Flexible / Dampening Silicone Adhesives and Sealants

11 Results
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Features: Flexible; High Dielectric; Non-corrosive; Phase Change
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Features: Flexible; Electrically Conductive; Non-corrosive; Phase Change
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
  • Composition: Filled
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel
from Master Bond, Inc.

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

  • Features: Flexible; High Dielectric; Non-corrosive; Phase Change
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
Flexible,Fast Curing Silicone for Medical Device Assemblies -- MasterSil 910Med
from Master Bond, Inc.

Passing both USP Class VI testing and ISO cytotoxicity specifications, MasterSil 910Med is formulated for bonding, sealing, coating in medical device applications. As an acetoxy type system, it bonds exceptionally well to a wide variety of substrates including metals, composites, ceramics, glass as... [See More]

  • Features: Flexible; High Dielectric; Thermal Insulation
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Composition: Unfilled
Flowable Silicone Offers Thermal Cycling and Shock Resistance -- MasterSil 323
from Master Bond, Inc.

Master Bond MasterSil 323 is a two component, addition cured system for bonding, sealing and potting applications. [See More]

  • Features: Flexible; High Dielectric; Non-corrosive
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
High Temperature Resistant, One Part Fluorosilicone Adhesive -- MasterSil 930
from Master Bond, Inc.

MasterSil 930 is an acetoxy type fluorosilicone for bonding, sealing and coating. Its most prominent feature is excellent chemical resistance, particularly to fuels, oils and solvents when compared to more standard silicones. Some of the chemicals that this product can withstand better than... [See More]

  • Features: Flexible; Non-corrosive; Thermal Insulation
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
  • Compound Type: Sealant; Adhesive
  • Composition: Unfilled
Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance -- MasterSil 151TC
from Master Bond, Inc.

MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]

  • Features: Flexible; High Dielectric; Non-corrosive
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Silicon Rubber -- RTV 100-150
from Novagard Solutions

Single component, moisture cured silicone rubber, strong durable sealant [See More]

  • Features: Flexible
  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Aluminum; Fiberglass
  • Compound Type: Sealant
  • Composition: Unfilled
Silicone Elastomer Gel Encapsulant And Potting Compound -- SilGel® 612 A/B
from Wacker Chemical Corp.

WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]

  • Features: Flexible; Flame Retardant
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Features: Flexible; Electrically Conductive
  • Type / Form: Liquid
  • Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic
Silicone Encapsulant -- PTS-46303
from Protavic America, Inc.

PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]

  • Features: Flexible; High Dielectric; Flame Retardant; UL Rating
  • Type / Form: Gel
  • Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic