Aerospace Conformal Coatings
from ELANTAS North America LLC
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Industry: Aerospace; Electronics; OEM or Industrial
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Filled
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Aerospace
- Chemical System: Epoxy
- Type: Thermally Conductive; High Dielectric; Airbus standards
- Composition: Unfilled
from RS Components, Ltd.
MG Silicone Conformal coating 340g [See More]
- Industry: Aerospace; Electronics; OEM or Industrial; Aerospace, Air Bag Controllers, Automobile, Aviation, Communication, Consumer Electronics Industries, Electric Generators, Industrial Control Equip
- Use Temperature: -40 to 392
- Chemical System: Silicone; Silicone
from Hernon Manufacturing, Inc.
Ultrabond ® 3443 is a single component, tri-cure conformal coating formulated for bonding glass to glass or glass to metals. Ultrabond ® 3443 is excellent for bonding and tacking many parts. Ultrabond ® 3443 can also be cured with heat above 200 °F (93 °C) or Activator 56 or... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
from MacDermid Alpha Electronics Solutions
A unique modified alkyd conformal coating formulated to meet the highest defense standards in Europe and the U.S. Product Overview. DCA SCC3 Conformal Coating is a unique, modified alkyd coating specifically formulated to meet the highest defence standards in both Europe and the United States. [See More]
- Industry: Aerospace; Automotive; Electronics
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial
- Chemical System: UV Curing
- Type: Thermally Conductive; High Dielectric; NASA Low Outgassing
- Composition: Filled
from RS Components, Ltd.
Konform silicone coating 400ml [See More]
- Industry: Aerospace; Aerospace, Data Communications, Instrumentation
- Form / Shape: Liquid
- Chemical System: Silicone; Silicone
- Use Temperature: -85 to 392
from Hernon Manufacturing, Inc.
Ultrabond ® 71813 is a single component, tri-cure conformal coating formulated for bonding glass to glass or glass to metals. Ultrabond ® 71813 is excellent for bonding and tacking many parts. Ultrabond ® 71813 can also be cured with heat above 200 °F (93 °C) or Activator 56... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial
- Chemical System: Silicone
- Type: Thermally Conductive; Electrically Conductive; NASA Low Outgassing
- Composition: Filled
from RS Components, Ltd.
MG prem acrylic conformal coating 419D [See More]
- Industry: Aerospace; Electronics; OEM or Industrial; Aerospace, Automobile, Aviation, Communication, Consumer Electronics Industry, Electrical, Electronic Components, Industrial, Instrumentation, Marine
- Use Temperature: -85 to 257
- Chemical System: Acrylic; Acrylic
from Hernon Manufacturing, Inc.
Ultrabond ® 773 is a single component, tri-cure conformal coating formulated for bonding glass to glass or glass to metals. Ultrabond ® 773 is excellent for bonding and tacking many parts. Ultrabond ® 773 can also be cured with heat above 200 °F (93 °C) or EF Primer 56. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Downhole
- Chemical System: Epoxy
- Type: Thermally Conductive; High Dielectric
- Composition: Unfilled
from Hernon Manufacturing, Inc.
Ultrabond ® 3444 is a single component, tri-cure conformal coating formulated for bonding glass to glass or glass to metals. Ultrabond ® 3444 is excellent for bonding and tacking many parts. Ultrabond ® 3444 can also be cured with heat above 200 °F (93 °C) or Activator 56. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial
- Chemical System: Epoxy
- Type: High Dielectric; NASA Low Outgassing
- Composition: Unfilled
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial
- Chemical System: Epoxy
- Type: Thermally Conductive; High Dielectric; Airbus Standards
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The recommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial
- Form / Shape: Liquid
- Cure / Technology: Thermoset; Two Component
- Use Temperature: -60 to 400
from Master Bond, Inc.
Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Industry: Aerospace; Electronics; Electric Power; OEM or Industrial
- Chemical System: Epoxy
- Type: High Dielectric; Electrically Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial
- Chemical System: Epoxy
- Type: High Dielectric; Optical
- Composition: Unfilled
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial
- Chemical System: Epoxy
- Type: Thermally Conductive; High Dielectric; Optical; NASA Low Outgassing
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial
- Chemical System: Epoxy
- Type: Thermally Conductive; High Dielectric; Optical; NASA Low Outgassing
- Composition: Filled
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial
- Chemical System: Epoxy
- Type: Thermally Conductive; High Dielectric; NASA low outgassing
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
- Chemical System: Epoxy
- Type: Thermally Conductive; Electrically Conductive
- Composition: Filled
from Master Bond, Inc.
Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial
- Chemical System: UV curable
- Type: Thermally Conductive; High Dielectric; Optical
- Composition: Unfilled
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Type: High Dielectric; Optical
- Form / Shape: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
- Chemical System: Epoxy
- Type: Optical
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is a user friendly compound that has a non-critical ten to one mix ratio by weight. This system cures readily... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial
- Chemical System: Epoxy
- Type: Thermally Conductive; High Dielectric; Optical; NASA Low Outgassing
- Composition: Unfilled
from Master Bond, Inc.
Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU •in/ft2 •hr • °F [2.60-2.88 W/(m •K)] and can be applied in sections as... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial
- Chemical System: Epoxy
- Type: Thermally Conductive; High Dielectric; NASA Low Outgassing
- Composition: Filled
from Master Bond, Inc.
EP41S-5 is chemically resistant and withstands acids, bases, alcohols, fuels and many solvents. This two part epoxy is widely used for bonding, sealing, coating, and encapsulating. It provides high physical strength properties and electrical insulation values. EP41S-5 offers convenient handling with... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial
- Chemical System: Epoxy
- Type: Thermally Conductive; High Dielectric; NASA Low Outgassing
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient of thermal expansion. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial
- Chemical System: Epoxy
- Type: Thermally Conductive; High Dielectric; NASA Low Outgassing
- Composition: Unfilled
from Master Bond, Inc.
Two component EP46HT-2AO Black is ideal for demanding bonding, sealing and encapsulation applications where thermal conductivity, electrical insulation and high temperature resistance are required. It has a service temperature range of -100 °F to +500 °F with a glass transition temperature... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial
- Chemical System: Epoxy
- Type: Thermally Conductive; High Dielectric; MIL-STD-810G, NASA Low Outgassing
- Composition: Unfilled