Filled Silicone Adhesives and Sealants Datasheets

Thermally Conductive Silicone Compound -- SEMICOSIL® 975 TC
from Wacker Chemical Corp.

SEMICOSIL ® 975 TC is a 1-part thermally conductive paste that is curing into self-adhesive gap filling silicone. The thermal paste is able to efficiently fill finest gaps of heat generating and ablating substrates and thus helps to minimize contact resistance. Thermal resistivity is minimized... [See More]

  • Composition: Filled
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
  • Compound Type: Adhesive
  • Cure / Technology: Single Component
Aremco-Seal™ -- 4030
from Aremco Products, Inc.

Hi-temp, prevents dusting of fibrous insulation materials [See More]

  • Composition: Filled
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Sealant
  • Substrate Compatibility: Ceramic, Glass
INSULCAST RTVS 12 General Purpose RTV Silicone Potting Compound
from ITW Polymer Technologies - Insulcast Division

RTVS 12 is a multi-purpose compound designed for use as an encapsulant, sealant, potting and mold making material. RTVS 12 exhibits excellent electrical properties, low temperature flexibility and high temperature stability. A variety of catalysts are available for different cure situations. (See... [See More]

  • Composition: Filled
  • Type / Form: Gel
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Substrate Compatibility: Plastic
Silicone Adhesive -- PTS-46303
from Protavic America, Inc.

PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]

  • Composition: Filled
  • Type / Form: Gel
  • Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
  • Substrate Compatibility: Metal