Electronics Silicone Adhesives and Sealants
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from MacDermid Alpha Electronics Solutions
A thixotropic two-part silicone potting compound specifically crafted to safeguard LED drivers and a range of other components. Product Overview. SC4003 is a thixotropic two-part silicone potting and encapsulating resin designed for the Indian market. Primarily developed for the protection of LED... [See More]
- Industry: Electronics; Semiconductors, IC's
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Compound Type: Encapsulant, Potting Compound
from CHT USA Inc.
CHT's AS1821 is is a non-corrosive, neutral cure, 1-part, RTV (Room Temperature Vulcanising) silicone adhesive sealant. It is one in a range of Acetone cure products which are solvent free. It exhibits excellent primerless adhesion to many substrates and cures rapidly at room temperature when in... [See More]
- Industry: Automotive; Electronics
- Cure / Technology: Single Component; Acetone
- Compound Type: Sealant; Adhesive
- Viscosity: 20000
from Ellsworth Adhesives
Dow 3-4237 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for potting, sealing, encapsulating, and protecting electrical components from contaminants, moisture, and stress. It is durable, flexible, self healing, and offers long working times. [See More]
- Industry: Electronics
- Cure / Technology: Two Component
- Compound Type: Encapsulant, Potting Compound; Sealant
- Features: High Dielectric
from Dongguan Sheen Electronic Technology Co., Ltd.
Designed as battery pack thermal runaway protection(thermal propagation) material, SF-C is a fiberglass or PET carrier ceramifiable (ceramifying) silicone rubber composite sheet. Like ordinary rubber, silicone rubber and thermoplastic elastomer, it has not only good insulation and elasticity, but... [See More]
- Industry: Electronics
- Compound Type: Adhesive
from RS Components, Ltd.
MG Silicone Conformal coating 340g [See More]
- Industry: Aerospace; Electronics; OEM or Industrial; Aerospace, Air Bag Controllers, Automobile, Aviation, Communication, Consumer Electronics Industries, Electric Generators, Industrial Control Equip
- Use Temperature: -40 to 392
from Hernon Manufacturing, Inc.
Silastomer ® 333 is a high performance, single component, ready to use adhesive / sealant. It has a paste-like consistency, which cures to a tough, resilient and durable silicone rubber when exposed to moisture in the air. Since it will not flow of its own weight, Silastomer ® 333 can be... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Composition: Filled
from CHT USA Inc.
AS5702 is a non-corrosive, neutral cure, 1-part, RTV (Room Temperature Vulcanising) silicone adhesive sealant. It is one in a range of Alkoxy cure products which are solvent free. It exhibits excellent primerless adhesion to many substrates and cures at room temperature when in contact with... [See More]
- Industry: Automotive; Electronics
- Cure / Technology: Single Component; Alkoxy
- Compound Type: Sealant; Adhesive
- Use Temperature: -76 to 392
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4207 Dielectric Tough Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has good... [See More]
- Industry: Electronics
- Cure / Technology: Two Component
- Compound Type: Encapsulant, Potting Compound
- Features: High Dielectric
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SE Series two-component Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 2.0 to 8.0 W/m ·K. ◆ Soft and elastic after curing, maintaining the required thickness and providing... [See More]
- Industry: Electronics
- Type / Form: Gel
- Compound Type: Thermally Conductive; Adhesive
- Use Temperature: -58 to 302
from RS Components, Ltd.
ELECTROFUGE VARNISH 200-ND 5 L [See More]
- Industry: Aerospace; Automotive; Electronics; Marine; Aerospace, Automotive, Electronics, Marine, Telecommunications
- Dielectric Strength: 2032
- Compound Type: Sealant
from Hernon Manufacturing, Inc.
Silastomer ® 334 is a high performance, single component, ready to use adhesive / sealant. It has a paste-like consistency, which cures to a tough, resilient and durable silicone rubber when exposed to moisture in the air. Since it will not flow of its own weight, Silastomer ® 334 can be... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Industry: Aerospace; Electronics; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from CHT USA Inc.
CHT ’s AS1803 is a white, non-corrosive, neutral cure 1-part RTV silicone adhesive sealant. This product will not corrode copper or its alloys and is designed for use with electronic components. It is part of CHT's range of Acetone cure products which are all solvent free. It features a fast... [See More]
- Industry: Automotive; Electronics
- Cure / Technology: Single Component; Acetone
- Compound Type: Adhesive
- Features: Flame Retardant; UL Rating
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4207 Dielectric Tough Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has good... [See More]
- Industry: Electronics
- Cure / Technology: Two Component
- Compound Type: Encapsulant, Potting Compound
- Features: High Dielectric
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's TIV800 Series RTV Thermal Conductive Adhesive are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 1.0 to 2.0 W/m ·K. ◆ High bonding performance. ◆ Good stability, long-term high... [See More]
- Industry: Electronics
- Use Temperature: -58 to 392
- Compound Type: Thermally Conductive; Adhesive
- Thermal Conductivity: 1.5
from RS Components, Ltd.
ELECTROFUGE VARNISH 200-ND 650 ML [See More]
- Industry: Aerospace; Automotive; Electronics; Marine; Aerospace, Automotive, Electronics, Marine, Telecommunications
- Type / Form: Liquid
- Compound Type: Sealant
- Dielectric Strength: 2032
from Hernon Manufacturing, Inc.
Silastomer ® 336 is a high performance, single component, acetoxy, ready to use silicone. It has a paste-like consistency, which cures to a tough, resilient and durable silicone rubber when exposed to moisture in the air. Since it will not flow of its own weight, Silastomer ® 336 can be... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Master Bond, Inc.
Passing both USP Class VI testing and ISO cytotoxicity specifications, MasterSil 910Med is formulated for bonding, sealing, coating in medical device applications. As an acetoxy type system, it bonds exceptionally well to a wide variety of substrates including metals, composites, ceramics, glass as... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Composition: Unfilled
from CHT USA Inc.
CHT's AS1707 is a 1-part, alkoxy cured, thermally conductive, low volatile, RTV silicone adhesive paste. AS1707 is formulated to meet the requirements for use as a space grade adhesive. AS1707 has low thermal outgassing properties and a wide operational temperature range. In addition to meeting... [See More]
- Industry: Automotive; Electronics
- Cure / Technology: Single Component; Alkoxy
- Compound Type: Thermally Conductive; Adhesive
- Features: Flame Retardant; UL Rating
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has excellent... [See More]
- Industry: Electronics
- Cure / Technology: Two Component
- Compound Type: Encapsulant, Potting Compound
- Features: High Dielectric
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SC Series Thermal Films are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 0.8 to 5.0 W/m ·K. ◆ Optional fiberglass or polyimide film can be used as the reinforcement carrier. ◆ High mechanical... [See More]
- Industry: Electronics
- Use Temperature: -58 to 392
- Compound Type: Thermally Conductive; Adhesive
- Thermal Conductivity: 3.5
from Hernon Manufacturing, Inc.
Silastomer ® 343 is a black, high performance, single component, ready to use adhesive / sealant. It has a paste-like consistency, which cures to a tough, resilient and durable silicone rubber when exposed to moisture in the air. Designed to provide excellent oil resistance and can be used as a... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Master Bond, Inc.
Master Bond MasterSil 323 is a two component, addition cured system for bonding, sealing and potting applications. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from CHT USA Inc.
CHT ’s TufGel 336 is a 2-part, tough, black silicone gel designed for electronic potting applications to provide protection from moisture, vibration and thermal or mechanical shock. TufGel 336 can also function as a contrast enhancement material in LED applications. TufGel 336 is also flame... [See More]
- Industry: Automotive; Electronics; OEM or Industrial
- Cure / Technology: Two Component ; Addition
- Type / Form: Gel
- Features: Flame Retardant
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has excellent... [See More]
- Industry: Electronics
- Cure / Technology: Two Component
- Compound Type: Encapsulant, Potting Compound
- Features: High Dielectric
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SC Series Thermal Films are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 0.8 to 5.0 W/m ·K. ◆ Optional fiberglass or polyimide film can be used as the reinforcement carrier. ◆ High mechanical... [See More]
- Industry: Electronics
- Use Temperature: -58 to 392
- Compound Type: Thermally Conductive; Adhesive
- Thermal Conductivity: 0.9000
from Hernon Manufacturing, Inc.
Supertacker ® 351 is a single component, high performance elastomeric adhesive that exhibits exceptional bonding characteristics to a broad range of materials including metals, glass, plastic composites, rubber, leather, wood and vinyl. Supertacker ® 351 provides a tough, waterproof bond... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Master Bond, Inc.
MasterSil 930 is an acetoxy type fluorosilicone for bonding, sealing and coating. Its most prominent feature is excellent chemical resistance, particularly to fuels, oils and solvents when compared to more standard silicones. Some of the chemicals that this product can withstand better than... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Sealant; Adhesive
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4241 Dielectric Tough Gel Clear-Green is a two component, heat curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, flame resistant, long working... [See More]
- Industry: Electronics
- Cure / Technology: Two Component
- Compound Type: Encapsulant, Potting Compound
- Features: High Dielectric
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Industry: Electronics
- Use Temperature: -40 to 248
- Compound Type: Thermally Conductive; Adhesive
- Thermal Conductivity: 6
from Hernon Manufacturing, Inc.
Supertacker ® 353 is a single component, high performance elastomeric adhesive that exhibits exceptional bonding characteristics to a broad range of materials including metals, glass, plastic composites, rubber, leather, wood and vinyl. Supertacker ® 353 provides a tough, waterproof bond... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Dow DOWSIL ™ 3-6635 Dielectric Gel Clear is a one component, heat curing, low temperature gel that is used to protect electrical components from extreme environments, moisture, and stress. It is flowable, low viscosity, durable, and self healing. 18.1 kg Pail. [See More]
- Industry: Electronics
- Cure / Technology: Single Component
- Compound Type: Encapsulant, Potting Compound
- Features: High Dielectric
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SE Series one-component Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 2.0 to 10.0 W/m ·K. ◆ High softness and compressibility, providing low assembly stress, ideal for... [See More]
- Industry: Electronics
- Type / Form: Gel
- Compound Type: Thermally Conductive; Adhesive
- Use Temperature: -58 to 302
from Hernon Manufacturing, Inc.
Supertacker ® 357 is a single component, high performance elastomeric adhesive that exhibits exceptional bonding characteristics to a broad range of materials including metals, glass, plastic composites, rubber, leather, wood and vinyl. Supertacker ® 357 provides a tough, waterproof bond... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Master Bond, Inc.
MasterSil 920-LO is an ideal material for the encapsulation of sensitive electronic and optical components, especially when low stress is a critical requirement. This neutral curing, non-corrosive, RTV silicone has very good flow properties and outstanding electrical insulation values, which enhance... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Dow DOWSIL ™ 6-1104 CV Sealant Clear is a one component, moisture curing, space grade silicone sealant that is used to increase performance, reliability, and safety of devices. It offers high elongation, non-flowing, no required mixing, and fast in-line processing. 142 g Tube. [See More]
- Industry: Electronics; Photonics
- Cure / Technology: Single Component
- Compound Type: Sealant
- Viscosity: 200000
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SE Series one-component Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 2.0 to 10.0 W/m ·K. ◆ High softness and compressibility, providing low assembly stress, ideal for... [See More]
- Industry: Electronics
- Type / Form: Gel
- Compound Type: Thermally Conductive; Adhesive
- Use Temperature: -58 to 302
from Hernon Manufacturing, Inc.
Hernon Dissipator 746D is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair provide... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Compound Type: Thermally Conductive; Adhesive
from Master Bond, Inc.
MasterSil 972TC-LO is capable of transferring heat with a thermal conductivity of 7-9 BTU •in/ft ² •hr • °F [1.01-1.30 W/(m •K)], while retaining superior dielectric properties. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Dow DOWSIL ™ EE-3200 Low Stress Silicone Encapsulant is a two component, low viscosity encapsulant with a 1:1 mix ratio, good heat dissipation, and good thermal conductivity. Once thoroughly mixed, the mixture will cure to a flexible elastomer for the protection of electronic and electrical... [See More]
- Industry: Automotive; Electronics
- Cure / Technology: Two Component
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 1400
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Industry: Electronics
- Use Temperature: -40 to 248
- Compound Type: Thermally Conductive; Adhesive
- Thermal Conductivity: 8
from Master Bond, Inc.
