Filled Conformal Coatings

ELAN-Tron® -- E 4141 White Resin / C 4141 Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Composition: Filled
  • Chemical System: UV Curing
  • Type: Thermally Conductive; High Dielectric; NASA Low Outgassing
  • Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Composition: Filled
  • Chemical System: Silicone
  • Type: Thermally Conductive; Electrically Conductive; NASA Low Outgassing
  • Cure / Technology: Thermoset; Two Component  ; Addition Cure
Epoxy Has Low Thermal Expansion Coefficient -- EP30LTE
from Master Bond, Inc.

Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, coating, sealing and casting. This new two component epoxy resin compound cures readily at ambient or more... [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: High Dielectric; Optical
  • Cure / Technology: Thermoset; Two Component  
Flexible, Electrically Conductive Two Component Epoxy -- EP79FL
from Master Bond, Inc.

EP79FL is a silver coated nickel filled polymer system that forms high strength bonds that are resistant to extreme cryogenic temperatures. It is electrically conductive and has a volume resistivity of <0.005 ohm-cm. As a silver coated nickel filled system, it is much more cost effective than... [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: Thermally Conductive; Electrically Conductive
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance -- EP30NS
from Master Bond, Inc.

Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: Thermally Conductive; High Dielectric; Optical; NASA Low Outgassing
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Nanosilica Filled, Optically Clear Epoxy Adhesive -- EP113
from Master Bond, Inc.

Formulated for potting, coating and sealing applications, EP113 is a two component, nanosilica filled epoxy. The nano particles enhance the dimensional stability and the already exceptionally low shrinkage upon curing. This low viscosity system bonds well to a wide variety of substrates including... [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: High Dielectric; Optical
  • Cure / Technology: Thermoset; Two Component  
Nickel Filled Electrically Conductive Epoxy System -- EP76M
from Master Bond, Inc.

Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: Thermally Conductive; Electrically Conductive
  • Cure / Technology: Thermoset; Two Component  
Room Temperature Curing Epoxy Features Low Thermal Resistance -- EP30TC
from Master Bond, Inc.

Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU •in/ft2 •hr • °F [2.60-2.88 W/(m •K)] and can be applied in sections as... [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: Thermally Conductive; High Dielectric; NASA Low Outgassing
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Toughened, Urethane Based Epoxy System Meets USP Class VI Specifications -- EP30DPBFMed
from Master Bond, Inc.

Master Bond EP30DPBFMed is a two part, flexibilized epoxy-urethane hybrid system that can be used for bonding, sealing, coating, and encapsulation. [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: Thermally Conductive; High Dielectric; USP Class VI
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Aremco-Seal™ -- 529
from Aremco Products, Inc.

Exceptional electrical, moisture & chemical resistance [See More]

  • Composition: Filled
  • Chemical System: Silicone
  • Type: High Dielectric
  • Cure / Technology: Thermoset
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Composition: Filled
  • Chemical System: Polyurethane
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
Silicone Adhesive -- PTS-46303
from Protavic America, Inc.

PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]

  • Composition: Filled
  • Chemical System: Silicone
  • Type: Thermally Conductive; Electrically Conductive
  • Cure / Technology: Thermoset; Two Component