Metal Polymers and Plastic Resins

8 Results
Fluon® Filled PTFE Compounds
from AGC Chemicals Americas, Inc.

Composed of pigments and fillers such as glass, carbon, graphite and metal powders (bronze and molybdenum disulfide), Fluon ® Filled PTFE Compounds are molding powders that enhance wear resistance, creep resistance, thermal conductivity and electrical conductivity over virgin PTFE resins. [See More]

  • Filler: Metal or MIM; Mineral or Inorganic; Carbon or Graphite
  • Chemical System: Fluoropolymer
  • Type: MoldingCompound; Thermoplastic
  • Form / Shape: Pellets
Two Component, Epoxy Resin Systems -- EP21LSCL-1
from Master Bond, Inc.

Master Bond EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring superb optical clarity as well as outstanding non-yellowing properties. This system has a forgiving mix ratio of 100 to 60 by weight. It will cure readily at 75°F in 3-5 days or 3-4 hours at 150-200°F. The optimum... [See More]

  • Filler: Metal or MIM
  • Chemical System: Epoxy
  • Type: CastingResin; Thermally cured
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Optoelectronics or Photonics; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
Electrically Conductive Epoxy -- EPO-TEK® EJ2189-LV
from Epoxy Technology

EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]

  • Filler: Metal or MIM; Silver
  • Chemical System: Epoxy
  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
Detectable UHMW -- Redco™ Polystone® M MDT
from Redwood Plastics

Food processors face the ever present risk of contamination finding its way into their product. The risks and potential financial losses can be significant if not detected early. Redwood Plastics now offers a ground breaking solution to this problem with the introduction of Redco ™ Polystone... [See More]

  • Filler: Metal or MIM
  • Chemical System: Polyethylene
  • Type: Thermoplastic
  • Industry: Sanitary
Aluminum Filled Epoxy Resin -- 70-3810
from Epoxies Etc...

70-3810 is a low viscosity, aluminum filled epoxy casting and tooling resin. This system is used for making heat resistant cast tools or parts that require high heat resistance and thermal conductivity. 70-3810 utilizes a new polymer resin that offers better heat resistance than most commercially... [See More]

  • Filler: Metal or MIM
  • Chemical System: Epoxy
  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
Bronze-filled PTFE
from Fluoro-Plastics, Inc.

High percentage of bronze powder (40-60%) yields high thermal conductivity and better creep resistance. Often used in hydraulic systems, particularly superb as linear bearings, e.g. slides, gibs, guide ways. Not suited for electrical applications. Bronze is attacked by certain chemicals. Compare... [See More]

  • Filler: Metal or MIM
  • Chemical System: Fluoropolymer
  • Type: Thermoplastic
  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
Blue Metal Detectable PEEK -- TECAPEEK ® ID Blue
from Ensinger North America

TECAPEEK ID blue is a metal detectable PEEK made with Victrex ® PEEK polymer. This PEEK has been modified with a detectable filler designed to increase detectability in food and pharmaceutical processes. The material is sensitive enough to allow for the easy detection of small particulates using... [See More]

  • Filler: Metal or MIM
  • Chemical System: PEEK
  • Type: Thermoplastic
  • Industry: Sanitary; OEM or Industrial
Stainless Steel-filled PTFE
from Fluoro-Plastics, Inc.

Extremely stiff and hard. High loading percentage (50% generally). Available in molded sheet only [See More]

  • Filler: Metal or MIM
  • Chemical System: Fluoropolymer
  • Type: Thermoplastic
  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging