Liquid Polymers and Plastic Resins

58 Results
ELAN-Cast® -- E 2154 Orange Resin / C 2154 Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Type: CastingResin; Thermally cured
  • Filler: Mineral or Inorganic
Electrically Insulative, Two Component Epoxy System -- EP30M3LV-NV
from Master Bond, Inc.

Master Bond Polymer System EP30M3LV is a low viscosity, two component epoxy compound for high performance, chemical resistant casting and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix ratio. This... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Type: CastingResin; Thermally cured
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
Epoxy Has Low Thermal Expansion Coefficient -- EP30LTE-LO
from Master Bond, Inc.

Master Bond Polymer System EP30LTE-LO is a recently developed thermal shock resistant epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, sealing and casting. This new two component epoxy resin compound which cures... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
Flexibilized and Toughened Low Viscosity Epoxy -- EP21FL
from Master Bond, Inc.

Master Bond Polymer System EP21FL is a low to moderate viscosity, two component epoxy resin system for high performance casting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This compound... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Type: CastingResin; Thermally cured
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
Highly Flexible Two Part Epoxy -- EP21TDC-7
from Master Bond, Inc.

Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The cured... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy; Polyurethane
  • Type: CastingResin; Thermally cured
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Military; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
Liquid Epoxy EP30F Resists Abrasion and Chemicals -- EP30F
from Master Bond, Inc.

Master Bond Polymer System EP30F is a new fast curing liquid epoxy resin compound for high perform-ance abrasion and chemical resistant seamless floors. This easy-to-use two component epoxy resin system offers a uniquely attractive combination of application and performance properties including... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
Low Outgassing Two Component Epoxy -- EP30-2
from Master Bond, Inc.

Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly at elevated temperatures with a 100/10 mix ratio by weight. This resin system is 100% reactive and does... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
Low Viscosity, Flexibilized Two Component Epoxy -- EP30FL
from Master Bond, Inc.

Master Bond Polymer System EP30FL is a low viscosity, flexibilized, two component epoxy resin system for high performance potting, casting, encapsulation as well as bonding and sealing. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1)... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
Low Viscosity, Two Component Epoxy -- EP30-1NV
from Master Bond, Inc.

Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
NASA Low Outgassing Approved Epoxy System -- EP30LTE
from Master Bond, Inc.

Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, coating, sealing and casting. This new two component epoxy resin compound cures readily at ambient or more... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Filler: Mineral or Inorganic
Two Component Optically Clear Epoxy Compound -- EP30HV
from Master Bond, Inc.

Master Bond Polymer System EP30HV is a low viscosity, two component epoxy system for high performance bonding, sealing, coating and casting. It is formulated to cure at room temperature or more rapidly at elevated temperatures. It has an easy to use, non-critical 4 to 1 mix ratio by weight. This... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Sanitary; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
Two Component Polymer System -- EP21CLV
from Master Bond, Inc.

Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Type: CastingResin; Thermally cured
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
Two Component, Highly Flexibilized Epoxy for Bonding, Sealing and Coating -- EP21TDC-4
from Master Bond, Inc.

Master Bond Polymer System EP21TDC-4 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one-to-four mix ratio by weight. The cured... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy; Polyurethane
  • Type: CastingResin; Thermally cured
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Military; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
Two Component, Thermally Resistant Epoxy -- EP30-3
from Master Bond, Inc.

Master Bond Polymer System EP30-3 is a two component, low viscosity, epoxy resin system featuring optical clarity, high physical strength properties, outstanding chemical resistance and superior high temperature properties. Excellent mechanical strength characteristics and remarkably high heat... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
Two Part Epoxy System for Medical and Related Applications Featuring Superior Toughness -- EP21LV3/5Med
from Master Bond, Inc.

Master Bond Polymer System EP21LV 3/5 is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting that cures flexible. It cures readily at room temperature and more quickly at elevated temperatures. It has a forgiving 3 to 5 mix... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Type: CastingResin; Thermally cured
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Sanitary; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
Biocompatible, Spectrally Transparent Epoxy -- EPO-TEK® MED-301
from Epoxy Technology

EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Filler: Unfilled
50 A Shore Polyether Polyurethane -- 3350
from Real Seal Company

Premiere Polyurethane Products. Real Seal has developed a reputation for being one of the premiere urethane product suppliers in the market. Becoming the industry standrad for physical toughness, polyurethane sees active service in applications requiring resistance to abrasion, tear, and high... [See More]

  • Form / Shape: Liquid
  • Chemical System: Polyurethane
  • Type: MoldingCompound; Thermally cured
  • Filler: Unfilled
Abrasive Adhesion Resins
from Georgia-Pacific Chemicals LLC

Urea-formaldehyde and phenol-formaldehyde resins are used for grit adhesion to various substrates in coated abrasives, bonded abrasives and wheels, and scrub pads. They are formulated to provide grain bonding in various substrates and high water tolerance with a light color that allows for the... [See More]

  • Form / Shape: Liquid
  • Chemical System: Phenolics or Formaldehyde Resins
  • Type: Thermally cured
  • Filler: Unfilled
Aluminum Filled Epoxy Resin -- 70-3810
from Epoxies Etc...

70-3810 is a low viscosity, aluminum filled epoxy casting and tooling resin. This system is used for making heat resistant cast tools or parts that require high heat resistance and thermal conductivity. 70-3810 utilizes a new polymer resin that offers better heat resistance than most commercially... [See More]

  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Type: CastingResin; Thermally cured
  • Filler: Metal or MIM
Specialty Conducting Polymers -- 4001
from Rieke Metals, Inc.

Poly(3-butylthiophene-2,5-diyl), Highly regioregular Electronic Grade. Typical results are between 80% and 90% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: Thermoplastic
  • Industry: Electronics; Semiconductors or IC Packaging
Fluoroelastomer Polymers -- 3M™ Dyneon™ Fluoropolymers
from 3M Advanced Materials Division

In 1969, astronauts boarded the Apollo 11 spacecraft wearing boots containing 3M ™ Dyneon ™ Fluoroelastomers. Today, these synthetic elastomeric materials are used in some of the toughest environments on earth. From hot-running automotive engines to harsh chemicals of semiconductor... [See More]

  • Form / Shape: Liquid; Pellets
  • Chemical System: Polypropylene; Polyamide; Fluoropolymer
  • Type: ExtrusionGrade; FilmGrade; MoldingCompound; Optical; Thermoplastic; Thermally cured
  • Filler: Unfilled
Thermoset Silicone Resin - Polyaddition Heat Curing - Translucent -- Bluesil™ Resin 21385 A/B
from Bluestar Silicones USA Corp.

Resin - Polyaddition heat curing - Translucent. Solventless, Quick curing, Good release properties, Good bath stability. Outstanding thermal stability, High adhesion to many substrates, Engine fluids resistance (Lubricant, Cooling liquid, …). Properties. Viscosity 8500. Description. [See More]

  • Form / Shape: Liquid
  • Chemical System: Silicone
  • Type: Thermally cured
  • Filler: Unfilled
Di-Pak™ E-4000 Series Elastomeric Eletrical Insulating Compound -- E-4021
from Hapco, Inc.

Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: CastingResin; Thermally cured
  • Industry: Electronics
Epoxy Hardener Novolac Modifier Resins
from Georgia-Pacific Chemicals LLC

These phenolic novolac resins are used as curing agents for epoxy resins in molding compounds, copper clad laminates, electrical applications and potting. [See More]

  • Form / Shape: Liquid
  • Chemical System: Phenolics or Formaldehyde Resins
  • Type: Thermally cured
  • Filler: Unfilled
Specialty Conducting Polymers -- 4002
from Rieke Metals, Inc.

Poly(3-hexylthiophene-2,5-diyl ),Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity.. P3HT. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn /... [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: Thermoplastic
  • Industry: Electronics; Semiconductors or IC Packaging
Di-Pak™ E-4500 Elastomeric Eletrical Insulating Compound -- E-4540
from Hapco, Inc.

Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available. [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: CastingResin; Thermally cured
  • Industry: Electronics
GP® 161G66 Resin
from Georgia-Pacific Chemicals LLC

GP ® 161G66 resin is used in conjunction with GP ®012G23 catalyst in the manufacture of pultruded composite parts. GP 161G66 is a phenolic resole and GP 012G23 is a base catalyst. They are formulated to provide low smoke generation and flame resistance. [See More]

  • Form / Shape: Liquid
  • Chemical System: Phenolics or Formaldehyde Resins
  • Type: Thermally cured
  • Filler: Unfilled
Specialty Conducting Polymers -- 4002-E
from Rieke Metals, Inc.

Poly(3-hexylthiophene-2,5-diyl ),Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity.. P3HT. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn /... [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: Thermoplastic
  • Industry: Electronics; Semiconductors or IC Packaging
Di-Pak™ E-4600 Elastomeric Eletrical Insulating Compound -- E-4650
from Hapco, Inc.

Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented. [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: CastingResin; Thermally cured
  • Industry: Electronics
GP® 4003 Resin
from Georgia-Pacific Chemicals LLC

GP ® 4003 resin is an aqueous dispersion designed as a modifier for latex and phenoxy resins to improve chemical resistance and adhesion for coatings on rigid substrates. [See More]

  • Form / Shape: Liquid
  • Chemical System: Phenolics or Formaldehyde Resins
  • Type: Thermally cured
  • Filler: Unfilled
Specialty Conducting Polymers -- 4002-EE
from Rieke Metals, Inc.

Poly(3-hexylthiophene-2,5-diyl ),Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity.. P3HT. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn /... [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: Thermoplastic
  • Industry: Electronics; Semiconductors or IC Packaging
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4888
from Hapco, Inc.

High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications. [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: CastingResin; Thermally cured
  • Industry: Electronics
GP® 5700 and 6700 Wood Adhesive Resins
from Georgia-Pacific Chemicals LLC

A family of neat wood adhesives resins used for in-plant mixing. They can be adjusted to accommodate the differences in customers ' processes. Our plywood and laminated veneer (LVL) resins are supplied in liquid form. They can be used with most hardwood and softwood species and are used for... [See More]

  • Form / Shape: Liquid
  • Chemical System: Phenolics or Formaldehyde Resins
  • Type: Thermally cured
  • Filler: Unfilled
Specialty Conducting Polymers -- 4003
from Rieke Metals, Inc.

Poly(3-octylthiophene-2,5-diyl ), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: Thermoplastic
  • Industry: Electronics; Semiconductors or IC Packaging
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4901-2
from Hapco, Inc.

Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds. [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: CastingResin; Thermally cured
  • Industry: Electronics
LEAF FREE™ Insulation Resins
from Georgia-Pacific Chemicals LLC

A line of patented, formaldehyde-free, water-soluble thermosetting resins specifically designed to meet individual customer needs for insulation in residential, commercial and industrial (C&I) construction. [See More]

  • Form / Shape: Liquid
  • Chemical System: Phenolics or Formaldehyde Resins
  • Type: Thermally cured
  • Filler: Unfilled
Specialty Conducting Polymers -- 4003-E
from Rieke Metals, Inc.

Poly(3-octylthiophene-2,5-diyl ), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: Thermoplastic
  • Industry: Electronics; Semiconductors or IC Packaging
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4200
from Hapco, Inc.

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: CastingResin; Thermally cured
  • Industry: Electronics
Water-Soluble UF Glass Mat Resins
from Georgia-Pacific Chemicals LLC

A line of water-soluble UF resins specifically designed to meet individual customer needs such as good tensile, good tear and low emissions. Two types are available: 1) a patented, single-package resin that will not require latex modification and 2) a conventional resin that accepts latex... [See More]

  • Form / Shape: Liquid
  • Chemical System: Phenolics or Formaldehyde Resins
  • Type: Thermally cured
  • Filler: Unfilled
Specialty Conducting Polymers -- 4004
from Rieke Metals, Inc.

Poly(3-decylthiophene-2,5-diyl ), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: Thermoplastic
  • Industry: Electronics; Semiconductors or IC Packaging
Specialty Conducting Polymers -- 4005
from Rieke Metals, Inc.

Poly(3-dodecylthiophene-2,5-diyl), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / <... [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: Thermoplastic
  • Industry: Electronics; Semiconductors or IC Packaging
Specialty Conducting Polymers -- 4006
from Rieke Metals, Inc.

poly(3-butylthiophene-2,5-diyl ),regiorandom [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: Thermoplastic
  • Industry: Electronics; Semiconductors or IC Packaging
Specialty Conducting Polymers -- 4007
from Rieke Metals, Inc.

poly(3-hexylthiophene-2,5-diyl ),regiorandom [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: Thermoplastic
  • Industry: Electronics; Semiconductors or IC Packaging
Specialty Conducting Polymers -- 4008
from Rieke Metals, Inc.

poly(3-octylthiophene-2,5-diyl ),regiorandom [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: Thermoplastic
  • Industry: Electronics; Semiconductors or IC Packaging
Specialty Conducting Polymers -- 4009
from Rieke Metals, Inc.

poly(3-decylthiophene-2,5-diyl ),regiorandom [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: Thermoplastic
  • Industry: Electronics; Semiconductors or IC Packaging
Specialty Conducting Polymers -- 4010
from Rieke Metals, Inc.

poly(3-dodecylthiophene-2,5-diyl ),regiorandom [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: Thermoplastic
  • Industry: Electronics; Semiconductors or IC Packaging
Specialty Conducting Polymers -- 4011
from Rieke Metals, Inc.

polythiophene-2,5-diyl. Please contact us at sales@riekemetals.com for ordering and bulk pricing. Our products are available in an electronic database in either .db or .sd formats. Highly regioregular (98.5% or higher) as well as the regiorandom (1:1:1:1) poly(3-alkylthiophene-2,5-diyl) polymers... [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: Thermoplastic
  • Industry: Electronics; Semiconductors or IC Packaging
Specialty Conducting Polymers -- 4013
from Rieke Metals, Inc.

Poly(3-pentylthiophene-2,5-diyl), Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: Thermoplastic
  • Industry: Electronics; Semiconductors or IC Packaging
Specialty Conducting Polymers -- 4016
from Rieke Metals, Inc.

Poly(3-heptylthiophene-2,5-diyl), Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: Thermoplastic
  • Industry: Electronics; Semiconductors or IC Packaging
Specialty Conducting Polymers -- 4020
from Rieke Metals, Inc.

Poly[3-(ethyl-4-butanoate)thiophene-2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: Thermoplastic
  • Industry: Electronics; Semiconductors or IC Packaging
Specialty Conducting Polymers -- 4021
from Rieke Metals, Inc.

Poly[3-(potassium-4-butanoate)thiophene-2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: Thermoplastic
  • Industry: Electronics; Semiconductors or IC Packaging
Specialty Conducting Polymers -- 4022
from Rieke Metals, Inc.

Poly[3-(potassium-5-pentanoate)thiophene-2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: Thermoplastic
  • Industry: Electronics; Semiconductors or IC Packaging
Specialty Conducting Polymers -- 4023
from Rieke Metals, Inc.

Poly[3-(ethyl-5-pentanoate)thiophene-2,5-diyl],Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: Thermoplastic
  • Industry: Electronics; Semiconductors or IC Packaging
Specialty Conducting Polymers -- 4024
from Rieke Metals, Inc.

Poly[3-(potassium -6-hexanoate)thiophene-2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: Thermoplastic
  • Industry: Electronics; Semiconductors or IC Packaging
Specialty Conducting Polymers -- 4025
from Rieke Metals, Inc.

Poly[3-(ethyl-6-hexanoate)thiophene-2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: Thermoplastic
  • Industry: Electronics; Semiconductors or IC Packaging
Specialty Conducting Polymers -- 4026
from Rieke Metals, Inc.

Poly[3-(potassium-7-heptanoate)thiophene-2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: Thermoplastic
  • Industry: Electronics; Semiconductors or IC Packaging
Specialty Conducting Polymers -- 4027
from Rieke Metals, Inc.

Poly[3-(ethyl-7-heptanoate)thiophene2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: Thermoplastic
  • Industry: Electronics; Semiconductors or IC Packaging
Specialty Conducting Polymers -- 4030
from Rieke Metals, Inc.

Poly [3-(3-carboxypropyl)thiophene-2,5-diyl] regioregular [See More]

  • Form / Shape: Liquid
  • Filler: Unfilled
  • Type: Thermoplastic
  • Industry: Electronics; Semiconductors or IC Packaging