Specialty / Other Silicone Adhesives and Sealants

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

• Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing; Addition Cure
• Type / Form: Liquid

• Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates

AS5702 is a non-corrosive, neutral cure, 1-part, RTV (Room Temperature Vulcanising) silicone adhesive sealant. It is one in a range of Alkoxy cure products which are solvent free. It exhibits excellent primerless adhesion to many substrates and cures at room temperature when in contact with... [See More]

• Cure / Technology: Single Component; Alkoxy
• Industry: Automotive; Electronics

• Compound Type: Sealant; Adhesive
• Use Temperature: -76 to 392

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

• Cure / Technology: Thermoset; Two Component  ; Addition Cure
• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates

• Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
• Composition: Filled

Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive dispensing, has a... [See More]

• Cure / Technology: Heat curing
• Features: Electrically Conductive

• Compound Type: Adhesive
• Industry: Semiconductors, IC's

LiPOLY ’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties. It... [See More]

• Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing (optional feature); High Heat
• Type / Form: Gel

• Compound Type: Thermally Conductive; Adhesive
• Industry: Electronics

A one part acetoxy cure silicone adhesive / sealant formulated for use at high temperatures. It is particularly suited for use in conjunction with insulations which require adhering or sealing to itself or hot surfaces. It cures to an elastomeric solid at room temperatures. VOC Compliant. Meets the... [See More]

• Cure / Technology: Single Component; Acetoxy
• Substrate Compatibility: Metal; Asphalt

• Compound Type: Adhesive
• Industry: Insulation Systems

ELASTOSIL ® RT 745 A/B is a pourable, thermally curable, addition-curing, two-part silicone rubber. Special features. two-part, 1 : 1 mixing ratio. low viscosity. low hardness. low risk of inhibition. rapid heat cure. primerless adhesion. Application. encapsulation of electronic components. [See More]

• Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing; Condensation Cured
• Substrate Compatibility: Ceramic, Glass; Metal; Dissimilar Substrates

• Compound Type: Sealant; Adhesive
• Features: Flame Retardant (optional feature)