]

  • Type: Optical
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Liquid
Optically Clear, Room Temperature Curing Epoxy Blocks UV Light Transmission -- EP30-2LB
from Master Bond, Inc.

Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is a user friendly compound that has a non-critical ten to one mix ratio by weight. This system cures readily... [See More]

  • Type: Thermally Conductive; High Dielectric; Optical; NASA Low Outgassing
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Two Component, Room Temperature Curing Epoxy For Bonding, Coating, Sealing And Potting -- EP88FL
from Master Bond, Inc.

Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting. [See More]

  • Type: Thermally Conductive; High Dielectric; Optical; Cryogenically serviceable
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Two Part, Low Viscosity Epoxy Offers Long Working Life and High Elongation -- EP29LPHE
from Master Bond, Inc.

Optically clear EP29LPHE is a two component epoxy that has notable toughness along with high elongation, which imparts good impact and shock resistance. It bonds well to a wide variety of substrates including metals, ceramics, glass, optical fibers, graphite and many rubbers and plastics. Its... [See More]

  • Type: Thermally Conductive; High Dielectric; Optical
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing