Black Max® Toughened Adhesive -- 380 [380 from Henkel Corporation]
from Applied Industrial Technologies

Typically used for close fitting parts, adhesive is black in color [See More]

  • Chemical System: Ethyl; Ceramic; Cyanoacrylate
  • Cure / Technology: Single Component; Reactive or Moisture Cured
  • Composition: Unfilled
  • Type / Form: Liquid
High Temperature Cement -- OMEGABOND® Air Set Series
from OMEGA Engineering, Inc.

Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]

  • Chemical System: Ceramic
  • Type / Form: Liquid (optional feature); Powder (optional feature)
  • Cure / Technology: Air Setting / Film Drying; Two Component   (optional feature); Single Component (optional feature)
  • Features: High Dielectric; Encapsulant, Potting Compound; Sealant; Thermally Conductive
Two-component Solvent-free Adhesive -- PC® 56 Adhesive
from Pittsburgh Corning (FOAMGLAS® insulation)

A two-component solvent-free adhesive that combines the benefits of bitumen and cement. Service temperature range is -15 °C to 45 °C (5 °F to 113 °F). E.U. Stock Item. Available in standard 28 kg pails. [See More]

  • Chemical System: Ceramic
  • Type / Form: Liquid; Powder
  • Cure / Technology: Two Component  
  • Substrate Compatibility: Concrete, Masonry; FOAMGLAS®
Black Max® Toughened Adhesive -- 38004 [380 from Henkel Corporation]
from All-Spec Industries

CFIA [See More]

  • Chemical System: Ethyl; Ceramic; Cyanoacrylate
  • Cure / Technology: Single Component; Reactive or Moisture Cured
  • Composition: Unfilled
  • Type / Form: Liquid
Ceramabond -- 503
from Aremco Products, Inc.

High fired strength, dense ceramics [See More]

  • Chemical System: Ceramic
  • Cure / Technology: Thermoset
  • Composition: Filled
  • Type / Form: Liquid
Hysol® Die Attach Adhesive -- QMI 2419
from Henkel Corporation - Electronics

Withstands polymer decomposition during reflow [See More]

  • Chemical System: Glass/Solvent; Ceramic
  • Cure / Technology: Thermoset; Single Component
  • Composition: Filled
  • Type / Form: Gel
Sensors, Adhesives and Epoxies -- TC-ADH-940HT-1
from SuperLogics, Inc.

2800 °F continuous service fast set alumina adhesive - 4 oz [See More]

  • Chemical System: Alumina; Ceramic
  • Cure / Technology: Air Setting / Film Drying
  • Composition: Unfilled
  • Features: High Dielectric