Dissimilar Substrates Silicone Adhesives and Sealants
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Composition: Unfilled
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Composition: Filled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Cure / Technology: Thermoset; Two Component ; Addition Cure
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Type / Form: Liquid
- Composition: Unfilled
from Master Bond, Inc.
Passing both USP Class VI testing and ISO cytotoxicity specifications, MasterSil 910Med is formulated for bonding, sealing, coating in medical device applications. As an acetoxy type system, it bonds exceptionally well to a wide variety of substrates including metals, composites, ceramics, glass as... [See More]
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Composition: Unfilled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Composition: Filled
from Wacker Chemical Corp.
ELASTOSIL ® RT 745 A/B is a pourable, thermally curable, addition-curing, two-part silicone rubber. Special features. two-part, 1 : 1 mixing ratio. low viscosity. low hardness. low risk of inhibition. rapid heat cure. primerless adhesion. Application. encapsulation of electronic components. [See More]
- Compound Type: Sealant; Adhesive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Condensation Cured
- Substrate Compatibility: Ceramic, Glass; Metal; Dissimilar Substrates
- Features: Flame Retardant (optional feature)
from DME Company
RTV Silicone Adhesive Sealant. Bonds Most Plastics Many Assembly Uses. Cures at Room Temperature To A Tough Flexible Rubber. Resists Shrinkage. Perfect For Caulking, Sealing, Waterproofing & Bonding. Bonds & Seals Terminals, Connectors, Mounting Fixtures, Mechanical Gaskets, Glass, Metal,... [See More]
- Compound Type: Sealant; Adhesive
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Plastic; Dissimilar Substrates
- Industry: Tooling
from Novagard Solutions
Non-corrosive, single component oxime silicon sealant and/or adhesive [See More]
- Compound Type: Sealant; Adhesive
- Composition: Unfilled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Wood; Dissimilar Substrates
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing