Leveling / Filling Compound Silicone Adhesives and Sealants
from Ellsworth Adhesives
Bostik Chem-Calk 1200 Clear is a one component, moisture curing, silicone sealant that is used for bonding nonporous materials, aluminum, glass, plastics, and ceramics. It is typically used for sealing doors, windows, skylights, and other building components. 10.1 oz Cartridge. [See More]
- Compound Type: Caulk, Grout; Leveling Filling; Sealant; Adhesive
- Cure / Technology: Single Component
- Substrate Compatibility: Ceramic, Glass
- Tensile (Break): 290
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Composition: Unfilled
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Composition: Filled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Cure / Technology: Thermoset; Two Component ; Addition Cure
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Type / Form: Liquid
- Composition: Unfilled
from Master Bond, Inc.
MasterSil 920-LO is an ideal material for the encapsulation of sensitive electronic and optical components, especially when low stress is a critical requirement. This neutral curing, non-corrosive, RTV silicone has very good flow properties and outstanding electrical insulation values, which enhance... [See More]
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Composition: Unfilled
from Shiu Li Technology Co., Ltd
LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures. [See More]
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from R. S. Hughes Company, Inc.
Dap Silicone Plus gray asphalt & concrete sealant. This asphalt & concrete sealant is waterproof. Minimum to maximum operating temperatures are -65 F to +350 F. Perfect for sealing applications. [See More]
- Compound Type: Leveling Filling; Sealant
- Use Temperature: -65 to 350
from Henkel Corporation - Industrial
BERGQUIST GAP PAD TGP 1350, Highly Conformable, Thermally Conductive, Reworkable Gap Filling Material. BERGQUIST ® GAP PAD TGP 1350 is a highly compliant Gap Pad material that is ideal for fragile component leads. The material includes a PEN film, which facilitates rework and improves puncture... [See More]
- Compound Type: Leveling Filling; Thermally Conductive; Adhesive
from Wacker Chemical Corp.
EL E952 *PLP,BL OH,18 is a self-levelling one-component silicone rubber with very good mechanical properties, which cures at room temperature under the influence of atmospheric moisture. Special features. acetic acid-curing system. self-levelling. excellent primerless adhesion to many substrates. [See More]
- Compound Type: Leveling Filling; Sealant; Adhesive
- Industry: OEM or Industrial
- Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
- Viscosity: 250000
from R. S. Hughes Company, Inc.
Loctite SI 5019 blue gasket adhesive/sealant is compatible with pvc materials with a 24 hr cure time. Minimum to maximum operating temperatures are -65 F to +500 F. Formerly known as Loctite Superflex Blue RTV Silicone. [See More]
- Compound Type: Leveling Filling; Sealant
- Use Temperature: -65 to 500
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Henkel Corporation - Industrial
UV-cured alkoxy silicone used for gasketing and sealing that requires a rapid-curing, post-applied sealant that facilitates immediate on-part inspection. LOCTITE ® SI 5089 is a straw-colored, medium viscosity, fluorescent UV-cured alkoxy silicone used for gasketing and sealing applications. It... [See More]
- Compound Type: Leveling Filling; Sealant
- Cure / Technology: UV or Radiation Cured; Single Component
- Type / Form: Liquid
- Viscosity: ? to 125000
from R. S. Hughes Company, Inc.
Loctite SI 587 blue gasket adhesive/sealant is compatible with metal materials with a 24 hr cure time. Delivers great performance with tensile strength of 232 psi. Minimum to maximum operating temperatures are -74.2 F to +500 F. Formerly known as Loctite 587 Blue High Performance RTV Silicone Gasket... [See More]
- Compound Type: Leveling Filling; Sealant
- Use Temperature: -74 to 500
- Cure / Technology: Room Temperature Vulcanizing or Curing