Semiconductors / IC Packaging Silicone Adhesives and Sealants
from MacDermid Alpha Electronics Solutions
A thixotropic two-part silicone potting compound specifically crafted to safeguard LED drivers and a range of other components. Product Overview. SC4003 is a thixotropic two-part silicone potting and encapsulating resin designed for the Indian market. Primarily developed for the protection of LED... [See More]
- Industry: Electronics; Semiconductors, IC's
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Compound Type: Encapsulant, Potting Compound
from Ellsworth Adhesives
Dow DOWSIL ™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C,... [See More]
- Industry: Electronics; Semiconductors, IC's
- Cure / Technology: Single Component
- Compound Type: Encapsulant, Potting Compound; Sealant
- Features: High Dielectric
from RS Components, Ltd.
Non-corrosive silicone sealant,Wht 310ml [See More]
- Industry: Semiconductors, IC's; Copper, Semiconductor Junction Protection
- Use Temperature: -40 to 302
- Compound Type: Sealant
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from RS Components, Ltd.
Non-corrosive silicone sealant,Wht 100gm [See More]
- Industry: Semiconductors, IC's; Copper, Semiconductor Junction Protection
- Use Temperature: -40 to 302
- Compound Type: Sealant
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Composition: Filled
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Industry: Aerospace; Electronics; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Master Bond, Inc.
Passing both USP Class VI testing and ISO cytotoxicity specifications, MasterSil 910Med is formulated for bonding, sealing, coating in medical device applications. As an acetoxy type system, it bonds exceptionally well to a wide variety of substrates including metals, composites, ceramics, glass as... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond MasterSil 323 is a two component, addition cured system for bonding, sealing and potting applications. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.3937
from Shenzhen DeepMaterial Technologies Co., Ltd
Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive dispensing, has a... [See More]
- Industry: Semiconductors, IC's
- Cure / Technology: Heat curing
- Compound Type: Adhesive
- Features: Electrically Conductive
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.3937
from Protavic America, Inc.
PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]
- Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Type / Form: Gel
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0098 to 0.0177
from Shiu Li Technology Co., Ltd
LiPOLY T-top99-s offers outstanding thermal conductivity at 24.0 W/m*K and extremely low thermal resistance under minimal force.T-top99-s offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.3937
from Shiu Li Technology Co., Ltd
LiPOLY TEM96D is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermalconductivity of 5.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; EMI/RFI Shielding; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.3937
from Shiu Li Technology Co., Ltd
LiPOLY HC-93 is a stereoscopic thermal conductive silicone rubber cap as substrate through a special production process. Due to its excellent characteristic of high thermal conductivity, insulation, shockproof and convenient assembly, it is widely used in heat transistor refer to TO220 / TO3P,... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Rubber or Elastomer
- Compound Type: Sealant; Thermally Conductive
- Features: High Dielectric; Laminaes; UL Rating