Laminating / Composites Silicone Adhesives and Sealants
from Master Bond, Inc.
Master Bond MasterSil 153Med is a two component, paste silicone compound for high performance bonding and sealing. This is an addition cured system and does not require exposure to air for complete cross-linking. With a convenient one to one mix ratio by weight, it will not outgas while curing. [See More]
- Features: Flexible; High Dielectric; Laminaes; Non-corrosive; Thermal Insulation
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Sealant; Adhesive
- Composition: Unfilled
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Features: High Dielectric; Laminaes; UL Rating
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.3937
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Features: High Dielectric; Laminaes; UL Rating
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.3937
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Features: High Dielectric; Laminaes; UL Rating
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0098 to 0.0177