Epoxy (EP) Conformal Coatings
from ELANTAS North America LLC
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Chemical System: Epoxy
- Composition: Filled
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
Henkel Loctite EC 210 Black is a two component, formerly Emerson and Cuming ECCOCOAT, oxide filled, epoxy adhesive liquid that is used for coating electrical components, plastics, metal, brick, concrete, and wood. It offers outstanding resistance to moisture, chemical attack, and weathering. It can... [See More]
- Chemical System: Epoxy
- Dielectric Strength: 420
- Cure / Technology: Two Component
- Viscosity: 1000 to 45000
from RS Components, Ltd.
Nickel Epoxy Conductive Coating Parts AB [See More]
- Chemical System: Epoxy; Epoxy
- Use Temperature: -40 to 302
- Industry: Conformal Coating
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: Thermally Conductive; High Dielectric; Airbus standards
- Cure / Technology: Thermoset; Single Component
from Ellsworth Adhesives
Henkel Loctite EC 210 Clear is a two component, formerly Emerson and Cuming ECCOCOAT, is a two component, oxide filled, epoxy adhesive liquid that is used for coating electrical components, plastics, metal, brick, concrete, and wood. It offers outstanding resistance to moisture, chemical attack, and... [See More]
- Chemical System: Epoxy
- Dielectric Strength: 420
- Cure / Technology: Two Component
- Viscosity: 5 to 1000
from RS Components, Ltd.
MG Chemicals thinner 2 4352 - 1L [See More]
- Chemical System: Acrylic; Epoxy; Acrylic, Alkyd, Cellulose Acetate Butyrate, Epoxy, Nitrocellulose, Polyester Resin
- Industry: Electronics; Electronics
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: Thermally Conductive; High Dielectric
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
HumiSeal ® 2A53A Epoxy Conformal Coating is a two component epoxy system that is used for circuit boards and applications that require resistance to chemicals or solvents. It fluoresces under UV light to aid inspection and can be applied by spraying, brushing, or dipping methods. Part A only, 1... [See More]
- Chemical System: Epoxy
- Viscosity: 150 to 350
- Cure / Technology: Two Component
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: High Dielectric; NASA Low Outgassing
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
HumiSeal ® 2A53A Epoxy Conformal Coating is a two component epoxy system that is used for circuit boards and applications that require resistance to chemicals or solvents. It fluoresces under UV light to aid inspection and can be applied by spraying, brushing, or dipping methods. Part A only,... [See More]
- Chemical System: Epoxy
- Viscosity: 150 to 350
- Cure / Technology: Two Component
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: Thermally Conductive; High Dielectric; Airbus Standards
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
HumiSeal ® 2A53A Epoxy Conformal Coating is a two component epoxy system that is used for circuit boards and applications that require resistance to chemicals or solvents. It fluoresces under UV light to aid inspection and can be applied by spraying, brushing, or dipping methods. Part A only, 5... [See More]
- Chemical System: Epoxy
- Viscosity: 150 to 350
- Cure / Technology: Two Component
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: Thermally Conductive; High Dielectric; ISO 10993-5
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
HumiSeal ® 2A53B Epoxy Conformal Coating is a two component epoxy system that is used for circuit boards and applications that require resistance to chemicals or solvents. It fluoresces under UV light to aid inspection and can be applied by spraying, brushing, or dipping methods. Part B, 1 L... [See More]
- Chemical System: Epoxy
- Viscosity: 150 to 350
- Cure / Technology: Two Component
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial
from Ellsworth Adhesives
HumiSeal ® 2A53B Epoxy Conformal Coating is a two component epoxy system that is used for circuit boards and applications that require resistance to chemicals or solvents. It fluoresces under UV light to aid inspection and can be applied by spraying, brushing, or dipping methods. Part B only, 5... [See More]
- Chemical System: Epoxy
- Viscosity: 150 to 350
- Cure / Technology: Two Component
from Master Bond, Inc.
Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial
from Ellsworth Adhesives
ResinLab EP965SC7 Clear is a two component, room temperature or heat curing, unfilled epoxy encapsulant that is used for medium castings, bonding with most materials, and filling voids. It is electronic grade, semi-rigid, free flowing, and has good air release and wetting properties. It is resistant... [See More]
- Chemical System: Epoxy
- Thermal Conductivity: 0.1400
- Cure / Technology: Two Component
- Tensile (Break): 7500
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: High Dielectric; Electrically Conductive
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: High Dielectric; Optical
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: Thermally Conductive; High Dielectric; Optical; NASA Low Outgassing
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Chemical System: Epoxy
- Composition: Filled
- Type: Thermally Conductive; High Dielectric; Optical; NASA Low Outgassing
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Shenzhen DeepMaterial Technologies Co., Ltd
Fast curing at low temperature, used for the assembly of CCD or CMOS components and VCM motors. This product is specifically designed for heat-sensitive applications that require low-temperature curing. It can quickly provide customers with high-throughput applications, such as attaching light... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Heat Curing
- Viscosity: 7000 to 27000
from ACCRAbond, Inc.
INSTAbond ® M810 -- a two-part epoxy compound that is used in potting, casting, encapsulation, adhesive and coatings applications. Key benefits include excellent adhesion, good water resistance, good toughness and flexibility. Certified to Mil-A-81236 Type 1 & Type 2. [See More]
- Chemical System: Epoxy
from Protavic America, Inc.
Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: High Dielectric
- Cure / Technology: Thermoset; Option of one or two component
from Aremco Products, Inc.
Aremco offers an impressive selection of high performance epoxies for specialty bonding and potting applications to 600 °F. These products can be applied to a myriad of substrates, offering exceptional chemical, electrical and mechanical properties. [See More]
- Chemical System: Epoxy
- Features: Dissimilar Substrates
- Form / Shape: Liquid
- Industry: Electronics
from Electro-Lite Corporation
ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: UV or Radiation Cured
- Features: Anti-static, ESD
from Shenzhen DeepMaterial Technologies Co., Ltd
It is a two-component epoxy structural adhesive. At room temperature (25°C), the operating time is 6 minutes, the curing time is 5 minutes, and the curing is complete in 12 hours. After being fully cured, it has the characteristics of high shear, high peeling, and good impact resistance. It is... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Two Component
- Use Temperature: -40 to 302
from Protavic America, Inc.
PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]
- Chemical System: Epoxy
- Composition: Filled
- Type: Thermally Conductive; High Dielectric
- Cure / Technology: Thermoset; Two Component