UL Approved Polymers and Plastic Resins
from AGC Chemicals Americas, Inc.
Melt processable copolymers composed of tetrafluoroethylene and ethylene, Fluon ® ETFE Resins offer superior physical toughness and adaptability to meet the ranging needs of simple, high-quality, complicated and even high-performance products. The fluoropolymers maintain stable mechanical and... [See More]
- Features: UL; Electrically Conductive Compound; Flame Retardant
- Chemical System: Fluoropolymer
- Type: MoldingCompound; Thermoplastic
- Filler: Unfilled
from ELANTAS PDG, Inc.
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Features: UL
- Chemical System: Polyester or Alkyd
- Type: CastingResin; Thermally cured
- Filler: Unfilled
from Victrex USA, Inc.
High performance thermoplastic material, 30% carbon fibre reinforced PolyEtherEtherKetone (PEEK), semi crystalline, granules for injection moulding, easy flow, FDA food contact compliant, colour black. [See More]
- Features: UL; Flame Retardant
- Chemical System: PEEK
- Type: MoldingCompound; Thermoplastic
- Filler: Carbon or Graphite
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL; Thermally Conductive
- Form / Shape: Pellets
- Type: MoldingCompound; Thermoplastic
- Industry: Electronics
from Celanese Corporation
To avoid hydrolytic degradation during processing, CELANEX resins have to be dried to a moisture level equal to or less than 0.02%. Drying should be done in a dehumidifying hopper dryer capable of dewpoints <-40 °F (-40 °C) at 250 °F (121 °C) for 4 hours. [See More]
- Features: UL
- Filler: Unfilled
- Type: MoldingCompound; Thermoplastic
- Use Temperature: 248 to 266
from Hapco, Inc.
Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]
- Features: UL; Thermally Conductive; Flame Retardant
- Filler: Unfilled
- Type: CastingResin; Thermally cured
- Form / Shape: Liquid
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL; Thermally Conductive
- Chemical System: Polyamide; Polyimide or Bismaleimide (BMI)
- Type: MoldingCompound; Thermoplastic
- Form / Shape: Pellets
from Celanese Corporation
To avoid hydrolytic degradation during processing, CELANEX resins have to be dried to a moisture level equal to or less than 0.02%. Drying should be done in a dehumidifying hopper dryer capable of dewpoints <-40 °F (-40 °C) at 250 °F (121 °C) for 4 hours. [See More]
- Features: UL
- Filler: Unfilled
- Type: MoldingCompound; Thermoplastic
- Use Temperature: 248 to 266
from Hapco, Inc.
DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]
- Features: UL; Thermally Conductive; Flame Retardant
- Filler: Unfilled
- Type: CastingResin; Thermally cured
- Form / Shape: Liquid
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL; Thermally Conductive
- Chemical System: Polyamide; Polyimide or Bismaleimide (BMI)
- Type: MoldingCompound; Thermoplastic
- Form / Shape: Pellets
from Celanese Corporation
It is normally not necessary to dry HOSTAFORM. However, should there be surface moisture (condensate) on the molding compound as a result of incorrect storage, drying is required. A circulating air drying cabinet can be used for this purpose if the granul [See More]
- Features: UL
- Filler: Unfilled
- Type: MoldingCompound; Thermoplastic
- Use Temperature: 248 to 284
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL; Thermally Conductive
- Chemical System: Polyamide; Polyimide or Bismaleimide (BMI)
- Type: MoldingCompound; Thermoplastic
- Form / Shape: Pellets
from Celanese Corporation
It is normally not necessary to dry HOSTAFORM. However, should there be surface moisture (condensate) on the molding compound as a result of incorrect storage, drying is required. A circulating air drying cabinet can be used for this purpose if the granul [See More]
- Features: UL
- Chemical System: Acetal or Polyoxymethylene (POM)
- Type: ExtrusionGrade; MoldingCompound; Thermoplastic
- Filler: Unfilled
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL; Thermally Conductive
- Form / Shape: Pellets
- Type: MoldingCompound; Thermoplastic
- Industry: Electronics
from Celanese Corporation
To avoid hydrolytic degradation during processing, Impet resins have to be dried to a moisture level equal to or less than 0.01%. Drying should be done in a dehumidifying hopper dryer capable of dewpoints <-40 °F (-40 °C) at 275 °F (135 °C) for 4 hours. [See More]
- Features: UL
- Filler: Unfilled
- Type: MoldingCompound; Thermoplastic
- Use Temperature: 266 to 284
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL; Thermally Conductive
- Chemical System: Polyamide; Polyimide or Bismaleimide (BMI)
- Type: MoldingCompound; Thermoplastic
- Form / Shape: Pellets
from Celanese Corporation
Polymer Resin [See More]
- Features: UL
- Filler: Unfilled
- Type: MoldingCompound; Thermoplastic
- Dielectric Strength: 310
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Features: UL; Thermally Conductive
- Chemical System: Polyamide; Polyimide or Bismaleimide (BMI)
- Type: MoldingCompound; Thermoplastic
- Form / Shape: Pellets
from Celanese Corporation
Polymer Resin [See More]
- Features: UL
- Filler: Unfilled
- Type: MoldingCompound; Thermoplastic
- Use Temperature: 203 to ?
from Celanese Corporation
To avoid hydrolytic degradation during processing, Vandar resins have to be dried to a moisture level equal to or less than 0.02%. Drying should be done in a dehumidifying hopper dryer capable of dewpoints <-40 °F (-40 °C) at 250 °F (121 °C) for 4 hours. [See More]
- Features: UL
- Filler: Unfilled
- Type: MoldingCompound; Thermoplastic
- Use Temperature: 248 to 266
from Celanese Corporation
When using short metering strokes an accumulator is recommended to get short injection times. VECTRA should in principle be predried. Because of the necessary low maximum residual moisture content the use of dry air dryers is recommended. The dew point should be = < - 40 ° C. The time between... [See More]
- Features: UL
- Filler: Unfilled
- Type: MoldingCompound; Thermoplastic
- Use Temperature: 302
from Celanese Corporation
When using short metering strokes an accumulator is recommended to get short injection times. VECTRA should in principle be predried. Because of the necessary low maximum residual moisture content the use of dry air dryers is recommended. The dew point should be = < - 40 ° C. The time between... [See More]
- Features: UL
- Filler: Unfilled
- Type: MoldingCompound; Thermoplastic
- Use Temperature: 302
from Celanese Corporation
Polymer Resin [See More]
- Features: UL
- Filler: Unfilled
- Type: MoldingCompound; Thermoplastic
- Use Temperature: 302