Room Temp. Cure / Vulcanizing Conformal Coatings
from ELANTAS North America LLC
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Filled
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type: High Dielectric; NASA Low Outgassing
- Composition: Unfilled
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type: Thermally Conductive; High Dielectric; Airbus Standards
- Composition: Unfilled
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type: Thermally Conductive; High Dielectric; ISO 10993-5
- Composition: Unfilled
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type: Thermally Conductive; High Dielectric; Optical; NASA Low Outgassing
- Composition: Unfilled
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type: Thermally Conductive; High Dielectric; Optical; NASA Low Outgassing
- Composition: Filled
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type: Thermally Conductive; High Dielectric; NASA low outgassing
- Composition: Unfilled
from Master Bond, Inc.
Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is a user friendly compound that has a non-critical ten to one mix ratio by weight. This system cures readily... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type: Thermally Conductive; High Dielectric; Optical; NASA Low Outgassing
- Composition: Unfilled
from Master Bond, Inc.
Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU •in/ft2 •hr • °F [2.60-2.88 W/(m •K)] and can be applied in sections as... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type: Thermally Conductive; High Dielectric; NASA Low Outgassing
- Composition: Filled
from Henkel Corporation - Electronics
(Known as Hysol PC18M ). LOCTITE STYCAST PC 18M is a flexible solvent-based, one-component coating. Provides good thermal shock resistance. [See More]
- Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing
- Industry: Electronics; Military
- Chemical System: Polyurethane
- Use Temperature: -40 to 230
from Wacker Chemical Corp.
SEMICOSIL ® 964 is a RTV-1 amine cure system that cures on contact with moisture in the air to a translucent coating. Special features. Solvent-free. Sprayable. CO2 accelerable. Excellent adhesion to most substrates. Flame retardant, UL 94V-0. Formulated and tested to meet IPC CC-830 B. [See More]
- Cure / Technology: Thermoset; Room Temperature Vulcanizing or Curing
- Chemical System: Silicone; Elastomeric
- Type: High Dielectric
- Form / Shape: Liquid
from Novagard Solutions
Non-corrosive, single component silicone coating [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured (optional feature); Single Component; Room Temperature Vulcanizing or Curing
- Chemical System: Silicone; Elastomeric
- Type: High Dielectric
- Composition: Unfilled
from Bluestar Silicones USA Corp.
Potting, encapsulant elastomer. Properties. Viscosity 3500. Hardness Sha 48. Description. a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL ™ ESA 7252 QC A & B is supplied as a viscous liquid which... [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Type: High Dielectric
- Form / Shape: Liquid