Encapsulating / Potting Silicone Adhesives and Sealants
from Ellsworth Adhesives
Dow 3-4237 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for potting, sealing, encapsulating, and protecting electrical components from contaminants, moisture, and stress. It is durable, flexible, self healing, and offers long working times. [See More]
- Compound Type: Encapsulant, Potting Compound; Sealant
- Features: High Dielectric
- Cure / Technology: Two Component
- Industry: Electronics
from MacDermid Alpha Electronics Solutions
A thixotropic two-part silicone potting compound specifically crafted to safeguard LED drivers and a range of other components. Product Overview. SC4003 is a thixotropic two-part silicone potting and encapsulating resin designed for the Indian market. Primarily developed for the protection of LED... [See More]
- Compound Type: Encapsulant, Potting Compound
- Industry: Electronics; Semiconductors, IC's
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4150 Dielectric Gel Clear-Green is a two component, fast room temperature curing, silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers flexibility, stress relief, and offers excellent... [See More]
- Compound Type: Encapsulant, Potting Compound; Sealant
- Features: High Dielectric
- Cure / Technology: Two Component
- Viscosity: 480
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Composition: Filled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Cure / Technology: Thermoset; Two Component ; Addition Cure
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4155 HV Dielectric Gel Clear-Green is a two component, high viscosity, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It cures quickly at room temperature, offers flexibility, thermal stability,... [See More]
- Compound Type: Encapsulant, Potting Compound
- Features: High Dielectric
- Cure / Technology: Two Component
- Industry: Electric Power
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Type / Form: Liquid
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4207 Dielectric Tough Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has good... [See More]
- Compound Type: Encapsulant, Potting Compound
- Features: High Dielectric
- Cure / Technology: Two Component
- Viscosity: 425
from Master Bond, Inc.
Passing both USP Class VI testing and ISO cytotoxicity specifications, MasterSil 910Med is formulated for bonding, sealing, coating in medical device applications. As an acetoxy type system, it bonds exceptionally well to a wide variety of substrates including metals, composites, ceramics, glass as... [See More]
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Composition: Unfilled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Cure / Technology: Thermoset; Single Component
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4207 Dielectric Tough Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has good... [See More]
- Compound Type: Encapsulant, Potting Compound
- Features: High Dielectric
- Cure / Technology: Two Component
- Industry: Electronics
from Master Bond, Inc.
Master Bond MasterSil 323 is a two component, addition cured system for bonding, sealing and potting applications. [See More]
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Features: Flexible; High Dielectric; Non-corrosive
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4207 Dielectric Tough Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has good... [See More]
- Compound Type: Encapsulant, Potting Compound
- Features: High Dielectric
- Cure / Technology: Two Component
- Industry: Electronics
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Composition: Filled
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has excellent... [See More]
- Compound Type: Encapsulant, Potting Compound
- Features: High Dielectric
- Cure / Technology: Two Component
- Viscosity: 325
from Master Bond, Inc.
MasterSil 920-LO is an ideal material for the encapsulation of sensitive electronic and optical components, especially when low stress is a critical requirement. This neutral curing, non-corrosive, RTV silicone has very good flow properties and outstanding electrical insulation values, which enhance... [See More]
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has excellent... [See More]
- Compound Type: Encapsulant, Potting Compound
- Features: High Dielectric
- Cure / Technology: Two Component
- Industry: Electronics
from Master Bond, Inc.
MasterSil 972TC-LO is capable of transferring heat with a thermal conductivity of 7-9 BTU •in/ft ² •hr • °F [1.01-1.30 W/(m •K)], while retaining superior dielectric properties. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics... [See More]
- Compound Type: Encapsulant, Potting Compound; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has excellent... [See More]
- Compound Type: Encapsulant, Potting Compound
- Features: High Dielectric
- Cure / Technology: Two Component
- Industry: Electronics
from Master Bond, Inc.
Low viscosity MasterSil 152 is a two component, optically clear silicone system that cures when exposed to air at room temperature. It has outstanding electrical insulation properties, making it ideal for potting and encapsulation applications. Additionally it features a long working life and has a... [See More]
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Type / Form: Liquid
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4241 Dielectric Tough Gel Clear-Green is a two component, heat curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, flame resistant, long working... [See More]
- Compound Type: Encapsulant, Potting Compound
- Features: High Dielectric
- Cure / Technology: Two Component
- Viscosity: 400
from Master Bond, Inc.
Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9 BTU... [See More]
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4241 Dielectric Tough Gel Clear-Green is a two component, heat curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, flame resistant, long working... [See More]
- Compound Type: Encapsulant, Potting Compound
- Features: High Dielectric
- Cure / Technology: Two Component
- Industry: Electronics
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4680 Silicone Gel Clear-Blue is a two component, room temperature curing, low viscosity, dielectric gel that is used for potting, sealing, encapsulating, and protecting electrical components from contaminants, moisture, and stress. It is durable, flexible, and fast curing. 1:1... [See More]
- Compound Type: Encapsulant, Potting Compound; Sealant
- Viscosity: 275
- Cure / Technology: Two Component
- Dielectric Strength: 406
from Ellsworth Adhesives
Dow DOWSIL ™ 3-6121 Low Temperature Elastomer Clear is a two component, room to high temperature curing, silicone encapsulant that is used to protect electrical components from contaminants, moisture, and stress. It is fast curing, flowable, tear resistant, and has high tensile strength. 10:1... [See More]
- Compound Type: Encapsulant, Potting Compound; Sealant
- Viscosity: 19250
- Cure / Technology: Two Component
- Thermal Conductivity: 0.1900
from Ellsworth Adhesives
Dow DOWSIL ™ 3-6635 Dielectric Gel Clear is a one component, heat curing, low temperature gel that is used to protect electrical components from extreme environments, moisture, and stress. It is flowable, low viscosity, durable, and self healing. 18.1 kg Pail. [See More]
- Compound Type: Encapsulant, Potting Compound
- Features: High Dielectric
- Cure / Technology: Single Component
- Industry: Electronics
from OMEGA Engineering, Inc.
OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Cure / Technology: Single Component
- Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
- Features: High Dielectric
from Chemence Inc.
KSC12028 is a silicone RTV gel developed for electronic applications requiring a re-penetrable self-sealing, silicone gel product. KSC12028 is a two part, solvent free, 1:1 mix ratio silicone that when mixed cures in 12 hours at room temperature. Alternatively, KSC12028 can be cured in approximately... [See More]
- Compound Type: Encapsulant, Potting Compound; Adhesive
- Substrate Compatibility: Metal; Plastic
- Type / Form: Gel
- Cure / Technology: Single Component
from Bluestar Silicones USA Corp.
Clear, Two-Component, Addition Cure, Heat Curing Electronic coating Silicone Compound. Properties. Viscosity 6000. Hardness Sha 30. Description. BLUESIL V-207 is a clear, two component, addition cure, heat curing silicone rubber compound. It is designed as a primerless coating and encapsulating... [See More]
- Compound Type: Encapsulant, Potting Compound
- Cure / Technology: Thermoset; Two Component ; Reactive or Moisture Cured
- Type / Form: Liquid
- Industry: Electronics
from Wacker Chemical Corp.
WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
- Industry: Electronics
from Techsil Limited
LOCTITE ® 595 is for superior bonding and sealing properties to most surfaces (although not recommended for use on concrete). This product resists aging weathering and thermal cycling without having adverse reactions such as hardening, shrinking or cracking. The thixotropic nature of LOCTITE... [See More]
- Compound Type: Encapsulant, Potting Compound
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Type / Form: Liquid
- Composition: Unfilled
from Shiu Li Technology Co., Ltd
LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures. [See More]
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Epoxies Etc...
50-1225 is a low viscosity, room temperature curing, RTV silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package. [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
- Composition: Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Henkel Corporation - Industrial
BERGQUIST GAP PAD TGP 7000ULM, Thermally conductive soft gap filling material, For high performance applications. BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications... [See More]
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Thermally Conductive
- Use Temperature: 140 to 392
from Aremco Products, Inc.
Hi-temp, prevents dusting of fibrous insulation materials [See More]
- Compound Type: Encapsulant, Potting Compound; Sealant
- Substrate Compatibility: Ceramic, Glass
- Type / Form: Liquid
- Composition: Filled
from OMEGA Engineering, Inc.
OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Features: High Dielectric
- Cure / Technology: Single Component
- Use Temperature: 392
from Wacker Chemical Corp.
GENIOSIL® WP1 is a polyether-based silane-terminated polymer suitable asbinder in moisture curing formulations. It is a clear liquid with a slight but characteristic odor and differs to conventional silylated polymers due to its high reactivity. This is a direct consequence of the structural... [See More]
- Compound Type: Encapsulant, Potting Compound; Sealant
- Cure / Technology: Two Component
- Type / Form: Liquid
- Industry: Construction
from Techsil Limited
Momentive RTV11 is a general purpose silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electrical coils and connectors, alongside making cast-in-place gaskets and moulds. RTV11 is supplied ready-to-use with DBT as the... [See More]
- Compound Type: Encapsulant, Potting Compound
- Use Temperature: -54 to 204
- Industry: Sanitary
from Protavic America, Inc.
PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Type / Form: Gel
- Composition: Filled
from Epoxies Etc...
20-1615 is a two component, room temperature curing silicone rubber compound. This silicone system is clear, odorless, and low in viscosity. 20-1615 is an excellent choice for potting electronic assemblies that require shock and vibration resistance. It also protects assemblies from moisture, ozone,... [See More]
- Compound Type: Encapsulant, Potting Compound
- Composition: Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Aremco Products, Inc.
Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]
- Compound Type: Encapsulant, Potting Compound
- Industry: Electronics
- Composition: Filled
- Use Temperature: 900
from Wacker Chemical Corp.
GENIOSIL® XT 50 is a silicone-modified polyetherbasedsilane-terminated polymer suitable as a binderin moisture curing formulations. It is a clear liquid witha slight but characteristic odor and differs toconventional silylated polymers due to its highreactivity. This is a direct consequence of the... [See More]
- Compound Type: Encapsulant, Potting Compound
- Substrate Compatibility: Concrete, Masonry
- Type / Form: Liquid
- Cure / Technology: Two Component (optional feature); Single Component; Reactive or Moisture Cured
from Techsil Limited
Momentive RTV11 is a general purpose silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electrical coils and connectors, alongside making cast-in-place gaskets and moulds. RTV11 is supplied ready-to-use with DBT as the... [See More]
- Compound Type: Encapsulant, Potting Compound
- Use Temperature: -54 to 204
- Industry: Sanitary
from Wacker Chemical Corp.
WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]
- Compound Type: Encapsulant, Potting Compound
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Features: Flexible; Flame Retardant
from Techsil Limited
Momentive RTV11 is a general purpose silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electrical coils and connectors, alongside making cast-in-place gaskets and moulds. RTV11 is supplied ready-to-use with DBT as the... [See More]
- Compound Type: Encapsulant, Potting Compound
- Use Temperature: -54 to 204
- Industry: Sanitary
from Techsil Limited
RTV12 A is a clear, two component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep sections without additional heating or moisture. RTV12 A is the base compound and requires a curing agent to be mixed with. For a clear product which allows... [See More]
- Compound Type: Encapsulant, Potting Compound
- Industry: Electronics
from Techsil Limited
RTV12 A is a clear, two component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep section without additional heating or moisture. RTV12 A is the base compound and requires a curing agent to be mixed with. For a clear product which allows... [See More]
- Compound Type: Encapsulant, Potting Compound
- Industry: Electronics
from Techsil Limited
Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber parts. Also suitable for... [See More]
- Compound Type: Encapsulant, Potting Compound
- Use Temperature: -54 to 260
- Industry: Electronics
from Techsil Limited
Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber parts. Also suitable for... [See More]
- Compound Type: Encapsulant, Potting Compound
- Use Temperature: -54 to 260
- Industry: Electronics
from Techsil Limited
Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber parts. Also suitable for... [See More]
- Compound Type: Encapsulant, Potting Compound
- Use Temperature: -54 to 260
from Techsil Limited
RTV560 is a silicone rubber compound from Momentive Performance Materials. It offers excellent release properties and also good adhesion capabilities with the use of a primer. This grade with cure at room temperature and retains its elastomeric properties across a wide temperature range. RTV560 is... [See More]
- Compound Type: Encapsulant, Potting Compound
- Use Temperature: -115 to 260
- Industry: Electronics
from Techsil Limited
RTV560 is a silicone rubber compound from Momentive Performance Materials. It offers excellent release properties and also good adhesion capabilities with the use of a primer. This grade with cure at room temperature and retains its elastomeric properties across a wide temperature range. RTV560 is... [See More]
- Compound Type: Encapsulant, Potting Compound
- Use Temperature: -115 to 260
- Industry: Electronics
from Techsil Limited
Momentive RTV566 is a two-part silicone rubber compound processed and tested for applications where low outgassing is required. Supplied as a kit with RTV566 A (base compound) and RTV566 B (curing agent). Product Benefits. Room temperature cure. Excellent release properties. Provides low outgassing... [See More]
- Compound Type: Encapsulant, Potting Compound
- Use Temperature: -115 to 260
from Techsil Limited
DETAILS. RTV577 is a low temperature silicone rubber compound from Momentive Performance Materials. It offers excellent release properties and also good adhesion capabilities with the use of a primer. This grade with cure at room temperature and retains its elastomeric properties across a wide... [See More]
- Compound Type: Encapsulant, Potting Compound
- Use Temperature: -115 to 204
from Techsil Limited
Momentive RTV60 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber parts. Also suitable for... [See More]
- Compound Type: Encapsulant, Potting Compound
- Use Temperature: -54 to 260