Thermal Compound / Heat Conductive Silicone Adhesives and Sealants
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SE Series two-component Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 2.0 to 8.0 W/m ·K. ◆ Soft and elastic after curing, maintaining the required thickness and providing... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Industry: Electronics
- Type / Form: Gel
- Use Temperature: -58 to 302
from CHT USA Inc.
CHT's AS1707 is a 1-part, alkoxy cured, thermally conductive, low volatile, RTV silicone adhesive paste. AS1707 is formulated to meet the requirements for use as a space grade adhesive. AS1707 has low thermal outgassing properties and a wide operational temperature range. In addition to meeting... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Features: Flame Retardant; UL Rating
- Cure / Technology: Single Component; Alkoxy
- Industry: Automotive; Electronics
from Hernon Manufacturing, Inc.
Hernon Dissipator 746D is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair provide... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Room Temperature Vulcanizing or Curing
from MacDermid Alpha Electronics Solutions
Enhanced flow properties aid potting of tight units and delicate electronics with effective heat dissipation and thermal performance. Product Overview. SC4004 is a thixotropic silicone potting compound developed for the Indian electronics market. Its thixotropic nature provides excellent flow... [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
- Industry: Electronics; Semiconductors, IC's
from Ellsworth Adhesives
Bergquist Liqui-Bond SA 1800 is a one component, thermally conductive silicone adhesive that is used for structural bonding applications that are exposed to extreme environments. It offers high thermal conductivity and low viscosity for ease of stenciling or screening. 1 gal Pail. [See More]
- Compound Type: Thermally Conductive; Adhesive
- Viscosity: 125000
- Cure / Technology: Single Component
- Thermal Conductivity: 1.8
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Composition: Unfilled
from RS Components, Ltd.
Thermal Putty with EMI, 2.0 W/m K, 55ml [See More]
- Compound Type: Leveling Filling; Sealant; Thermally Conductive
- Thermal Conductivity: 2
- Use Temperature: -58 to 392
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's TIV800 Series RTV Thermal Conductive Adhesive are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 1.0 to 2.0 W/m ·K. ◆ High bonding performance. ◆ Good stability, long-term high... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Use Temperature: -58 to 392
- Industry: Electronics
- Thermal Conductivity: 1.5
from Ellsworth Adhesives
Bergquist Liqui-Bond SA 2000 is a one component, thermally conductive silicone adhesive that is used for structural bonding applications that are exposed to extreme environments. It cures at elevated temperatures and has excellent mechanical and chemical stability. 600 cc Cartridge. [See More]
- Compound Type: Thermally Conductive; Adhesive
- Viscosity: 200000
- Cure / Technology: Single Component
- Thermal Conductivity: 2
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Composition: Filled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Cure / Technology: Thermoset; Two Component ; Addition Cure
from RS Components, Ltd.
Thermal Putty, 2.0 W/m K, 55ml [See More]
- Compound Type: Leveling Filling; Sealant; Thermally Conductive
- Thermal Conductivity: 2
- Use Temperature: -58 to 392
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SC Series Thermal Films are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 0.8 to 5.0 W/m ·K. ◆ Optional fiberglass or polyimide film can be used as the reinforcement carrier. ◆ High mechanical... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Use Temperature: -58 to 392
- Industry: Electronics
- Thermal Conductivity: 3.5
from Ellsworth Adhesives
Henkel Loctite STYCAST 5952 Red, formerly Emerson and Cuming, is a two component, addition cured, filled silicone encapsulant that is used for encapsulating electronic components that generate heat such as sensors, transformers, and power supplies. It is non-corrosive, reversion resistant, and has... [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
- Viscosity: 40000 to 65000
- Cure / Technology: Two Component
- Thermal Conductivity: 0.8500
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Type / Form: Liquid
- Composition: Unfilled
from RS Components, Ltd.
Thermal Putty [See More]
- Compound Type: Leveling Filling; Sealant; Thermally Conductive
- Thermal Conductivity: 2
- Use Temperature: -40 to 392
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SC Series Thermal Films are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 0.8 to 5.0 W/m ·K. ◆ Optional fiberglass or polyimide film can be used as the reinforcement carrier. ◆ High mechanical... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Use Temperature: -58 to 392
- Industry: Electronics
- Thermal Conductivity: 0.9000
from Ellsworth Adhesives
Henkel Loctite STYCAST 5952 White, formerly Emerson and Cuming, is a two component, addition cured, filled silicone encapsulant that is used for encapsulating electronic components that generate heat such as sensors, transformers, and power supplies. It is non-corrosive, reversion resistant, and has... [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
- Viscosity: 18000 to 40000
- Cure / Technology: Two Component
- Thermal Conductivity: 0.8500
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Composition: Filled
from RS Components, Ltd.
Thermal Putty [See More]
- Compound Type: Leveling Filling; Sealant; Thermally Conductive
- Thermal Conductivity: 3
- Use Temperature: -40 to 392
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Use Temperature: -40 to 248
- Industry: Electronics
- Thermal Conductivity: 6
from Ellsworth Adhesives
Henkel Loctite STYCAST 5954 Red Silicone Encapsulant, formerly Emerson and Cuming, is a two component, highly filled silicone that is used for encapsulating heat generating electronic components such as sensors, power supplies, and transformers. It has very high thermal conductivity, excellent... [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
- Viscosity: 35000 to 55000
- Cure / Technology: Two Component
- Thermal Conductivity: 1.15
from Master Bond, Inc.
MasterSil 972TC-LO is capable of transferring heat with a thermal conductivity of 7-9 BTU •in/ft ² •hr • °F [1.01-1.30 W/(m •K)], while retaining superior dielectric properties. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics... [See More]
- Compound Type: Encapsulant, Potting Compound; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Composition: Unfilled
from RS Components, Ltd.
Thermal Putty [See More]
- Compound Type: Leveling Filling; Sealant; Thermally Conductive
- Thermal Conductivity: 5
- Use Temperature: -40 to 392
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SE Series one-component Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 2.0 to 10.0 W/m ·K. ◆ High softness and compressibility, providing low assembly stress, ideal for... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Industry: Electronics
- Type / Form: Gel
- Use Temperature: -58 to 302
from Ellsworth Adhesives
Henkel Loctite STYCAST 5954 Red Silicone Encapsulant, formerly Emerson and Cuming, is a two component, addition cured, highly filled, silicone encapsulant that is used for encapsulating electronic components that generate heat such as sensors, transformers, and power supplies. It is non-corrosive,... [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
- Viscosity: 35000 to 55000
- Cure / Technology: Two Component
- Thermal Conductivity: 1.15
from Master Bond, Inc.
Master Bond MasterSil 705TC is a one component, thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It features outstanding thermal conductivity and is well suited for applications that require flexibility and high temperature resistance. It cures... [See More]
- Compound Type: Sealant; Thermally Conductive; Adhesive
- Composition: Unfilled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
Thermal Putty [See More]
- Compound Type: Leveling Filling; Sealant; Thermally Conductive
- Thermal Conductivity: 7
- Use Temperature: -58 to 392
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SE Series one-component Thermal Gel are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 2.0 to 10.0 W/m ·K. ◆ High softness and compressibility, providing low assembly stress, ideal for... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Industry: Electronics
- Type / Form: Gel
- Use Temperature: -58 to 302
from Ellsworth Adhesives
Henkel Loctite STYCAST 5954 White Silicone Encapsulant, formerly Emerson and Cuming, is a two component, highly filled silicone that is used for encapsulating heat generating electronic components such as sensors, power supplies, and transformers. It has very high thermal conductivity, excellent... [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
- Viscosity: 15000 to 35000
- Cure / Technology: Two Component
- Thermal Conductivity: 1.15
from Master Bond, Inc.
Master Bond MasterSil 153AO is an addition cured two part silicone with a high tensile lap shear strength, thermal conductivity and electrical insulation. [See More]
- Compound Type: Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Use Temperature: -40 to 248
- Industry: Electronics
- Thermal Conductivity: 8
from Ellsworth Adhesives
Henkel Loctite STYCAST 5954 White Silicone Encapsulant, formerly Emerson and Cuming, is a two component, addition cured, highly filled, silicone encapsulant that is used for encapsulating electronic components that generate heat such as sensors, transformers, and power supplies. It is non-corrosive,... [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
- Viscosity: 15000 to 35000
- Cure / Technology: Two Component
- Thermal Conductivity: 1.15
from Master Bond, Inc.
Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9 BTU... [See More]
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Type / Form: Liquid
- Composition: Unfilled
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m ·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Use Temperature: -40 to 257
- Industry: Electronics
- Thermal Conductivity: 2
from Ellsworth Adhesives
Parker Lord CoolTherm ® SC-309 is a two component, thermally conductive silicone encapsulant that is used for electrical/electronic encapsulating applications. It provides low stress on components, environmental resistance, and excellent flame retardancy. Hardener, 1 gal Pail. [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
- Thermal Conductivity: 0.9000
- Cure / Technology: Two Component
- Tensile (Break): 50
from Master Bond, Inc.
MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the aerospace, electronic,... [See More]
- Compound Type: Sealant; Thermally Conductive; Adhesive
- Composition: Unfilled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SC Series Thermal Films are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 0.8 to 5.0 W/m ·K. ◆ Optional fiberglass or polyimide film can be used as the reinforcement carrier. ◆ High mechanical... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Industry: Electronics
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Type / Form: Liquid
- Composition: Unfilled
from Shiu Li Technology Co., Ltd
LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Compound Type: Sealant; Thermally Conductive
- Industry: Electronics
- Features: UL Rating
- Gap Fill: 0.0197 to 0.1969
from Techsil Limited
TSE3281-G is a thermally conductive silicone adhesive from Momentive Performance Materials. This one component material is non-corrosive and has excellent adhesion properties to a wide variety of substrates. Potential applications for TSE3281-G include sealing and bonding for thermally conductive... [See More]
- Compound Type: Sealant; Thermally Conductive
- Industry: Electronics
from Wacker Chemical Corp.
WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
- Industry: Electronics
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® GAP FILLER TGF 3500LVO is a silicone, two-component, high thermal conductivity, liquid gap filler. This product offers the mechanical property benefits of a silicone material with the additional feature of low outgassing. It can be used in industries ranging from automotive to... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Cure / Technology: Thermoset
- Type / Form: Liquid
- Industry: OEM or Industrial
from Henkel Corporation - Industrial
BERGQUIST GAP PAD TGP 1350, Highly Conformable, Thermally Conductive, Reworkable Gap Filling Material. BERGQUIST ® GAP PAD TGP 1350 is a highly compliant Gap Pad material that is ideal for fragile component leads. The material includes a PEN film, which facilitates rework and improves puncture... [See More]
- Compound Type: Leveling Filling; Thermally Conductive; Adhesive
from OMEGA Engineering, Inc.
OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Cure / Technology: Single Component
- Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
- Features: High Dielectric
from Epoxies Etc...
50-1225 is a low viscosity, room temperature curing, RTV silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package. [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
- Composition: Unfilled
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Protavic America, Inc.
PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Type / Form: Gel
- Composition: Filled
from Shiu Li Technology Co., Ltd
LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Compound Type: Sealant; Thermally Conductive
- Industry: Electronics
- Features: UL Rating
- Gap Fill: 0.0197 to 0.1969
from Techsil Limited
Momentive SnapSIL TN3005 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Industry: Electronics
from Wacker Chemical Corp.
ELASTOSIL ® RT 675 A/B is a pourable, addition-curing RTV-2 silicone rubber. [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Industry: Electronics
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® GAP PAD TGP 10000ULM is an extremely soft gap filling material rated at a thermal conductivity of 10.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Use Temperature: -76 to 392
- Industry: OEM or Industrial
- Thermal Conductivity: 10
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 12-2, Silicone, General Assembly LOCTITE ® ABLESTIK 12-2 adhesive is the lower viscosity version of ABLETHERM 12-1 adhesive. It is designed for bonding applications which require high thermal conductivity and reworkability. Thermally conductive. Reworkable. Unfilled [See More]
- Compound Type: Thermally Conductive; Adhesive
- Cure / Technology: Single Component
- Substrate Compatibility: Metal
from OMEGA Engineering, Inc.
OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]
- Compound Type: Encapsulant, Potting Compound; Thermally Conductive; Adhesive
- Features: High Dielectric
- Cure / Technology: Single Component
- Use Temperature: 392
from Shiu Li Technology Co., Ltd
LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]
- Compound Type: Sealant; Thermally Conductive
- Industry: Electronics
- Features: UL Rating
- Gap Fill: 0.0197 to 0.1969
from Techsil Limited
Momentive SnapSIL TN3005 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Industry: Electronics
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® GAP PAD TGP 5000 is a silicone based, thermally conductive, fiberglass reinforced and S-class soft gap pad. Its highly conformable nature and S-class softness ensures that it conforms to demanding contours and maintains structural integrity. Fiberglass reinforcement provides... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Use Temperature: -76 to 392
- Industry: OEM or Industrial
- Thermal Conductivity: 5
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 813J01 BIPAX, Silicone, Non-corrosive, Encapsulant LOCTITE ® ABLESTIK 813J01 BIPAX exhibits very low stress upon cure thus preventing component cracking and other stress-related problems. This adhesive can be cured at room temperature in thick or thin sections. It is... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Viscosity: 40000
- Cure / Technology: Single Component
from Shiu Li Technology Co., Ltd
LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]
- Compound Type: Sealant; Thermally Conductive
- Industry: Electronics
- Features: UL Rating
- Gap Fill: 0.0197 to 0.1969
from Techsil Limited
Momentive SnapSIL TN3085 is a thermally conductive, low volatile siloxane, silicone adhesive that cures at room temperature to form an elastic, flame retardant silicone rubber. It offers primerless adhesion to many substrates. Designed for bonding applications in power supplies, securing PCB's to... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Industry: Electronics
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Use Temperature: -76 to 392
- Industry: OEM or Industrial
from Henkel Corporation - Industrial
LOCTITE STYCAST 5952-1, Silicone, Potting or Encapsulant. LOCTITE ® STYCAST 5952-1 is designed for encapsulation of heat generating devices. It is also recommended for applications requiring a non-corrosive casting and coating. Electrically non-conductive. Good elongation strength. Moderate tear... [See More]
- Compound Type: Thermally Conductive
- Features: High Dielectric
- Cure / Technology: Two Component
- Viscosity: 60000
from Shiu Li Technology Co., Ltd
LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]
- Compound Type: Sealant; Thermally Conductive
- Industry: Electronics
- Features: UL Rating
- Gap Fill: 0.0197 to 0.1969
from Techsil Limited
Momentive SnapSIL TN3305 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Industry: Electronics
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® LIQUI FORM TLF 6000HG thermally conductive gel interface material is designed to meet the demanding requirements in certain telecom market applications. Its unique formulation assures a balanced mix of high thermal conductivity, good dispensing efficiency and high thermal... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Industry: OEM or Industrial
- Type / Form: Gel
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Compound Type: Sealant; Thermally Conductive
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Gap Fill: 0.0197 to 0.3937
from Techsil Limited
Momentive SnapSIL TN3305 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates and high elongation once cured. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Compound Type: Sealant; Thermally Conductive
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Gap Fill: 0.0197 to 0.3937
from Techsil Limited
Momentive SnapSIL TN3075 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be used as a waterproof sealant for... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Compound Type: Sealant; Thermally Conductive
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: High Dielectric; Laminaes; UL Rating
- Gap Fill: 0.0098 to 0.0177
from Techsil Limited
Momentive SnapSIL TN3075 is a low volatile siloxane, silicone adhesive sealant that cures at room temperature. It offers primerless adhesion to many substrates. Ideal for use as an insulating adhesive seal and fixing for electrical and electronic parts. Can also be used as a waterproof sealant for... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It ’s suitable for high power transistors, electrical equipment,... [See More]
- Compound Type: Sealant; Thermally Conductive
- Industry: Electronics
- Features: UL Rating
- Gap Fill: 0.0059
from Techsil Limited
Momentive TIA241GF is a 2 part, thermally conductive silicone that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, the non-slumping paste consistency of TIA214GF provides physical stability to prevent run-off after dispense. [See More]
- Compound Type: Thermally Conductive; Adhesive
- Industry: Electronics
- Features: Flame Retardant
from Shiu Li Technology Co., Ltd
LiPOLY ’s thermal insulator SH1500/2000/3000 uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 1.5/2.0/3.0 W/m*K, the thickness is 0.23~0.35mm. Its high... [See More]
- Compound Type: Sealant; Thermally Conductive
- Industry: Electronics
- Features: UL Rating
- Gap Fill: 0.0091 to 0.0138
from Techsil Limited
Momentive TIA350R is a one-component, heat curable silicone adhesive designed for thermally conductive applications. This grade cures quickly upon exposure to heat and adheres well to a wide variety of substrates. Recommended for use as a thermal interface material between dies and heat spreaders,... [See More]
- Compound Type: Thermally Conductive; Adhesive
- Use Temperature: -40 to 200
- Industry: Electronics