Master Bond MasterSil 705TC is a one component, thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It features outstanding thermal conductivity and is well suited for applications that require flexibility and high temperature resistance. It cures... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Compound Type: Sealant; Thermally Conductive; Adhesive
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ EE-3200 Low Stress Silicone Encapsulant is a two component, low viscosity encapsulant with a 1:1 mix ratio, good heat dissipation, and good thermal conductivity. Once thoroughly mixed, the mixture will cure to a flexible elastomer for the protection of electronic and electrical... [See More]
- Industry: Automotive; Electronics
- Cure / Technology: Two Component
- Compound Type: Encapsulant, Potting Compound
- Viscosity: 2000
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Industry: Electronics
- Use Temperature: -40 to 257
- Compound Type: Thermally Conductive; Adhesive
- Thermal Conductivity: 2
from Master Bond, Inc.
MasterSil 912Med is a single component silicone with a paste viscosity for bonding, sealing and coating medical devices. This non-corrosive, neutral cure compound complies with USP Class VI and ISO 10993-5 specifications. It resists many kinds of sterilization including gamma and other types of... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Sealant; Adhesive
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C,... [See More]
- Industry: Electronics; Semiconductors, IC's
- Cure / Technology: Single Component
- Compound Type: Encapsulant, Potting Compound; Sealant
- Features: High Dielectric
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SC Series Thermal Films are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 0.8 to 5.0 W/m ·K. ◆ Optional fiberglass or polyimide film can be used as the reinforcement carrier. ◆ High mechanical... [See More]
- Industry: Electronics
- Compound Type: Thermally Conductive; Adhesive
from Master Bond, Inc.
Low viscosity MasterSil 152 is a two component, optically clear silicone system that cures when exposed to air at room temperature. It has outstanding electrical insulation properties, making it ideal for potting and encapsulation applications. Additionally it features a long working life and has a... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Ellsworth Adhesives
Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 0.9 kg Kit. [See More]
- Industry: Electronics
- Cure / Technology: Two Component
- Compound Type: Encapsulant, Potting Compound; Sealant
- Features: High Dielectric
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AE Series one-component Silicone-free Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Free from siloxane and the risk of silicone oil bleed. ◆ Good thermal conductivity, available in options ranging from 1.0 to 3.0 W/m ·K. ◆... [See More]
- Industry: Electronics
- Type / Form: Gel
- Compound Type: Thermally Conductive; Adhesive
- Use Temperature: -58 to 248
from Master Bond, Inc.
Master Bond MasterSil 153AO is an addition cured two part silicone with a high tensile lap shear strength, thermal conductivity and electrical insulation. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Compound Type: Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 36.3 kg Kit. [See More]
- Industry: Electronics
- Cure / Technology: Two Component
- Compound Type: Encapsulant, Potting Compound; Sealant
- Features: High Dielectric
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Industry: Electronics
- Use Temperature: -40 to 248
- Compound Type: Thermally Conductive; Adhesive
- Thermal Conductivity: 5
from Master Bond, Inc.
Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9 BTU... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 7.2 kg Kit. [See More]
- Industry: Electronics
- Cure / Technology: Two Component
- Compound Type: Encapsulant, Potting Compound; Sealant
- Features: High Dielectric
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Industry: Electronics
- Use Temperature: -40 to 257
- Compound Type: Thermally Conductive; Adhesive
- Thermal Conductivity: 3
from Henkel Corporation - Electronics
Loctite ® Liquid Optically Clear Adhesives (LOCAs) for cover lens bonding, touch panel sensor assembly and direct bonding applications in touch panel and display devices including mobile phones, tablets, monitors, televisions and outdoor signage. [See More]
- Industry: Electronics
- Cure / Technology: UV or Radiation Cured
- Compound Type: Adhesive
- Elongation: 100.0
from Wacker Chemical Corp.
WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]
- Industry: Electronics
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
from Shenzhen DeepMaterial Technologies Co., Ltd
Used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. This product is usually used from -53°C to 204°C. [See More]
- Industry: Electronics
- Cure / Technology: UV or Radiation Cured; Reactive or Moisture Cured
from Aremco Products, Inc.
Hi-temp, prevents dusting of fibrous insulation materials [See More]
- Industry: Automotive; Electronics; OEM or Industrial; Oven & Furnace Applications
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Sealant
- Substrate Compatibility: Ceramic, Glass
from ThreeBond International, Inc.
Electrically Conductive Resins. These Electrically conductive resin can connect multiple electrical contacts simultaneously and make it possible to create an electrical connection in materials that cannot be soldered. They are electro-conductive resins made up of synthetic resin and a conductive... [See More]
- Industry: Automotive; Electronics
- Substrate Compatibility: Rubber or Elastomer
- Compound Type: Adhesive
- Composition: Filled
from Chemence Inc.
KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that when mixed will cure at room... [See More]
- Industry: Electronics
- Substrate Compatibility: Plastic
- Compound Type: Adhesive
- Cure / Technology: Single Component
from Phelps Industrial Products
Phelps Style 9815 is 100% RTV (room temperature vulcanizing) silicone that can be used anywhere a high temperature sealant/adhesive is required. This high temp silicone sealant builds a formed-in-place gasket at operating temperatures up to 310 °C. Phelps Style 9815 high temperature silicone... [See More]
- Industry: Electronics; Construction; OEM or Industrial
- Type / Form: Gel
- Compound Type: Sealant
- Substrate Compatibility: Ceramic, Glass; Metal
from Techsil Limited
MG Chemicals 422B is a silicone modified conformal coating which is a clear and flexible coating, ideal for protecting electronic circuits in high temperature environments or applications requiring extreme flexibility. It protects against moisture, dirt, dust, and other particulates thus avoiding... [See More]
- Industry: Electronics
from Bluestar Silicones USA Corp.
Clear, Two-Component, Addition Cure, Heat Curing Electronic coating Silicone Compound. Properties. Viscosity 6000. Hardness Sha 30. Description. BLUESIL V-207 is a clear, two component, addition cure, heat curing silicone rubber compound. It is designed as a primerless coating and encapsulating... [See More]
- Industry: Electronics
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound
- Cure / Technology: Thermoset; Two Component ; Reactive or Moisture Cured
from Epoxies Etc...
50-1225 is a low viscosity, room temperature curing, RTV silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package. [See More]
- Industry: Electronics
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
- Composition: Unfilled
from Shiu Li Technology Co., Ltd
LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Industry: Electronics
- Features: UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.1969
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
from Wacker Chemical Corp.
WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]
- Industry: Automotive; Electronics; Electric Power; Optical
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Aremco Products, Inc.
Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]
- Industry: Electronics
- Composition: Filled
- Compound Type: Encapsulant, Potting Compound
- Use Temperature: 900
from Techsil Limited
MG Chemicals 422B Silicone Conformal Coating is a clear and flexible aerosol coating that is ideal for protecting electronic circuits in high temperature environments or applications requiring extreme flexibility. It protects against moisture, dirt, dust, and other particulates thus avoiding... [See More]
- Industry: Electronics
from Epoxies Etc...
20-1615 is a two component, room temperature curing silicone rubber compound. This silicone system is clear, odorless, and low in viscosity. 20-1615 is an excellent choice for potting electronic assemblies that require shock and vibration resistance. It also protects assemblies from moisture, ozone,... [See More]
- Industry: Electronics
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound
- Composition: Unfilled
from Shiu Li Technology Co., Ltd
LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Industry: Electronics
- Features: UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.1969
from Protavic America, Inc.
PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]
- Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Type / Form: Gel
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
from Techsil Limited
MG Chemicals 422B is a silicone modified conformal coating which is a clear and flexible coating, ideal for protecting electronic circuits in high temperature environments or applications requiring extreme flexibility. It protects against moisture, dirt, dust, and other particulates thus avoiding... [See More]
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]
- Industry: Electronics
- Features: UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.1969
from Techsil Limited
Momentive CRTV5120 is a high performance, semi-conductive silicone adhesive. This one-part RTV offers fast cure and a resistivity of 200 - 800 ohm-cm. CRTV5120 offers a primerless adhesion to many metals, plastics and glass. This product is ideal for gaskets & seals for electronics that need EMI... [See More]
- Industry: Electronics
- Features: Electrically Conductive
- Compound Type: Adhesive
from Shiu Li Technology Co., Ltd
LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]
- Industry: Electronics
- Features: UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.1969
from Techsil Limited
RTV12 A is a clear, two component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep section without additional heating or moisture. RTV12 A is the base compound and requires a curing agent to be mixed with. For a clear product which allows... [See More]
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]
- Industry: Electronics
- Features: UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.1969
from Techsil Limited
RTV12 A is a clear, two component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep sections without additional heating or moisture. RTV12 A is the base compound and requires a curing agent to be mixed with. For a clear product which allows... [See More]
- Industry: Electronics
- Compound Type: Encapsulant, Potting Compound
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.3937
from Techsil Limited
RTV12 A is a clear, two component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep section without additional heating or moisture. RTV12 A is the base compound and requires a curing agent to be mixed with. For a clear product which allows... [See More]
- Industry: Electronics
- Compound Type: Encapsulant, Potting Compound
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.3937
from Techsil Limited
Momentive RTV160 is an electronic grade silicone adhesive sealant from Momentive Performance Materials. This material cures to a tough, resilient silicone rubber at room temperature. Product Benefits. Easy to use, one-component material. Cures at room temperature and ambient humidity. Offers... [See More]
- Industry: Electronics
- Use Temperature: -60 to 204
- Compound Type: Sealant
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0098 to 0.0177
from Techsil Limited
Momentive RTV162 is an electronic grade silicone adhesive sealant from Momentive Performance Materials. This material cures to a tough, resilient silicone rubber at room temperature. Product Benefits. Easy to use, one-component material. Cures at room temperature and ambient humidity. Offers... [See More]
- Industry: Electronics
- Use Temperature: -60 to 204
- Compound Type: Sealant
from Shiu Li Technology Co., Ltd
LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It ’s suitable for high power transistors, electrical equipment,... [See More]
- Industry: Electronics
- Features: UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0059
from Techsil Limited
Momentive RTV162 is an electronic grade silicone adhesive sealant from Momentive Performance Materials. This material cures to a tough, resilient silicone rubber at room temperature. Product Benefits. Easy to use, one-component material. Cures at room temperature and ambient humidity. Offers... [See More]
- Industry: Electronics
- Use Temperature: -60 to 204
- Compound Type: Sealant
from Shiu Li Technology Co., Ltd
LiPOLY ’s thermal insulator SH1500/2000/3000 uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 1.5/2.0/3.0 W/m*K, the thickness is 0.23~0.35mm. Its high... [See More]
- Industry: Electronics
- Features: UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0091 to 0.0138
from Techsil Limited
Momentive RTV162 is an electronic grade silicone adhesive sealant from Momentive Performance Materials. This material cures to a tough, resilient silicone rubber at room temperature. Product Benefits. Easy to use, one-component material. Cures at room temperature and ambient humidity. Offers... [See More]
- Industry: Electronics
- Use Temperature: -60 to 204
- Compound Type: Sealant
from Shiu Li Technology Co., Ltd
LiPOLY T-top81 is an ultra-soft, highly conformable, non-flammable interface material. T-top81 is a high deflection material, designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-top81... [See More]
- Industry: Electronics
- Features: UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.1969
from Techsil Limited
Momentive RTV167 is an electronic grade silicone adhesive sealant from Momentive Performance Materials. This material cures to a tough, resilient silicone rubber at room temperature. Product Benefits. Easy to use, one-component material. Cures at room temperature and ambient humidity. Offers... [See More]
- Industry: Electronics
- Use Temperature: -60 to 204
- Compound Type: Sealant
from Shiu Li Technology Co., Ltd
Our high thermally conductive gap filler T-work 7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink. [See More]
- Industry: Electronics
- Features: UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.1969
from Techsil Limited
Momentive RTV167 is an electronic grade silicone adhesive sealant from Momentive Performance Materials. This material cures to a tough, resilient silicone rubber at room temperature. Product Benefits. Easy to use, one-component material. Cures at room temperature and ambient humidity. Offers... [See More]
- Industry: Electronics
- Use Temperature: -60 to 204
- Compound Type: Sealant
from Shiu Li Technology Co., Ltd
LiPOLY T-work 8000 is a high performance thermally conductive interface pad. T-work 8000 offers outstanding thermal conductivity at 15.0 W/m*K and extremely low thermal resistance under minimal force. T-work 8000 offers excellent compression, filling small air gaps and uneven surfaces, ensuring an... [See More]
- Industry: Electronics
- Features: UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.1969
from Techsil Limited
Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber parts. Also suitable for... [See More]
- Industry: Electronics
- Use Temperature: -54 to 260
- Compound Type: Encapsulant, Potting Compound
from Shiu Li Technology Co., Ltd
LiPOLY T-work 9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work 9000 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]
- Industry: Electronics
- Features: UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.1969