OEM / Industrial Conformal Coatings
from RS Components, Ltd.
MG Silicone Conformal coating 340g [See More]
- Industry: Aerospace; Electronics; OEM or Industrial; Aerospace, Air Bag Controllers, Automobile, Aviation, Communication, Consumer Electronics Industries, Electric Generators, Industrial Control Equip
- Use Temperature: -40 to 392
- Chemical System: Silicone; Silicone
from ELANTAS North America LLC
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Industry: Aerospace; Electronics; OEM or Industrial
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Filled
from Hernon Manufacturing, Inc.
Ultrabond ® 3443 is a single component, tri-cure conformal coating formulated for bonding glass to glass or glass to metals. Ultrabond ® 3443 is excellent for bonding and tacking many parts. Ultrabond ® 3443 can also be cured with heat above 200 °F (93 °C) or Activator 56 or... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Aerospace
- Chemical System: Epoxy
- Type: Thermally Conductive; High Dielectric; Airbus standards
- Composition: Unfilled
from RS Components, Ltd.
MG prem acrylic conformal coating 419D [See More]
- Industry: Aerospace; Electronics; OEM or Industrial; Aerospace, Automobile, Aviation, Communication, Consumer Electronics Industry, Electrical, Electronic Components, Industrial, Instrumentation, Marine
- Use Temperature: -85 to 257
- Chemical System: Acrylic; Acrylic
from Hernon Manufacturing, Inc.
Ultrabond ® 71813 is a single component, tri-cure conformal coating formulated for bonding glass to glass or glass to metals. Ultrabond ® 71813 is excellent for bonding and tacking many parts. Ultrabond ® 71813 can also be cured with heat above 200 °F (93 °C) or Activator 56... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial
- Chemical System: UV Curing
- Type: Thermally Conductive; High Dielectric; NASA Low Outgassing
- Composition: Filled
from Hernon Manufacturing, Inc.
Ultrabond ® 773 is a single component, tri-cure conformal coating formulated for bonding glass to glass or glass to metals. Ultrabond ® 773 is excellent for bonding and tacking many parts. Ultrabond ® 773 can also be cured with heat above 200 °F (93 °C) or EF Primer 56. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial
- Chemical System: Silicone
- Type: Thermally Conductive; Electrically Conductive; NASA Low Outgassing
- Composition: Filled
from Hernon Manufacturing, Inc.
Ultrabond ® 3444 is a single component, tri-cure conformal coating formulated for bonding glass to glass or glass to metals. Ultrabond ® 3444 is excellent for bonding and tacking many parts. Ultrabond ® 3444 can also be cured with heat above 200 °F (93 °C) or Activator 56. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Downhole
- Chemical System: Epoxy
- Type: Thermally Conductive; High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial
- Chemical System: Epoxy
- Type: High Dielectric; NASA Low Outgassing
- Composition: Unfilled
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial
- Chemical System: Epoxy
- Type: Thermally Conductive; High Dielectric; Airbus Standards
- Composition: Unfilled
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Industry: Electronics; OEM or Industrial
- Chemical System: Epoxy
- Type: Thermally Conductive; High Dielectric; ISO 10993-5
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The recommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial
- Form / Shape: Liquid
- Cure / Technology: Thermoset; Two Component
- Use Temperature: -60 to 400
from Master Bond, Inc.
Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Industry: Aerospace; Electronics; Electric Power; OEM or Industrial
- Chemical System: Epoxy
- Type: High Dielectric; Electrically Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial
- Chemical System: Epoxy
- Type: High Dielectric; Optical
- Composition: Unfilled
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial
- Chemical System: Epoxy
- Type: Thermally Conductive; High Dielectric; Optical; NASA Low Outgassing
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial
- Chemical System: Epoxy
- Type: Thermally Conductive; High Dielectric; Optical; NASA Low Outgassing
- Composition: Filled
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Industry: Automotive; Electronics; Electric Power; OEM or Industrial
- Chemical System: Silicone
- Type: Thermally Conductive; Electrically Conductive
- Composition: Unfilled
from Aremco Products, Inc.
Exceptional electrical, moisture & chemical resistance [See More]
- Industry: Automotive; Electronics; OEM or Industrial; Tubular Heaters, & Electrical Devices
- Chemical System: Silicone
- Type: High Dielectric
- Composition: Filled
from Electro-Lite Corporation
ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]
- Industry: Electronics; OEM or Industrial
- Cure / Technology: UV or Radiation Cured
- Chemical System: Epoxy
- Form / Shape: Liquid
from Protavic America, Inc.
The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial
- Chemical System: Polyurethane
- Type: High Dielectric
- Composition: Filled
from Protavic America, Inc.
Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]
- Industry: Electronics; Electric Power; OEM or Industrial
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Protavic America, Inc.
ANA-97290 is a clear Ultraviolet/ Visible light curing adhesive. It has very low shrinkage during cure for alignment sensitive parts. It is recommended for small electrical/electronic casting and encapsulating applications that require a unique combination of excellent wetting, flow, good thermal... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial
- Composition: Unfilled
- Type: Electrically Conductive
- Cure / Technology: Thermoset; Two Component ; UV or Radiation Cured
from Protavic America, Inc.
PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial
- Chemical System: Polyurethane
- Type: High Dielectric
- Composition: Unfilled