Thermal / Heat Insulating Silicone Adhesives and Sealants
from Master Bond, Inc.
Passing both USP Class VI testing and ISO cytotoxicity specifications, MasterSil 910Med is formulated for bonding, sealing, coating in medical device applications. As an acetoxy type system, it bonds exceptionally well to a wide variety of substrates including metals, composites, ceramics, glass as... [See More]
- Features: Flexible; High Dielectric; Thermal Insulation
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Encapsulant, Potting Compound; Sealant; Adhesive
- Composition: Unfilled
from Master Bond, Inc.
MasterSil 930 is an acetoxy type fluorosilicone for bonding, sealing and coating. Its most prominent feature is excellent chemical resistance, particularly to fuels, oils and solvents when compared to more standard silicones. Some of the chemicals that this product can withstand better than... [See More]
- Features: Flexible; Non-corrosive; Thermal Insulation
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Sealant; Adhesive
- Composition: Unfilled
from Master Bond, Inc.
MasterSil 920-LO is an ideal material for the encapsulation of sensitive electronic and optical components, especially when low stress is a critical requirement. This neutral curing, non-corrosive, RTV silicone has very good flow properties and outstanding electrical insulation values, which enhance... [See More]
- Features: Flexible; High Dielectric; Non-corrosive; Thermal Insulation
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
MasterSil 912Med is a single component silicone with a paste viscosity for bonding, sealing and coating medical devices. This non-corrosive, neutral cure compound complies with USP Class VI and ISO 10993-5 specifications. It resists many kinds of sterilization including gamma and other types of... [See More]
- Features: Flexible; Non-corrosive; Thermal Insulation
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
- Compound Type: Sealant; Adhesive
- Composition: Unfilled
from Master Bond, Inc.
Low viscosity MasterSil 152 is a two component, optically clear silicone system that cures when exposed to air at room temperature. It has outstanding electrical insulation properties, making it ideal for potting and encapsulation applications. Additionally it features a long working life and has a... [See More]
- Features: Flexible; High Dielectric; Non-corrosive; Thermal Insulation
- Type / Form: Liquid
- Compound Type: Encapsulant, Potting Compound; Leveling Filling; Sealant; Adhesive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
from Protavic America, Inc.
PTS-46323 ™ is a two-component ONE TO ONE MIX RATIO silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible... [See More]
- Features: Flexible; High Dielectric; Flame Retardant; Thermal Insulation
- Type / Form: Gel
- Compound Type: Encapsulant, Potting Compound; Adhesive
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic