Tooling / Mold Material Silicone Adhesives and Sealants
from Ellsworth Adhesives
Dow SILASTIC ™ RTV-3110 Base is easily mixed and poured, cures at room temperature, gives accurate reproduction of masters for mold making with primer, provides wide service temperature ranges and absorbs mechanical shock and vibration. Base only. 18.1 kg Pail. [See More]
- Industry: Tooling
- Cure / Technology: Two Component
- Compound Type: Sealant
- Viscosity: 13000
from Master Bond, Inc.
Passing both USP Class VI testing and ISO cytotoxicity specifications, MasterSil 910Med is formulated for bonding, sealing, coating in medical device applications. As an acetoxy type system, it bonds exceptionally well to a wide variety of substrates including metals, composites, ceramics, glass as... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Composition: Unfilled
from Ellsworth Adhesives
Dow SILASTIC ™ RTV-3110 Base is easily mixed and poured, cures at room temperature, gives accurate reproduction of masters for mold making with primer, provides wide service temperature ranges and absorbs mechanical shock and vibration. Base only. 4 kg Pail. [See More]
- Industry: Tooling
- Cure / Technology: Two Component
- Compound Type: Sealant
- Viscosity: 13000
from Master Bond, Inc.
MasterSil 930 is an acetoxy type fluorosilicone for bonding, sealing and coating. Its most prominent feature is excellent chemical resistance, particularly to fuels, oils and solvents when compared to more standard silicones. Some of the chemicals that this product can withstand better than... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Sealant; Adhesive
- Composition: Unfilled
from Ellsworth Adhesives
Dow SILASTIC ™ RTV-3110 Base is easily mixed and poured, cures at room temperature, gives accurate reproduction of masters for mold making with primer, provides wide service temperature ranges and absorbs mechanical shock and vibration. Base only. 453 g Jar. [See More]
- Industry: Tooling
- Cure / Technology: Two Component
- Compound Type: Sealant
- Viscosity: 13000
from Master Bond, Inc.
MasterSil 920-LO is an ideal material for the encapsulation of sensitive electronic and optical components, especially when low stress is a critical requirement. This neutral curing, non-corrosive, RTV silicone has very good flow properties and outstanding electrical insulation values, which enhance... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Dow SILASTIC ™ RTV-3112 Base is easily mixed and poured, cures at room temperature, gives accurate reproduction of masters for mold making with primer, provides wide service temperature ranges and absorbs mechanical shock and vibration. Base only. 18.1 kg Pail. [See More]
- Industry: Tooling
- Cure / Technology: Two Component
- Compound Type: Sealant
- Viscosity: 28000
from Master Bond, Inc.
MasterSil 972TC-LO is capable of transferring heat with a thermal conductivity of 7-9 BTU •in/ft ² •hr • °F [1.01-1.30 W/(m •K)], while retaining superior dielectric properties. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Dow SILASTIC ™ RTV-3112 Base is easily mixed and poured, cures at room temperature, gives accurate reproduction of masters for mold making with primer, provides wide service temperature ranges and absorbs mechanical shock and vibration. Base only. 4 kg Pail. [See More]
- Industry: Tooling
- Cure / Technology: Two Component
- Compound Type: Sealant
- Viscosity: 28000
from Master Bond, Inc.
Master Bond MasterSil 705TC is a one component, thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It features outstanding thermal conductivity and is well suited for applications that require flexibility and high temperature resistance. It cures... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Compound Type: Sealant; Thermally Conductive; Adhesive
- Composition: Unfilled
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.3937
from DME Company
RTV Silicone Adhesive Sealant. Bonds Most Plastics Many Assembly Uses. Cures at Room Temperature To A Tough Flexible Rubber. Resists Shrinkage. Perfect For Caulking, Sealing, Waterproofing & Bonding. Bonds & Seals Terminals, Connectors, Mounting Fixtures, Mechanical Gaskets, Glass, Metal,... [See More]
- Industry: Tooling
- Substrate Compatibility: Plastic; Dissimilar Substrates
- Compound Type: Sealant; Adhesive
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Hapco, Inc.
Hapsil 360 ™ is a high tear strength, tin-catalyzed RTV-2 silicone rubber, which was designed for casting Hapco's wide variety of rigid and flexible polyurethane resins. Hapsil 360 ™ is not sensitive to inhibition, meaning it will cure at room temperature over virtually any surface. [See More]
- Industry: OEM or Industrial; Tooling
- Type / Form: Liquid
- Compound Type: Sealant; Adhesive
- Composition: Unfilled
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.3937
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0098 to 0.0177
from Shiu Li Technology Co., Ltd
LiPOLY T-top99-s offers outstanding thermal conductivity at 24.0 W/m*K and extremely low thermal resistance under minimal force.T-top99-s offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.3937
from Shiu Li Technology Co., Ltd
LiPOLY TEM96D is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermalconductivity of 5.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; EMI/RFI Shielding; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.3937