Aerospace Silicone Adhesives and Sealants
from Ellsworth Adhesives
Dow DOWSIL ™ 730 FS Solvent Resistant Sealant White is a one component, non-slumping, fluorosilicone paste that is used for bonding, sealing, repairing, or assembling applications that are exposed to moisture, extreme temperatures, shock, oils, solvents, fuels, and swelling effects. It offers... [See More]
- Industry: Aerospace; Automotive
- Cure / Technology: Single Component
- Compound Type: Sealant; Adhesive
- Tensile (Break): 435
from RS Components, Ltd.
MG Silicone Conformal coating 340g [See More]
- Industry: Aerospace; Electronics; OEM or Industrial; Aerospace, Air Bag Controllers, Automobile, Aviation, Communication, Consumer Electronics Industries, Electric Generators, Industrial Control Equip
- Use Temperature: -40 to 392
from Hernon Manufacturing, Inc.
Silastomer ® 333 is a high performance, single component, ready to use adhesive / sealant. It has a paste-like consistency, which cures to a tough, resilient and durable silicone rubber when exposed to moisture in the air. Since it will not flow of its own weight, Silastomer ® 333 can be... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Dow DOWSIL ™ 730 FS Solvent Resistant Sealant White is a one component, non-slumping, fluorosilicone paste that is used for bonding, sealing, repairing, or assembling applications that are exposed to moisture, extreme temperatures, shock, oils, solvents, fuels, and swelling effects. It offers... [See More]
- Industry: Aerospace; Automotive
- Cure / Technology: Single Component
- Compound Type: Sealant; Adhesive
- Tensile (Break): 435
from RS Components, Ltd.
Konform silicone coating 400ml [See More]
- Industry: Aerospace; Aerospace, Data Communications, Instrumentation
- Use Temperature: -85 to 392
- Type / Form: Liquid
from Hernon Manufacturing, Inc.
Silastomer ® 334 is a high performance, single component, ready to use adhesive / sealant. It has a paste-like consistency, which cures to a tough, resilient and durable silicone rubber when exposed to moisture in the air. Since it will not flow of its own weight, Silastomer ® 334 can be... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Composition: Filled
from Ellsworth Adhesives
Dow DOWSIL ™ 730 Solvent Resistant Sealant White is a one component, non-slumping, fluorosilicone paste that is used for bonding, sealing, repairing, or assembling applications that are exposed to moisture, extreme temperatures, shock, oils, solvents, fuels, and swelling effects. It offers... [See More]
- Industry: Aerospace; Automotive
- Cure / Technology: Single Component
- Compound Type: Sealant; Adhesive
- Tensile (Break): 300
from RS Components, Ltd.
ELECTROFUGE VARNISH 200-ND 5 L [See More]
- Industry: Aerospace; Automotive; Electronics; Marine; Aerospace, Automotive, Electronics, Marine, Telecommunications
- Dielectric Strength: 2032
- Compound Type: Sealant
from Hernon Manufacturing, Inc.
Silastomer ® 336 is a high performance, single component, acetoxy, ready to use silicone. It has a paste-like consistency, which cures to a tough, resilient and durable silicone rubber when exposed to moisture in the air. Since it will not flow of its own weight, Silastomer ® 336 can be... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Industry: Aerospace; Electronics; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Ellsworth Adhesives
Dow DOWSIL ™ 736 Heat Resistant Sealant Red is a one component, non-slumping, silicone paste that is used for coating, sealing, encapsulating, potting, and bonding applications that are exposed to high temperatures. It is recommended for industrial ovens, aerospace gasketing, moving oven... [See More]
- Industry: Aerospace
- Cure / Technology: Single Component
- Compound Type: Sealant; Adhesive
- Tensile (Break): 350
from RS Components, Ltd.
ELECTROFUGE VARNISH 200-ND 650 ML [See More]
- Industry: Aerospace; Automotive; Electronics; Marine; Aerospace, Automotive, Electronics, Marine, Telecommunications
- Type / Form: Liquid
- Compound Type: Sealant
- Dielectric Strength: 2032
from Hernon Manufacturing, Inc.
Silastomer ® 343 is a black, high performance, single component, ready to use adhesive / sealant. It has a paste-like consistency, which cures to a tough, resilient and durable silicone rubber when exposed to moisture in the air. Designed to provide excellent oil resistance and can be used as a... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Master Bond, Inc.
Passing both USP Class VI testing and ISO cytotoxicity specifications, MasterSil 910Med is formulated for bonding, sealing, coating in medical device applications. As an acetoxy type system, it bonds exceptionally well to a wide variety of substrates including metals, composites, ceramics, glass as... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ 736 Heat Resistant Sealant Red is a one component, non-slumping, silicone paste that is used for coating, sealing, encapsulating, potting, and bonding applications that are exposed to high temperatures. It is recommended for industrial ovens, aerospace gasketing, moving oven... [See More]
- Industry: Aerospace
- Cure / Technology: Single Component
- Compound Type: Sealant; Adhesive
- Tensile (Break): 350
from Hernon Manufacturing, Inc.
Supertacker ® 351 is a single component, high performance elastomeric adhesive that exhibits exceptional bonding characteristics to a broad range of materials including metals, glass, plastic composites, rubber, leather, wood and vinyl. Supertacker ® 351 provides a tough, waterproof bond... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Master Bond, Inc.
Master Bond MasterSil 323 is a two component, addition cured system for bonding, sealing and potting applications. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
Dow DOWSIL ™ 736 Heat Resistant Sealant Red is a one component, non-slumping, silicone paste that is used for coating, sealing, encapsulating, potting, and bonding applications that are exposed to high temperatures. It is recommended for industrial ovens, aerospace gasketing, moving oven... [See More]
- Industry: Aerospace
- Cure / Technology: Single Component
- Compound Type: Sealant; Adhesive
- Tensile (Break): 350
from Hernon Manufacturing, Inc.
Supertacker ® 353 is a single component, high performance elastomeric adhesive that exhibits exceptional bonding characteristics to a broad range of materials including metals, glass, plastic composites, rubber, leather, wood and vinyl. Supertacker ® 353 provides a tough, waterproof bond... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.3937
from Wacker Chemical Corp.
One-component, acid-curing, low-modulus silicone sealant for glazing and industrial applications. ELASTOSIL ® 4100 cures at room temperature under the action of atmospheric moisture to give a permanently flexible silicone rubber. Special features. suitable for use in sanitary areas. [See More]
- Industry: Aerospace; Automotive; Marine; Construction; OEM or Industrial
- Type / Form: Gel
- Compound Type: Caulk, Grout; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Plastic; Paint
from Bluestar Silicones USA Corp.
Two-Component, Flowable Silicone Aerospace Sealant. Properties. Viscosity 190000. Hardness Sha 58. Description. Bluesil V-695 is a black, two component addition cure, flowable silicone aerospace sealant. It is specifically designed for, and qualified to, General Electric Aircraft Engine... [See More]
- Industry: Aerospace
- Substrate Compatibility: Metal; Plastic
- Compound Type: Sealant
- Cure / Technology: Two Component
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.3937
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0098 to 0.0177
from Shiu Li Technology Co., Ltd
LiPOLY T-top99-s offers outstanding thermal conductivity at 24.0 W/m*K and extremely low thermal resistance under minimal force.T-top99-s offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.3937
from Shiu Li Technology Co., Ltd
LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Shiu Li Technology Co., Ltd
LiPOLY S-putty5-s is a one-part dispensable material with thermal conductivity 10.0 W/m*K. It also can overcome overflow and drying problems to increase the thermal conductivity. S-putty5-s is a great alternative to thermal grease and ideally suited for dispensing using the dispensing robot. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
- Viscosity: 2.00E7
- Compound Type: Sealant; Thermally Conductive
- Use Temperature: -76 to 356