Thermal / Heat Insulating Conformal Coatings

Epoxy Features Very Low Coefficient of Thermal Expansion -- EP30LTE-2
from Master Bond, Inc.

Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]

  • Features: Non-corrosive; Phase Change; Thermal Insulation; Dissimilar Substrates
  • Chemical System: Epoxy
  • Type: High Dielectric; NASA Low Outgassing
  • Composition: Unfilled
Fast Curing, Non-Yellowing Two Component Epoxy -- EP30-4
from Master Bond, Inc.

Master Bond Polymer Adhesive EP30-4 is a unique low viscosity, two component epoxy adhesive for bonding, coating, and sealing formulated to cure at room temperature or more rapidly at elevated temperatures, with a two (2) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not... [See More]

  • Features: Flexible; Non-corrosive; Thermal Insulation; Dissimilar Substrates
  • Chemical System: Epoxy
  • Type: High Dielectric; Optical
  • Cure / Technology: Thermoset; Two Component  
High Strength UV Curable Adhesive -- UV15
from Master Bond, Inc.

Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Features: Impregnating Resin; Non-corrosive; Thermal Insulation; Dissimilar Substrates
  • Chemical System: Epoxy
  • Type: High Dielectric; Optical
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
High Strength, Chemically Resistant UV Curable System -- UV18S
from Master Bond, Inc.

Master Bond UV18S is a new one component, high strength UV curable system with superb chemical resistance & flexibility for coating, sealing and bonding. It is a 100% reactive, mobile liquid at ambient temperatures which does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Features: Impregnating Resin; Non-corrosive; Thermal Insulation; Dissimilar Substrates
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Type: High Dielectric; Optical
  • Form / Shape: Liquid
High Strength, Non-Yellowing UV Curable -- UV15-7NV
from Master Bond, Inc.

Master Bond Polymer system UV15-7NV is a new one component, optically clear, non yellowing UV curable polymer system for high performance bonding, sealing and coating. It is 100% reactive and does not contain any solvents or other volatiles. When exposed to a source of UV light of adequate wave... [See More]

  • Features: Non-corrosive; Thermal Insulation; Dissimilar Substrates
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Type: High Dielectric; Optical
  • Form / Shape: Liquid
High Strength, UV Curable Epoxy System -- UV16
from Master Bond, Inc.

Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Features: Impregnating Resin; Non-corrosive; Thermal Insulation; Dissimilar Substrates
  • Chemical System: Epoxy
  • Type: High Dielectric; Optical
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
Low Outgassing Two Component Epoxy -- EP30-2
from Master Bond, Inc.

Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly at elevated temperatures with a 100/10 mix ratio by weight. This resin system is 100% reactive and does... [See More]

  • Features: Flexible; Non-corrosive; Thermal Insulation; Dissimilar Substrates
  • Chemical System: Epoxy
  • Type: High Dielectric; Optical
  • Cure / Technology: Thermoset; Two Component  
Low Stress, NASA Low Outgassing Silicone Adhesive -- MasterSil 920-LO
from Master Bond, Inc.

MasterSil 920-LO is an ideal material for the encapsulation of sensitive electronic and optical components, especially when low stress is a critical requirement. This neutral curing, non-corrosive, RTV silicone has very good flow properties and outstanding electrical insulation values, which enhance... [See More]

  • Features: Flexible; Non-corrosive; Thermal Insulation; Dissimilar Substrates
  • Chemical System: Silicone
  • Type: High Dielectric; Optical; NASA Low Outgassing
  • Composition: Unfilled
Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Features: Impregnating Resin; Non-corrosive; Solvent Based; Thermal Insulation; Dissimilar Substrates
  • Chemical System: Epoxy
  • Type: High Dielectric; Optical
  • Composition: Unfilled
Low Viscosity, Non-Yellowing Two Component Epoxy -- EP112LS
from Master Bond, Inc.

EP112LS is optically clear, features reliable non-yellowing properties and has a refractive index of 1.55. This electrically insulative system is resistant to chemicals including water, oils, fuels, acids and bases. Featuring a mixed viscosity of 50-200 cps, EP112LS is serviceable over the... [See More]

  • Features: Impregnating Resin; Non-corrosive; Thermal Insulation; Dissimilar Substrates
  • Chemical System: Epoxy
  • Type: High Dielectric; Optical
  • Composition: Unfilled
Low Viscosity, Two Component Epoxy -- EP30-1
from Master Bond, Inc.

Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This... [See More]

  • Features: Flexible; Non-corrosive; Thermal Insulation; Dissimilar Substrates
  • Chemical System: Epoxy
  • Type: High Dielectric; Optical
  • Cure / Technology: Thermoset; Two Component  
Low Viscosity, Two Component Epoxy with Low Exotherm -- EP21LVSP6
from Master Bond, Inc.

EP21LVSP6 is a two component system that is also well suited for potting and encapsulation applications. It offers a very convenient one to one mix ratio, by weight or volume and is formulated to cure at room temperature. It has a desirable combination of a long open time of 3-5 hours, low mixed... [See More]

  • Features: Impregnating Resin; Non-corrosive; Thermal Insulation; Dissimilar Substrates
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Unfilled
Nanosilica Filled, Optically Clear Epoxy Adhesive -- EP113
from Master Bond, Inc.

Formulated for potting, coating and sealing applications, EP113 is a two component, nanosilica filled epoxy. The nano particles enhance the dimensional stability and the already exceptionally low shrinkage upon curing. This low viscosity system bonds well to a wide variety of substrates including... [See More]

  • Features: Non-corrosive; Thermal Insulation; Dissimilar Substrates
  • Chemical System: Epoxy
  • Type: High Dielectric; Optical
  • Composition: Filled
NASA Low Outgassing Approved, One Component Epoxy -- EP17HT-LO
from Master Bond, Inc.

Passing ASTM E595 testing for NASA low outgassing, EP17HT-LO is widely used in a variety of applications in the aerospace, oil/chemical processing, optical, opto-electronic and specialty OEM industries. This single component, thermally stable system has a glass transition temperature of 225 °C. [See More]

  • Features: EMI/RFI Shielding; Non-corrosive; Thermal Insulation; Dissimilar Substrates
  • Composition: Unfilled
  • Type: High Dielectric; Optical; NASA Low Outgassing
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
One Component, UV Curable Adhesive System -- UV10
from Master Bond, Inc.

Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]

  • Features: Impregnating Resin; Non-corrosive; Thermal Insulation; Dissimilar Substrates
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Type: High Dielectric; Optical
  • Form / Shape: Liquid
Optically Clear, Low Viscosity, Two Component Epoxy -- EP30
from Master Bond, Inc.

Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]

  • Features: Flexible; Non-corrosive; Thermal Insulation; Dissimilar Substrates
  • Chemical System: Epoxy
  • Type: Optical
  • Cure / Technology: Thermoset; Two Component  
Two Component, Thermal Shock And Heat Resistant Epoxy System -- EP121
from Master Bond, Inc.

Master Bond Polymer System EP121 is a new superior and cost effective two component epoxy resin system for electrical potting and encapsulation which combines high physical strength properties, remarkable thermal shock and heat resistance, inertness to water and chemicals with good electrical... [See More]

  • Features: Non-corrosive; Thermal Insulation; Dissimilar Substrates
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Unfilled
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Features: Flexible; Flame Retardant; Thermal Insulation; UL Rating
  • Chemical System: Polyurethane
  • Type: High Dielectric
  • Composition: Filled
Optically Clear UV Adhesive -- ANA-97290
from Protavic America, Inc.

ANA-97290 is a clear Ultraviolet/ Visible light curing adhesive. It has very low shrinkage during cure for alignment sensitive parts. It is recommended for small electrical/electronic casting and encapsulating applications that require a unique combination of excellent wetting, flow, good thermal... [See More]

  • Features: Thermal Insulation
  • Composition: Unfilled
  • Type: Electrically Conductive
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured