Two Component System Silicone Adhesives and Sealants
from CHT USA Inc.
CHT ’s TufGel 336 is a 2-part, tough, black silicone gel designed for electronic potting applications to provide protection from moisture, vibration and thermal or mechanical shock. TufGel 336 can also function as a contrast enhancement material in LED applications. TufGel 336 is also flame... [See More]
- Cure / Technology: Two Component ; Addition
- Features: Flame Retardant
- Type / Form: Gel
- Industry: Automotive; Electronics; OEM or Industrial
from Ellsworth Adhesives
Dow 3-4237 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for potting, sealing, encapsulating, and protecting electrical components from contaminants, moisture, and stress. It is durable, flexible, self healing, and offers long working times. [See More]
- Cure / Technology: Two Component
- Features: High Dielectric
- Compound Type: Encapsulant, Potting Compound; Sealant
- Industry: Electronics
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from MacDermid Alpha Electronics Solutions
A thixotropic two-part silicone potting compound specifically crafted to safeguard LED drivers and a range of other components. Product Overview. SC4003 is a thixotropic two-part silicone potting and encapsulating resin designed for the Indian market. Primarily developed for the protection of LED... [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Industry: Electronics; Semiconductors, IC's
- Compound Type: Encapsulant, Potting Compound
from Dexmet® Corporation, a part of PPG’s engineered materials division
Cuming Microwave currently offers a limited line of adhesives for bonding applications. The product line includes an epoxy and a silicone-based system. Pressure sensitive adhesives are available as options with our elastomeric and foam absorbers. For other adhesive recommendations, please contact... [See More]
- Cure / Technology: Two Component
- Compound Type: Adhesive
from Ellsworth Adhesives
Dow 96-083 Silicone Adhesive Clear is a two component, heat curing adhesive that is used for repairs and bonding a variety of materials such as glass, metals, plastics, and ceramics. It offers high tensile strength, flowability, low viscosity, self-leveling, and contains no added solvents. 10:1 mix... [See More]
- Cure / Technology: Two Component
- Substrate Compatibility: Ceramic, Glass; Plastic
- Compound Type: Adhesive
- Viscosity: 275 to 10600
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Cure / Technology: Thermoset; Two Component ; Addition Cure
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Composition: Filled
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4150 Dielectric Gel Clear-Green is a two component, fast room temperature curing, silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers flexibility, stress relief, and offers excellent... [See More]
- Cure / Technology: Two Component
- Features: High Dielectric
- Compound Type: Encapsulant, Potting Compound; Sealant
- Viscosity: 480
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4155 HV Dielectric Gel Clear-Green is a two component, high viscosity, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It cures quickly at room temperature, offers flexibility, thermal stability,... [See More]
- Cure / Technology: Two Component
- Features: High Dielectric
- Compound Type: Encapsulant, Potting Compound
- Industry: Electric Power
from Master Bond, Inc.
Master Bond MasterSil 323 is a two component, addition cured system for bonding, sealing and potting applications. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Features: Flexible; High Dielectric; Non-corrosive
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4207 Dielectric Tough Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has good... [See More]
- Cure / Technology: Two Component
- Features: High Dielectric
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 425
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4207 Dielectric Tough Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has good... [See More]
- Cure / Technology: Two Component
- Features: High Dielectric
- Compound Type: Encapsulant, Potting Compound
- Industry: Electronics
from Master Bond, Inc.
MasterSil 972TC-LO is capable of transferring heat with a thermal conductivity of 7-9 BTU •in/ft ² •hr • °F [1.01-1.30 W/(m •K)], while retaining superior dielectric properties. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics... [See More]
- Cure / Technology: Thermoset; Two Component
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4207 Dielectric Tough Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has good... [See More]
- Cure / Technology: Two Component
- Features: High Dielectric
- Compound Type: Encapsulant, Potting Compound
- Industry: Electronics
from Master Bond, Inc.
Low viscosity MasterSil 152 is a two component, optically clear silicone system that cures when exposed to air at room temperature. It has outstanding electrical insulation properties, making it ideal for potting and encapsulation applications. Additionally it features a long working life and has a... [See More]
- Cure / Technology: Thermoset; Two Component ; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has excellent... [See More]
- Cure / Technology: Two Component
- Features: High Dielectric
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 325
from Master Bond, Inc.
Master Bond MasterSil 153AO is an addition cured two part silicone with a high tensile lap shear strength, thermal conductivity and electrical insulation. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Compound Type: Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has excellent... [See More]
- Cure / Technology: Two Component
- Features: High Dielectric
- Compound Type: Encapsulant, Potting Compound
- Industry: Electronics
from Master Bond, Inc.
Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9 BTU... [See More]
- Cure / Technology: Thermoset; Two Component
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has excellent... [See More]
- Cure / Technology: Two Component
- Features: High Dielectric
- Compound Type: Encapsulant, Potting Compound
- Industry: Electronics
from Master Bond, Inc.
MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the aerospace, electronic,... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Sealant; Thermally Conductive; Adhesive
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4241 Dielectric Tough Gel Clear-Green is a two component, heat curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, flame resistant, long working... [See More]
- Cure / Technology: Two Component
- Features: High Dielectric
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 400
from Master Bond, Inc.
Master Bond MasterSil 153Med is a two component, paste silicone compound for high performance bonding and sealing. This is an addition cured system and does not require exposure to air for complete cross-linking. With a convenient one to one mix ratio by weight, it will not outgas while curing. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cured
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Sealant; Adhesive
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4241 Dielectric Tough Gel Clear-Green is a two component, heat curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, flame resistant, long working... [See More]
- Cure / Technology: Two Component
- Features: High Dielectric
- Compound Type: Encapsulant, Potting Compound
- Industry: Electronics
from Master Bond, Inc.
Mastersil 323Med is a two part, addition cured silicone that passes ISO 10933-5 for cytotoxicity used in medical device manufacturing. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Sealant; Adhesive
- Features: High Dielectric; Non-corrosive
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4680 Silicone Gel Clear-Blue is a two component, room temperature curing, low viscosity, dielectric gel that is used for potting, sealing, encapsulating, and protecting electrical components from contaminants, moisture, and stress. It is durable, flexible, and fast curing. 1:1... [See More]
- Cure / Technology: Two Component
- Viscosity: 275
- Compound Type: Encapsulant, Potting Compound; Sealant
- Dielectric Strength: 406
from Ellsworth Adhesives
Dow DOWSIL ™ 3-6121 Low Temperature Elastomer Clear is a two component, room to high temperature curing, silicone encapsulant that is used to protect electrical components from contaminants, moisture, and stress. It is fast curing, flowable, tear resistant, and has high tensile strength. 10:1... [See More]
- Cure / Technology: Two Component
- Viscosity: 19250
- Compound Type: Encapsulant, Potting Compound; Sealant
- Thermal Conductivity: 0.1900
from Ellsworth Adhesives
Dow DOWSIL ™ 90-006-2 RF Aerospace Sealant is a two component, room temperature curing, silicone elastomer that is used for bonding to primed surfaces such as glass, metals, polyester, epoxies, cured silicone rubber, and silicone resin laminates. It offers short working times, high viscosity... [See More]
- Cure / Technology: Two Component
- Viscosity: 1.20E6
- Compound Type: Sealant; Adhesive
- Tensile (Break): 600
from Ellsworth Adhesives
Dow DOWSIL ™ 93-500 Thixotropic Space Grade Encapsulant and 93-500 Space Grade Encapsulant Clear are two component, silicone elastomers that are used for aerospace applications such as sealing optical sensors, encapsulating/potting electronic components, and bonding solar cells to substrates,... [See More]
- Cure / Technology: Two Component
- Thermal Conductivity: 0.2000
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Tensile (Break): 1225
from Ellsworth Adhesives
Dow DOWSIL ™ CY 52-276 Kit Clear is a two component, low volatility silicone gel that is used for protecting and sealing electronic devices from thermal shock, vibration, fuels, and solvents. with addition cure, It offers flexibility and a low temperature cure. 1:1 mix ratio. Part A, 1 kg... [See More]
- Cure / Technology: Two Component
- Viscosity: 900 to 1200
- Compound Type: Encapsulant, Potting Compound; Sealant
- Dielectric Strength: 356
from Ellsworth Adhesives
Dow DOWSIL ™ CY 52-276 Kit Clear is a two component, low volatility silicone gel that is used for protecting and sealing electronic devices from thermal shock, vibration, fuels, and solvents. with addition cure, It offers flexibility and a low temperature cure. 1:1 mix ratio. Part B, 1 kg... [See More]
- Cure / Technology: Two Component
- Viscosity: 900
- Compound Type: Encapsulant, Potting Compound; Sealant
- Dielectric Strength: 356
from Henkel Corporation - Industrial
LOCTITE STYCAST 4640, Silicone, Flexible, Potting or Encapsulant LOCTITE ® STYCAST 4640 RTV condensation cure silicone rubber syntactic foam is engineered to yield a flexible, low density material with a low dielectric constant and dissipation factor. It is designed for airborne potting, sealing... [See More]
- Cure / Technology: Two Component
- Type / Form: Liquid
- Compound Type: Caulk, Grout
- Viscosity: 45000
from Epoxies Etc...
50-1225 is a low viscosity, room temperature curing, RTV silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
- Composition: Unfilled
from Bluestar Silicones USA Corp.
Two-Component, Flowable Silicone Aerospace Sealant. Properties. Viscosity 190000. Hardness Sha 58. Description. Bluesil V-695 is a black, two component addition cure, flowable silicone aerospace sealant. It is specifically designed for, and qualified to, General Electric Aircraft Engine... [See More]
- Cure / Technology: Two Component
- Substrate Compatibility: Metal; Plastic
- Compound Type: Sealant
- Industry: Aerospace
from Hapco, Inc.
Hapsil 360 ™ is a high tear strength, tin-catalyzed RTV-2 silicone rubber, which was designed for casting Hapco's wide variety of rigid and flexible polyurethane resins. Hapsil 360 ™ is not sensitive to inhibition, meaning it will cure at room temperature over virtually any surface. [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Compound Type: Sealant; Adhesive
- Composition: Unfilled
from Wacker Chemical Corp.
GENIOSIL® WP1 is a polyether-based silane-terminated polymer suitable asbinder in moisture curing formulations. It is a clear liquid with a slight but characteristic odor and differs to conventional silylated polymers due to its high reactivity. This is a direct consequence of the structural... [See More]
- Cure / Technology: Two Component
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Sealant
- Industry: Construction
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Cure / Technology: Thermoset; Two Component
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
from Henkel Corporation - Industrial
LOCTITE STYCAST 5952-1, Silicone, Potting or Encapsulant. LOCTITE ® STYCAST 5952-1 is designed for encapsulation of heat generating devices. It is also recommended for applications requiring a non-corrosive casting and coating. Electrically non-conductive. Good elongation strength. Moderate tear... [See More]
- Cure / Technology: Two Component
- Features: High Dielectric
- Compound Type: Thermally Conductive
- Viscosity: 60000
from Epoxies Etc...
20-1615 is a two component, room temperature curing silicone rubber compound. This silicone system is clear, odorless, and low in viscosity. 20-1615 is an excellent choice for potting electronic assemblies that require shock and vibration resistance. It also protects assemblies from moisture, ozone,... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound
- Composition: Unfilled
from Wacker Chemical Corp.
GENIOSIL® XT 55 is a silicon reinforced polyetherbasedsilane-terminated polymer suitable as a binderin moisture curing formulations. It is a clear liquid witha slight but characteristic odor and differs toconventional silylated polymers due to its highreactivity. This is a direct consequence of... [See More]
- Cure / Technology: Two Component ; Reactive or Moisture Cured
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound
- Industry: Construction
from Protavic America, Inc.
PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]
- Cure / Technology: Thermoset; Two Component
- Type / Form: Gel
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
from Henkel Corporation - Industrial
LOCTITE STYCAST S 5225, Silicone, Potting, Encapsulating. LOCTITE ® STYCAST S 5225 liquid encapsulant is designed for use on small electronic devices requiring a low viscosity material capable of flowing throughout tightly packed components. LOCTITE STYCAST S 5225 features primerless adhesion... [See More]
- Cure / Technology: Two Component
- Viscosity: 2230
from Wacker Chemical Corp.
WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound
- Features: Flexible; Flame Retardant
from Henkel Corporation - Industrial
2-part, fast, high strength, neutral cure alkoxy silicone paste adhesive suitable for structural bracket and clip bonding. LOCTITE ® SI 5604 is a black, gray or almond-colored, 2-part, fast, high strength, neutral cure alkoxy silicone paste adhesive designed for bonding applications. It... [See More]
- Cure / Technology: Two Component
- Features: UL Rating
- Compound Type: Adhesive
- Use Temperature: 40 to 450
from Henkel Corporation - Industrial
Neutral curing alkoxy silicone adhesive paste with quick cure speed. Typical applications include bonding and sealing in the appliance market. LOCTITE ® SI 5606 is a gray, 2-part, thixotropic, neutral curing alkoxy silicone adhesive paste with quick cure speed. Typical applications include... [See More]
- Cure / Technology: Two Component
- Use Temperature: 250 to 350
- Compound Type: Adhesive
from Henkel Corporation - Industrial
2-part, thixotropic, neutral curing alkoxy silicone with medium cure speed at room temperature. LOCTITE ® SI 5607 is a gray 2-part, thixotropic, neutral curing alkoxy silicone with medium cure speed at room temperature. Typical applications include bonding and sealing in the appliance market... [See More]
- Cure / Technology: Two Component
- Viscosity: 275
- Compound Type: Adhesive
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 59C CAT 59, Silicone, Assembly LOCTITE ® ABLESTIK 59C CAT 59 adhesive is designed for applications requiring very high temperature exposures. This adhesive can withstand continuous exposure at temperatures as high as 150 to 260 ºC. It can be used in its cured or uncured... [See More]
- Cure / Technology: Two Component ; Contact or Pressure Sensitive Adhesives
- Use Temperature: 67 to 500
- Compound Type: Adhesive
from Henkel Corporation - Industrial
LOCTITE ® 5613 Silicone, Black is designed for superior fluid resistance and fast room temperature cure. Pneumatic dispensing recommended, non-corrosive and low odor. Tack-free in 10 minutes. Black in color. [See More]
- Cure / Technology: Two Component
- Compound Type: Sealant