Thermosetting / Crosslinking Conformal Coatings

ELAN-Tron® -- E 4141 White Resin / C 4141 Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Filled
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Type: Thermally Conductive; High Dielectric; Airbus standards
  • Composition: Unfilled
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Addition Cure
  • Chemical System: Silicone
  • Type: Thermally Conductive; Electrically Conductive; NASA Low Outgassing
  • Composition: Filled
Epoxy Features Exceptional Chemical and Heat Resistance -- EP35SP
from Master Bond, Inc.

EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type: Thermally Conductive; High Dielectric
  • Composition: Unfilled
Epoxy Features Very Low Coefficient of Thermal Expansion -- EP30LTE-2
from Master Bond, Inc.

Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Type: High Dielectric; NASA Low Outgassing
  • Composition: Unfilled
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Type: Thermally Conductive; High Dielectric; Airbus Standards
  • Composition: Unfilled
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med
from Master Bond, Inc.

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Type: Thermally Conductive; High Dielectric; ISO 10993-5
  • Composition: Unfilled
Fast Curing, Optically Clear, Two Part Epoxy -- EP39-2
from Master Bond, Inc.

Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial
High Glass Transition Temperature Epoxy System -- EP62-1
from Master Bond, Inc.

Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The reccommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial
  • Form / Shape: Liquid
  • Use Temperature: -60 to 400
High Temperature Resistant Epoxy Compound -- EP45HT
from Master Bond, Inc.

Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial
High Temperature Resistant, One Component Epoxy System -- EP13
from Master Bond, Inc.

Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Unfilled
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP
from Master Bond, Inc.

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type: High Dielectric; Electrically Conductive
  • Composition: Unfilled
Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type: High Dielectric; Optical
  • Composition: Unfilled
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2
from Master Bond, Inc.

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Type: Thermally Conductive; High Dielectric; Optical; NASA Low Outgassing
  • Composition: Unfilled
Low Viscosity, Fast Curing, Two Component Epoxy -- EP38
from Master Bond, Inc.

Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Unfilled
Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance -- EP30NS
from Master Bond, Inc.

Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Type: Thermally Conductive; High Dielectric; Optical; NASA Low Outgassing
  • Composition: Filled
NASA Low Outgassing Rated Epoxy Features Enhanced Chemical Resistance -- EP42-2LV Black
from Master Bond, Inc.

EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Type: Thermally Conductive; High Dielectric; NASA low outgassing
  • Composition: Unfilled
New Epoxy Offers Rapid Cures and Chemical Resistance -- EP41S-F
from Master Bond, Inc.

Offering impressive physical strength characteristics, EP41S-F is an electrically insulative two component epoxy that cures rapidly at ambient and elevated temperatures. Typically faster curing epoxies are somewhat less chemically resistant than other types of systems, but EP41S-F is one of the few... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Type: Thermally Conductive; High Dielectric
  • Composition: Unfilled
Nickel Filled Electrically Conductive Epoxy System -- EP76M
from Master Bond, Inc.

Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type: Thermally Conductive; Electrically Conductive
  • Composition: Filled
One Component, Higher Viscosity Uv Curable System For Bonding, Sealing And Coating -- UV10TK40M
from Master Bond, Inc.

Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]

  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; UV curing system
  • Chemical System: UV curable
  • Type: Thermally Conductive; High Dielectric; Optical
  • Composition: Unfilled
One Component, Storage Stable Epoxy -- EP19HT
from Master Bond, Inc.

Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Unfilled
One Component, UV Curable Adhesive System -- UV10
from Master Bond, Inc.

Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]

  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Form / Shape: Liquid
  • Type: High Dielectric; Optical
  • Features: Impregnating Resin; Non-corrosive; Thermal Insulation; Dissimilar Substrates
Optically Clear, Low Viscosity, Two Component Epoxy -- EP30
from Master Bond, Inc.

Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Type: Optical
  • Form / Shape: Liquid
Silicone Conformal Coating -- SEMICOSIL® 936 UV
from Wacker Chemical Corp.

SEMICOSIL ® 936 UV is an RTV-1 amine cure system that cures on contact with moisture in the air and/or through exposure to high energy ultraviolet light. Special features. Rapid UV acceleration. Shadow cure. solvent free. Application. SEMICOSIL ® 936 UV is intended as a protective coating... [See More]

  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Chemical System: Silicone; Elastomeric
  • Type: High Dielectric
  • Form / Shape: Liquid
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Silicone
  • Type: Thermally Conductive; Electrically Conductive
  • Composition: Unfilled
Heat Cure Silicone -- Bluesil™ V-204 A/B
from Bluestar Silicones USA Corp.

A White, Two-Component, Electronic protevtive coating, Heat Cure Silicone. Properties. Viscosity 35000. Hardness Sha 42. Description. Bluesil V-204 is a white, two component, addition cure, heat curing silicone compound. It is designed as a protective coating for light sensitive electronic circuits... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Shape: Liquid
  • Chemical System: Silicone
  • Industry: Electronics
Aremco-Seal™ -- 529
from Aremco Products, Inc.

Exceptional electrical, moisture & chemical resistance [See More]

  • Cure / Technology: Thermoset
  • Chemical System: Silicone
  • Type: High Dielectric
  • Composition: Filled
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Polyurethane
  • Type: High Dielectric
  • Composition: Filled
Epoxy Adhesive -- ANE-26144
from Protavic America, Inc.

Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]

  • Cure / Technology: Thermoset; Option of one or two component
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Unfilled
Optically Clear UV Adhesive -- ANA-97290
from Protavic America, Inc.

ANA-97290 is a clear Ultraviolet/ Visible light curing adhesive. It has very low shrinkage during cure for alignment sensitive parts. It is recommended for small electrical/electronic casting and encapsulating applications that require a unique combination of excellent wetting, flow, good thermal... [See More]

  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
  • Composition: Unfilled
  • Type: Electrically Conductive
  • Form / Shape: Gel (optional feature); Liquid
Polyurethane Adhesive -- PNU-56200
from Protavic America, Inc.

PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Polyurethane
  • Type: High Dielectric
  • Composition: Unfilled