Electrical Power / HV Silicone Adhesives and Sealants
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4155 HV Dielectric Gel Clear-Green is a two component, high viscosity, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It cures quickly at room temperature, offers flexibility, thermal stability,... [See More]
- Industry: Electric Power
- Cure / Technology: Two Component
- Compound Type: Encapsulant, Potting Compound
- Features: High Dielectric
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Hernon Manufacturing, Inc.
Silastomer ® 333 is a high performance, single component, ready to use adhesive / sealant. It has a paste-like consistency, which cures to a tough, resilient and durable silicone rubber when exposed to moisture in the air. Since it will not flow of its own weight, Silastomer ® 333 can be... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Ellsworth Adhesives
Dow SYLGARD ™ 160 Silicone Elastomer is a two component, room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate thermal conductivity, and flame resistance. 1:1 mix ratio. 200 mL Cartridge. This is a Dow... [See More]
- Industry: Electric Power
- Cure / Technology: Two Component
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 8775
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Composition: Filled
from Hernon Manufacturing, Inc.
Silastomer ® 334 is a high performance, single component, ready to use adhesive / sealant. It has a paste-like consistency, which cures to a tough, resilient and durable silicone rubber when exposed to moisture in the air. Since it will not flow of its own weight, Silastomer ® 334 can be... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Ellsworth Adhesives
Dow SYLGARD ™ 160 Silicone Elastomer is a two component, room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate thermal conductivity, and flame resistance. 1:1 mix ratio. Part A, 226.7 kg Pail. [See More]
- Industry: Electric Power
- Cure / Technology: Two Component
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 8100 to 8775
from Master Bond, Inc.
Passing both USP Class VI testing and ISO cytotoxicity specifications, MasterSil 910Med is formulated for bonding, sealing, coating in medical device applications. As an acetoxy type system, it bonds exceptionally well to a wide variety of substrates including metals, composites, ceramics, glass as... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Composition: Unfilled
from Hernon Manufacturing, Inc.
Silastomer ® 336 is a high performance, single component, acetoxy, ready to use silicone. It has a paste-like consistency, which cures to a tough, resilient and durable silicone rubber when exposed to moisture in the air. Since it will not flow of its own weight, Silastomer ® 336 can be... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Ellsworth Adhesives
Dow SYLGARD ™ 160 Silicone Elastomer is a two component, room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate thermal conductivity, and flame resistance. 1:1 mix ratio. Part A, 24.9 kg Pail. [See More]
- Industry: Electric Power
- Cure / Technology: Two Component
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 8100 to 8775
from Master Bond, Inc.
Master Bond MasterSil 323 is a two component, addition cured system for bonding, sealing and potting applications. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Hernon Manufacturing, Inc.
Silastomer ® 343 is a black, high performance, single component, ready to use adhesive / sealant. It has a paste-like consistency, which cures to a tough, resilient and durable silicone rubber when exposed to moisture in the air. Designed to provide excellent oil resistance and can be used as a... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Ellsworth Adhesives
Dow SYLGARD ™ 160 Silicone Elastomer is a two component, room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate thermal conductivity, and flame resistance. 1:1 mix ratio. Part A, 5.4 kg Pail. This is a Dow... [See More]
- Industry: Electric Power
- Cure / Technology: Two Component
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 8100 to 8775
from Master Bond, Inc.
MasterSil 930 is an acetoxy type fluorosilicone for bonding, sealing and coating. Its most prominent feature is excellent chemical resistance, particularly to fuels, oils and solvents when compared to more standard silicones. Some of the chemicals that this product can withstand better than... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Sealant; Adhesive
- Composition: Unfilled
from Hernon Manufacturing, Inc.
Supertacker ® 351 is a single component, high performance elastomeric adhesive that exhibits exceptional bonding characteristics to a broad range of materials including metals, glass, plastic composites, rubber, leather, wood and vinyl. Supertacker ® 351 provides a tough, waterproof bond... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Ellsworth Adhesives
Dow SYLGARD ™ 160 Silicone Elastomer is a two component, room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate thermal conductivity, and flame resistance. 1:1 mix ratio. Part B, 226.7 kg Pail. [See More]
- Industry: Electric Power
- Cure / Technology: Two Component
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 3950 to 8775
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Hernon Manufacturing, Inc.
Supertacker ® 353 is a single component, high performance elastomeric adhesive that exhibits exceptional bonding characteristics to a broad range of materials including metals, glass, plastic composites, rubber, leather, wood and vinyl. Supertacker ® 353 provides a tough, waterproof bond... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Ellsworth Adhesives
Dow SYLGARD ™ 160 Silicone Elastomer is a two component, room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate thermal conductivity, and flame resistance. 1:1 mix ratio. Part B, 24.9 kg Pail. [See More]
- Industry: Electric Power
- Cure / Technology: Two Component
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 3950 to 8775
from Master Bond, Inc.
MasterSil 920-LO is an ideal material for the encapsulation of sensitive electronic and optical components, especially when low stress is a critical requirement. This neutral curing, non-corrosive, RTV silicone has very good flow properties and outstanding electrical insulation values, which enhance... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Hernon Manufacturing, Inc.
