OEM / Industrial Silicone Adhesives and Sealants
from RS Components, Ltd.
MG Silicone Conformal coating 340g [See More]
- Industry: Aerospace; Electronics; OEM or Industrial; Aerospace, Air Bag Controllers, Automobile, Aviation, Communication, Consumer Electronics Industries, Electric Generators, Industrial Control Equip
- Use Temperature: -40 to 392
from Hernon Manufacturing, Inc.
Silastomer ® 333 is a high performance, single component, ready to use adhesive / sealant. It has a paste-like consistency, which cures to a tough, resilient and durable silicone rubber when exposed to moisture in the air. Since it will not flow of its own weight, Silastomer ® 333 can be... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from CHT USA Inc.
CHT ’s TufGel 336 is a 2-part, tough, black silicone gel designed for electronic potting applications to provide protection from moisture, vibration and thermal or mechanical shock. TufGel 336 can also function as a contrast enhancement material in LED applications. TufGel 336 is also flame... [See More]
- Industry: Automotive; Electronics; OEM or Industrial
- Cure / Technology: Two Component ; Addition
- Type / Form: Gel
- Features: Flame Retardant
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from RS Components, Ltd.
Produit detancheite pour moule [See More]
- Industry: OEM or Industrial; Industrial
- Compound Type: Sealant
from Hernon Manufacturing, Inc.
Silastomer ® 334 is a high performance, single component, ready to use adhesive / sealant. It has a paste-like consistency, which cures to a tough, resilient and durable silicone rubber when exposed to moisture in the air. Since it will not flow of its own weight, Silastomer ® 334 can be... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Composition: Filled
from RS Components, Ltd.
Silcoset 152 Silicone Sealant 75ml [See More]
- Industry: OEM or Industrial; Industrial
- Use Temperature: -76 to 572
- Compound Type: Sealant
from Hernon Manufacturing, Inc.
Silastomer ® 336 is a high performance, single component, acetoxy, ready to use silicone. It has a paste-like consistency, which cures to a tough, resilient and durable silicone rubber when exposed to moisture in the air. Since it will not flow of its own weight, Silastomer ® 336 can be... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Industry: Aerospace; Electronics; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from RS Components, Ltd.
Silcoset 152 Silicone Sealant 310ml [See More]
- Industry: OEM or Industrial; Industrial
- Use Temperature: -76 to 572
- Compound Type: Sealant
from Hernon Manufacturing, Inc.
Silastomer ® 343 is a black, high performance, single component, ready to use adhesive / sealant. It has a paste-like consistency, which cures to a tough, resilient and durable silicone rubber when exposed to moisture in the air. Designed to provide excellent oil resistance and can be used as a... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Master Bond, Inc.
Passing both USP Class VI testing and ISO cytotoxicity specifications, MasterSil 910Med is formulated for bonding, sealing, coating in medical device applications. As an acetoxy type system, it bonds exceptionally well to a wide variety of substrates including metals, composites, ceramics, glass as... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Composition: Unfilled
from RS Components, Ltd.
Silcoset 153 Silicone Sealant 75ml [See More]
- Industry: OEM or Industrial; Industrial
- Use Temperature: -76 to 482
- Compound Type: Sealant
from Hernon Manufacturing, Inc.
Supertacker ® 351 is a single component, high performance elastomeric adhesive that exhibits exceptional bonding characteristics to a broad range of materials including metals, glass, plastic composites, rubber, leather, wood and vinyl. Supertacker ® 351 provides a tough, waterproof bond... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Master Bond, Inc.
Master Bond MasterSil 323 is a two component, addition cured system for bonding, sealing and potting applications. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
Silcoset 153 Silicone Sealant 310ml [See More]
- Industry: OEM or Industrial; Industrial
- Use Temperature: -76 to 482
- Compound Type: Sealant
from Hernon Manufacturing, Inc.
Supertacker ® 353 is a single component, high performance elastomeric adhesive that exhibits exceptional bonding characteristics to a broad range of materials including metals, glass, plastic composites, rubber, leather, wood and vinyl. Supertacker ® 353 provides a tough, waterproof bond... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Master Bond, Inc.
MasterSil 930 is an acetoxy type fluorosilicone for bonding, sealing and coating. Its most prominent feature is excellent chemical resistance, particularly to fuels, oils and solvents when compared to more standard silicones. Some of the chemicals that this product can withstand better than... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Sealant; Adhesive
- Composition: Unfilled
from Hernon Manufacturing, Inc.
Supertacker ® 357 is a single component, high performance elastomeric adhesive that exhibits exceptional bonding characteristics to a broad range of materials including metals, glass, plastic composites, rubber, leather, wood and vinyl. Supertacker ® 357 provides a tough, waterproof bond... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component
- Compound Type: Adhesive
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Sanitary; Photonics; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Hernon Manufacturing, Inc.
Hernon Dissipator 746D is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair provide... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Compound Type: Thermally Conductive; Adhesive
from Master Bond, Inc.
MasterSil 920-LO is an ideal material for the encapsulation of sensitive electronic and optical components, especially when low stress is a critical requirement. This neutral curing, non-corrosive, RTV silicone has very good flow properties and outstanding electrical insulation values, which enhance... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
MasterSil 972TC-LO is capable of transferring heat with a thermal conductivity of 7-9 BTU •in/ft ² •hr • °F [1.01-1.30 W/(m •K)], while retaining superior dielectric properties. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Wacker Chemical Corp.
ELASTOSIL ® RT 2100 is a room temperature vulcanizing silicone rubber. It is. especially useful for electrical insulation applications such as potting, encapsulating, embedding, sealing and environmental protection. ELASTOSIL ® RT 2100 is simple to handle and offers a balanced property... [See More]
- Industry: OEM or Industrial
- Type / Form: Gel
- Compound Type: Adhesive
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
from Aremco Products, Inc.
Hi-temp, low viscosity, easy to use, offered in alternative pigments [See More]
- Industry: Automotive; OEM or Industrial; Bonding Fiberoptic Strands
- Substrate Compatibility: Fiberoptics
- Compound Type: Sealant; Adhesive
- Composition: Unfilled
from CoorsTek
CoorsTek understands ceramic-to-metal bonding and offers a diverse product portfolio of Durall ™ adhesive products. Our industrial bonding experts will help you select the best adhesive for your specific wear application to ensure long-lasting bonds and reduced downtime for critical material... [See More]
- Industry: OEM or Industrial; Material Handling
- Type / Form: Gel; Liquid
- Compound Type: Adhesive
- Substrate Compatibility: Ceramic, Glass; Metal
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® GAP FILLER TGF 3500LVO is a silicone, two-component, high thermal conductivity, liquid gap filler. This product offers the mechanical property benefits of a silicone material with the additional feature of low outgassing. It can be used in industries ranging from automotive to... [See More]
- Industry: OEM or Industrial
- Type / Form: Liquid
- Compound Type: Thermally Conductive; Adhesive
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.3937
from Hapco, Inc.
Hapsil 360 ™ is a high tear strength, tin-catalyzed RTV-2 silicone rubber, which was designed for casting Hapco's wide variety of rigid and flexible polyurethane resins. Hapsil 360 ™ is not sensitive to inhibition, meaning it will cure at room temperature over virtually any surface. [See More]
- Industry: OEM or Industrial; Tooling
- Type / Form: Liquid
- Compound Type: Sealant; Adhesive
- Composition: Unfilled
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
from Chemence Inc.
KS130 is a fast curing silicone RTV adhesive rubber developed for the bonding of "difficult to bond" plastics like Tygon ™.KS130 is a one part silicone that when applied to the substrate enables handling of the bonded assembly within an hour. When cured, the elastomer resists weathering,... [See More]
- Industry: OEM or Industrial
- Substrate Compatibility: Plastic
- Compound Type: Adhesive
- Cure / Technology: Single Component
from Phelps Industrial Products
Phelps Style 9815 is 100% RTV (room temperature vulcanizing) silicone that can be used anywhere a high temperature sealant/adhesive is required. This high temp silicone sealant builds a formed-in-place gasket at operating temperatures up to 310 °C. Phelps Style 9815 high temperature silicone... [See More]
- Industry: Electronics; Construction; OEM or Industrial
- Type / Form: Gel
- Compound Type: Sealant
- Substrate Compatibility: Ceramic, Glass; Metal
from Wacker Chemical Corp.
WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]
- Industry: OEM or Industrial
- Type / Form: Liquid
- Compound Type: Sealant; Adhesive
- Cure / Technology: Thermoset
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® GAP PAD TGP 10000ULM is an extremely soft gap filling material rated at a thermal conductivity of 10.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the... [See More]
- Industry: OEM or Industrial
- Use Temperature: -76 to 392
- Compound Type: Thermally Conductive; Adhesive
- Thermal Conductivity: 10
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.3937
from Protavic America, Inc.
PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]
- Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Type / Form: Gel
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
from Phelps Industrial Products
Phelps Style 9816 is 100% silicone sealant. This product can be used for gasketing and as an adhesive, and sticks to metal and glass surfaces. For best results clean with a solvent such as xylol, toluol or methyl ethyl ketone. Phelps Silicone Sealant exhibits high degree of flexibility without... [See More]
- Industry: Construction; OEM or Industrial
- Type / Form: Gel
- Compound Type: Sealant
- Composition: Unfilled
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® GAP PAD TGP 5000 is a silicone based, thermally conductive, fiberglass reinforced and S-class soft gap pad. Its highly conformable nature and S-class softness ensures that it conforms to demanding contours and maintains structural integrity. Fiberglass reinforcement provides... [See More]
- Industry: OEM or Industrial
- Use Temperature: -76 to 392
- Compound Type: Thermally Conductive; Adhesive
- Thermal Conductivity: 5
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0098 to 0.0177
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique... [See More]
- Industry: OEM or Industrial
- Use Temperature: -76 to 392
- Compound Type: Thermally Conductive; Adhesive
from Shiu Li Technology Co., Ltd
LiPOLY T-top99-s offers outstanding thermal conductivity at 24.0 W/m*K and extremely low thermal resistance under minimal force.T-top99-s offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.3937
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® LIQUI FORM TLF 6000HG thermally conductive gel interface material is designed to meet the demanding requirements in certain telecom market applications. Its unique formulation assures a balanced mix of high thermal conductivity, good dispensing efficiency and high thermal... [See More]
- Industry: OEM or Industrial
- Type / Form: Gel
- Compound Type: Thermally Conductive; Adhesive
from Shiu Li Technology Co., Ltd
LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Shiu Li Technology Co., Ltd
LiPOLY S-putty5-s is a one-part dispensable material with thermal conductivity 10.0 W/m*K. It also can overcome overflow and drying problems to increase the thermal conductivity. S-putty5-s is a great alternative to thermal grease and ideally suited for dispensing using the dispensing robot. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
- Viscosity: 2.00E7
- Compound Type: Sealant; Thermally Conductive
- Use Temperature: -76 to 356
from Shiu Li Technology Co., Ltd
LiPOLY TEM96D is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermalconductivity of 5.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; EMI/RFI Shielding; Laminaes; UL Rating
- Compound Type: Sealant; Thermally Conductive
- Gap Fill: 0.0197 to 0.3937
from Shiu Li Technology Co., Ltd
LiPOLY HC-93 is a stereoscopic thermal conductive silicone rubber cap as substrate through a special production process. Due to its excellent characteristic of high thermal conductivity, insulation, shockproof and convenient assembly, it is widely used in heat transistor refer to TO220 / TO3P,... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Rubber or Elastomer
- Compound Type: Sealant; Thermally Conductive
- Features: High Dielectric; Laminaes; UL Rating
from Shiu Li Technology Co., Ltd
LiPOLY SP is a stereoscopic thermal conductive silicone rubber cap as substrate through a special production process. Due to its excellent characteristic of high thermal conductivity, insulation, shockproof and convenient assembly, it is widely used in heat transistor refer to TO220 / TO3P, diode,... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Rubber or Elastomer
- Compound Type: Sealant; Thermally Conductive
- Features: High Dielectric; Laminaes; UL Rating