UL Approved Silicone Adhesives and Sealants
from CHT USA Inc.
CHT ’s AS1803 is a white, non-corrosive, neutral cure 1-part RTV silicone adhesive sealant. This product will not corrode copper or its alloys and is designed for use with electronic components. It is part of CHT's range of Acetone cure products which are all solvent free. It features a fast... [See More]
- Features: Flame Retardant; UL Rating
- Cure / Technology: Single Component; Acetone
- Compound Type: Adhesive
- Industry: Automotive; Electronics
from Master Bond, Inc.
Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9 BTU... [See More]
- Features: High Dielectric; Flame Retardant; Non-corrosive; UL Rating
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from CHT USA Inc.
CHT's AS1707 is a 1-part, alkoxy cured, thermally conductive, low volatile, RTV silicone adhesive paste. AS1707 is formulated to meet the requirements for use as a space grade adhesive. AS1707 has low thermal outgassing properties and a wide operational temperature range. In addition to meeting... [See More]
- Features: Flame Retardant; UL Rating
- Cure / Technology: Single Component; Alkoxy
- Compound Type: Thermally Conductive; Adhesive
- Industry: Automotive; Electronics
from Shiu Li Technology Co., Ltd
LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Features: UL Rating
- Industry: Electronics
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.1969
from Protavic America, Inc.
PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]
- Features: Flexible; Electrically Conductive; Flame Retardant; UL Rating
- Type / Form: Gel
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Metal
from Henkel Corporation - Industrial
2-part, fast, high strength, neutral cure alkoxy silicone paste adhesive suitable for structural bracket and clip bonding. LOCTITE ® SI 5604 is a black, gray or almond-colored, 2-part, fast, high strength, neutral cure alkoxy silicone paste adhesive designed for bonding applications. It... [See More]
- Features: UL Rating
- Cure / Technology: Two Component
- Compound Type: Adhesive
- Use Temperature: 40 to 450
from Novagard Solutions
Non-corrosive, single component oxime silicon sealant and/or adhesive [See More]
- Features: High Dielectric; Non-corrosive; UL Rating
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Wood; Dissimilar Substrates
- Compound Type: Sealant; Adhesive
- Composition: Unfilled
from Shiu Li Technology Co., Ltd
LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Features: UL Rating
- Industry: Electronics
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.1969
from Protavic America, Inc.
PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]
- Features: Flexible; High Dielectric; Flame Retardant; UL Rating
- Type / Form: Gel
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
from Shiu Li Technology Co., Ltd
LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]
- Features: UL Rating
- Industry: Electronics
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.1969
from Shiu Li Technology Co., Ltd
LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]
- Features: UL Rating
- Industry: Electronics
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.1969
from Shiu Li Technology Co., Ltd
LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]
- Features: UL Rating
- Industry: Electronics
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.1969
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Features: High Dielectric; Laminaes; UL Rating
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.3937
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Features: High Dielectric; Laminaes; UL Rating
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.3937
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Features: High Dielectric; Laminaes; UL Rating
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0098 to 0.0177