Supertacker ® 357 is a single component, high performance elastomeric adhesive that exhibits exceptional bonding characteristics to a broad range of materials including metals, glass, plastic composites, rubber, leather, wood and vinyl. Supertacker ® 357 provides a tough, waterproof bond... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Ellsworth Adhesives
Dow SYLGARD ™ 160 Silicone Elastomer is a two component, room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate thermal conductivity, and flame resistance. 1:1 mix ratio. Part B, 5.4 kg Pail. This is a Dow... [See More]
- Industry: Electric Power
- Cure / Technology: Two Component
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 3950 to 8775
from Master Bond, Inc.
MasterSil 972TC-LO is capable of transferring heat with a thermal conductivity of 7-9 BTU •in/ft ² •hr • °F [1.01-1.30 W/(m •K)], while retaining superior dielectric properties. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Hernon Manufacturing, Inc.
Hernon Dissipator 746D is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair provide... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Compound Type: Thermally Conductive; Adhesive
from Ellsworth Adhesives
Dow SYLGARD ™ 164 Silicone Elastomer Gray is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides good flowability, thermal... [See More]
- Industry: Electric Power
- Cure / Technology: Two Component
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 8925
from Master Bond, Inc.
Master Bond MasterSil 705TC is a one component, thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It features outstanding thermal conductivity and is well suited for applications that require flexibility and high temperature resistance. It cures... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Compound Type: Sealant; Thermally Conductive; Adhesive
- Composition: Unfilled
from Ellsworth Adhesives
Dow SYLGARD ™ 164 Silicone Elastomer Gray is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides good flowability, thermal... [See More]
- Industry: Electric Power
- Cure / Technology: Two Component
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 4400 to 8925
from Master Bond, Inc.
MasterSil 912Med is a single component silicone with a paste viscosity for bonding, sealing and coating medical devices. This non-corrosive, neutral cure compound complies with USP Class VI and ISO 10993-5 specifications. It resists many kinds of sterilization including gamma and other types of... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Sealant; Adhesive
- Composition: Unfilled
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
from Wacker Chemical Corp.
WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]
- Industry: Automotive; Electronics; Electric Power; Optical
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Novagard Solutions
Non-corrosive, single component silicone coating [See More]
- Industry: Electronics; Electric Power; OEM or Industrial
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Sealant
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic
from Techsil Limited
TSE3941 is a flame retardant silicone adhesive sealant from Momentive Performance Materials, designed for electrical and electronic applications. This non-flowable, one-component RTV forms a soft elastic silicone rubber which is non-corrosive to metallic substrates. Product Benefits. High thermal... [See More]
- Industry: Electronics; Electric Power
- Features: Flame Retardant
- Compound Type: Adhesive
- Use Temperature: -55 to 200
from Bluestar Silicones USA Corp.
Potting, encapsulant elastomer. Properties. Viscosity 3500. Hardness Sha 48. Description. a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL ™ ESA 7252 QC A & B is supplied as a viscous liquid which... [See More]
- Industry: Electronics; Electric Power
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.3937
from Protavic America, Inc.
PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]
- Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Type / Form: Gel
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.3937
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0098 to 0.0177
from Shiu Li Technology Co., Ltd
LiPOLY T-top99-s offers outstanding thermal conductivity at 24.0 W/m*K and extremely low thermal resistance under minimal force.T-top99-s offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.3937
from Shiu Li Technology Co., Ltd
LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Shiu Li Technology Co., Ltd
LiPOLY S-putty5-s is a one-part dispensable material with thermal conductivity 10.0 W/m*K. It also can overcome overflow and drying problems to increase the thermal conductivity. S-putty5-s is a great alternative to thermal grease and ideally suited for dispensing using the dispensing robot. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
- Viscosity: 2.00E7
- Compound Type: Sealant; Thermally Conductive
- Use Temperature: -76 to 356
from Shiu Li Technology Co., Ltd
LiPOLY TEM96D is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermalconductivity of 5.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; EMI/RFI Shielding; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.3937
from Shiu Li Technology Co., Ltd
LiPOLY HC-93 is a stereoscopic thermal conductive silicone rubber cap as substrate through a special production process. Due to its excellent characteristic of high thermal conductivity, insulation, shockproof and convenient assembly, it is widely used in heat transistor refer to TO220 / TO3P,... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Rubber or Elastomer
- Compound Type: Sealant; Thermally Conductive
- Features: High Dielectric; Laminaes; UL Rating
from Shiu Li Technology Co., Ltd
LiPOLY SP is a stereoscopic thermal conductive silicone rubber cap as substrate through a special production process. Due to its excellent characteristic of high thermal conductivity, insulation, shockproof and convenient assembly, it is widely used in heat transistor refer to TO220 / TO3P, diode,... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Rubber or Elastomer
- Compound Type: Sealant; Thermally Conductive
- Features: High Dielectric; Laminaes; UL Rating
from Shiu Li Technology Co., Ltd
LiPOLY TP200 is a stereoscopic thermal conductive silicone rubber cap as substrate through a special production process. Due to its excellent characteristic of high thermal conductivity, insulation, shockproof and convenient assembly, it is widely used in heat transistor refer to TO220 / TO3P,... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Rubber or Elastomer
- Compound Type: Sealant; Thermally Conductive
- Features: High Dielectric; Laminaes; UL Rating