Thermosetting / Crosslinking Silicone Adhesives and Sealants
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Cure / Technology: Thermoset; Two Component ; Addition Cure
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Composition: Filled
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Master Bond, Inc.
Passing both USP Class VI testing and ISO cytotoxicity specifications, MasterSil 910Med is formulated for bonding, sealing, coating in medical device applications. As an acetoxy type system, it bonds exceptionally well to a wide variety of substrates including metals, composites, ceramics, glass as... [See More]
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond MasterSil 323 is a two component, addition cured system for bonding, sealing and potting applications. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Features: Flexible; High Dielectric; Non-corrosive
from Master Bond, Inc.
MasterSil 930 is an acetoxy type fluorosilicone for bonding, sealing and coating. Its most prominent feature is excellent chemical resistance, particularly to fuels, oils and solvents when compared to more standard silicones. Some of the chemicals that this product can withstand better than... [See More]
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Sealant; Adhesive
- Composition: Unfilled
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
MasterSil 920-LO is an ideal material for the encapsulation of sensitive electronic and optical components, especially when low stress is a critical requirement. This neutral curing, non-corrosive, RTV silicone has very good flow properties and outstanding electrical insulation values, which enhance... [See More]
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
MasterSil 972TC-LO is capable of transferring heat with a thermal conductivity of 7-9 BTU •in/ft ² •hr • °F [1.01-1.30 W/(m •K)], while retaining superior dielectric properties. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics... [See More]
- Cure / Technology: Thermoset; Two Component
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond MasterSil 705TC is a one component, thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It features outstanding thermal conductivity and is well suited for applications that require flexibility and high temperature resistance. It cures... [See More]
- Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Compound Type: Sealant; Thermally Conductive; Adhesive
- Composition: Unfilled
from Master Bond, Inc.
MasterSil 912Med is a single component silicone with a paste viscosity for bonding, sealing and coating medical devices. This non-corrosive, neutral cure compound complies with USP Class VI and ISO 10993-5 specifications. It resists many kinds of sterilization including gamma and other types of... [See More]
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Sealant; Adhesive
- Composition: Unfilled
from Master Bond, Inc.
Low viscosity MasterSil 152 is a two component, optically clear silicone system that cures when exposed to air at room temperature. It has outstanding electrical insulation properties, making it ideal for potting and encapsulation applications. Additionally it features a long working life and has a... [See More]
- Cure / Technology: Thermoset; Two Component ; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Master Bond, Inc.
Master Bond MasterSil 153AO is an addition cured two part silicone with a high tensile lap shear strength, thermal conductivity and electrical insulation. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Compound Type: Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9 BTU... [See More]
- Cure / Technology: Thermoset; Two Component
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the aerospace, electronic,... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Sealant; Thermally Conductive; Adhesive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond MasterSil 153Med is a two component, paste silicone compound for high performance bonding and sealing. This is an addition cured system and does not require exposure to air for complete cross-linking. With a convenient one to one mix ratio by weight, it will not outgas while curing. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cured
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Sealant; Adhesive
- Composition: Unfilled
from Master Bond, Inc.
Mastersil 323Med is a two part, addition cured silicone that passes ISO 10933-5 for cytotoxicity used in medical device manufacturing. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Sealant; Adhesive
- Features: High Dielectric; Non-corrosive
from Epoxies Etc...
50-1225 is a low viscosity, room temperature curing, RTV silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
- Composition: Unfilled
from Bluestar Silicones USA Corp.
Clear, Two-Component, Addition Cure, Heat Curing Electronic coating Silicone Compound. Properties. Viscosity 6000. Hardness Sha 30. Description. BLUESIL V-207 is a clear, two component, addition cure, heat curing silicone rubber compound. It is designed as a primerless coating and encapsulating... [See More]
- Cure / Technology: Thermoset; Two Component ; Reactive or Moisture Cured
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound
- Industry: Electronics
from Henkel Corporation - Electronics
LOCTITE 5210 is an ultra fast curing, non-corrosive RTV silicone designed for potting, wire tracking, selective sealing, vibration dampening and repair/rework applications on PCB's. [See More]
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
- Industry: Electronics
- Compound Type: Sealant
- Elongation: 230.0
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® GAP FILLER TGF 3500LVO is a silicone, two-component, high thermal conductivity, liquid gap filler. This product offers the mechanical property benefits of a silicone material with the additional feature of low outgassing. It can be used in industries ranging from automotive to... [See More]
- Cure / Technology: Thermoset
- Type / Form: Liquid
- Compound Type: Thermally Conductive; Adhesive
- Industry: OEM or Industrial
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Cure / Technology: Thermoset; Two Component
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
from Aremco Products, Inc.
Hi-temp, low viscosity, easy to use, offered in alternative pigments [See More]
- Cure / Technology: Thermoset
- Substrate Compatibility: Fiberoptics
- Compound Type: Sealant; Adhesive
- Composition: Unfilled
from Wacker Chemical Corp.
WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]
- Cure / Technology: Thermoset
- Type / Form: Liquid
- Compound Type: Sealant; Adhesive
- Industry: OEM or Industrial
from Epoxies Etc...
20-1615 is a two component, room temperature curing silicone rubber compound. This silicone system is clear, odorless, and low in viscosity. 20-1615 is an excellent choice for potting electronic assemblies that require shock and vibration resistance. It also protects assemblies from moisture, ozone,... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound
- Composition: Unfilled
from Protavic America, Inc.
PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]
- Cure / Technology: Thermoset; Two Component
- Type / Form: Gel
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
from Wacker Chemical Corp.
WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound
- Features: Flexible; Flame Retardant