Semiconductor / IC's Polymers and Plastic Resins

69 Results
Amorphous Fluoropolymers -- CYTOP™
from AGC Chemicals Americas, Inc.

CYTOP ™ amorphous fluoropolymers have the same excellent chemical, thermal, electrical and surface properties as conventional fluoropolymers like PTFEs, but also exhibit high optical transparency and good solubility in specific fluorinated solvents. CYTOP fluoropolymers are like transparent... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging; Optical Film, Antifouling Coatings for Phtomasks
  • Chemical System: Fluoropolymer
  • Type: MoldingCompound; Thermoplastic
  • Filler: Unfilled
Engineering Plastics -- Semitron®
from Mitsubishi Chemical Advanced Materials AG

Semitron ® ESd 300 Polyethylene Terephthalate Polyester PET-P shapes are characterized by their excellent thermal performance, superior chemical resistance, consistent electrical properties, outstanding dimensional stability and abrasion resistance, minimal moisture absorption, and their low... [See More]

  • Industry: Semiconductors or IC Packaging; Bearing & Structural
  • Chemical System: Polyethylene
  • Type: Thermoplastic
  • Features: Anti-static or ESD Control
Electrically Insulative, Two Component Epoxy System -- EP30M3LV-NV
from Master Bond, Inc.

Master Bond Polymer System EP30M3LV is a low viscosity, two component epoxy compound for high performance, chemical resistant casting and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix ratio. This... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
Engineering Plastics -- Semitron®
from Mitsubishi Chemical Advanced Materials AG

Semitron ® CNT Polyoxymethylene POM-C is an extruded carbon nano tube-filled grade, developed specifically for electronic fixture applications that require a precise surface resistivity range, yet offer increased dimensional stability versus conventional POM ESd products. In addition to these... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging; Structural
  • Chemical System: Acetal or Polyoxymethylene (POM)
  • Type: ExtrusionGrade; Thermoplastic
  • Filler: extruded carbon nano tube-filled
Epoxy Has Low Thermal Expansion Coefficient -- EP30LTE-LO
from Master Bond, Inc.

Master Bond Polymer System EP30LTE-LO is a recently developed thermal shock resistant epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, sealing and casting. This new two component epoxy resin compound which cures... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Form / Shape: Liquid
Engineering Plastics -- Semitron®
from Mitsubishi Chemical Advanced Materials AG

Semitron ® ESd 225 Polyoxymethylene POM shapes are characterized by their excellent wear resistance, thermal performance, and their ability to quickly dissipate static charges. Due to these properties, this grade is ideal for several applications throughout the semiconductor and electronics... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging; Structural
  • Chemical System: Acetal or Polyoxymethylene (POM)
  • Type: Thermoplastic
  • Features: Anti-static or ESD Control
Flexibilized and Toughened Low Viscosity Epoxy -- EP21FL
from Master Bond, Inc.

Master Bond Polymer System EP21FL is a low to moderate viscosity, two component epoxy resin system for high performance casting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This compound... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
Highly Flexible Two Part Epoxy -- EP21TDC-7
from Master Bond, Inc.

Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The cured... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Military; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
  • Chemical System: Epoxy; Polyurethane
  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
Liquid Epoxy EP30F Resists Abrasion and Chemicals -- EP30F
from Master Bond, Inc.

Master Bond Polymer System EP30F is a new fast curing liquid epoxy resin compound for high perform-ance abrasion and chemical resistant seamless floors. This easy-to-use two component epoxy resin system offers a uniquely attractive combination of application and performance properties including... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Form / Shape: Liquid
Low Outgassing Two Component Epoxy -- EP30-2
from Master Bond, Inc.

Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly at elevated temperatures with a 100/10 mix ratio by weight. This resin system is 100% reactive and does... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Form / Shape: Liquid
Low Viscosity, Flexibilized Two Component Epoxy -- EP30FL
from Master Bond, Inc.

Master Bond Polymer System EP30FL is a low viscosity, flexibilized, two component epoxy resin system for high performance potting, casting, encapsulation as well as bonding and sealing. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1)... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Form / Shape: Liquid
Low Viscosity, Two Component Epoxy -- EP30-1NV
from Master Bond, Inc.

Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Form / Shape: Liquid
NASA Low Outgassing Approved Epoxy System -- EP30LTE
from Master Bond, Inc.

Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, coating, sealing and casting. This new two component epoxy resin compound cures readily at ambient or more... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Filler: Mineral or Inorganic
Two Component Optically Clear Epoxy Compound -- EP30HV
from Master Bond, Inc.

Master Bond Polymer System EP30HV is a low viscosity, two component epoxy system for high performance bonding, sealing, coating and casting. It is formulated to cure at room temperature or more rapidly at elevated temperatures. It has an easy to use, non-critical 4 to 1 mix ratio by weight. This... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Sanitary; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Form / Shape: Liquid
Two Component Polymer System -- EP21CLV
from Master Bond, Inc.

Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
Two Component, Epoxy Resin Systems -- EP21LSCL-1
from Master Bond, Inc.

Master Bond EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring superb optical clarity as well as outstanding non-yellowing properties. This system has a forgiving mix ratio of 100 to 60 by weight. It will cure readily at 75°F in 3-5 days or 3-4 hours at 150-200°F. The optimum... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Optoelectronics or Photonics; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Thermally cured
  • Filler: Metal or MIM
Two Component, Highly Flexibilized Epoxy for Bonding, Sealing and Coating -- EP21TDC-4
from Master Bond, Inc.

Master Bond Polymer System EP21TDC-4 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one-to-four mix ratio by weight. The cured... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Military; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
  • Chemical System: Epoxy; Polyurethane
  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
Two Component, Thermally Resistant Epoxy -- EP30-3
from Master Bond, Inc.

Master Bond Polymer System EP30-3 is a two component, low viscosity, epoxy resin system featuring optical clarity, high physical strength properties, outstanding chemical resistance and superior high temperature properties. Excellent mechanical strength characteristics and remarkably high heat... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Form / Shape: Liquid
Two Part Epoxy System for Medical and Related Applications Featuring Superior Toughness -- EP21LV3/5Med
from Master Bond, Inc.

Master Bond Polymer System EP21LV 3/5 is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting that cures flexible. It cures readily at room temperature and more quickly at elevated temperatures. It has a forgiving 3 to 5 mix... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Sanitary; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
Fluoroelastomer Polymers -- 3M™ Dyneon™ Fluoropolymers
from 3M Advanced Materials Division

In 1969, astronauts boarded the Apollo 11 spacecraft wearing boots containing 3M ™ Dyneon ™ Fluoroelastomers. Today, these synthetic elastomeric materials are used in some of the toughest environments on earth. From hot-running automotive engines to harsh chemicals of semiconductor... [See More]

  • Industry: Aerospace; Automotive; Electronics; Energy Conversion (Battery / Fuel Cell); Electrical Power or High Voltage; Marine; Sanitary; Military; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Oil &Gas Exploration
  • Chemical System: Polypropylene; Polyamide; Fluoropolymer
  • Type: ExtrusionGrade; FilmGrade; MoldingCompound; Optical; Thermoplastic; Thermally cured
  • Filler: Unfilled
Bondable PTFE
from Fluoro-Plastics, Inc.

PTFE can be etched with a sodium ammonia or sodium naphthalene etch so that its surface is chemically modified for adhesion to various substrates using ordinary commercial grade epoxies. When etched for bonding, PTFE can be used as chute liners, vessel linings, and glued to processing surfaces to... [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: ExtrusionGrade; Thermoplastic
  • Filler: Unfilled
Electrically Conductive Epoxy -- EPO-TEK® EJ2189-LV
from Epoxy Technology

EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]

  • Industry: Electronics; Electrical Power or High Voltage; Semiconductors or IC Packaging
  • Chemical System: Epoxy
  • Type: CastingResin; Thermally cured
  • Filler: Metal or MIM; Silver
Ceramic Filled PEEK -- TECAPEEK CMF White
from Ensinger North America

TECAPEEK CMF is a composite material based on Victrex ® PEEK 450G polymer, that is filled with ceramic. This materials has been specifically designed with the requirements of the semiconductor industry in mind. Because of the often intricate designs necessary for parts such as test sockets,... [See More]

  • Industry: Electronics; Electrical Power or High Voltage; Semiconductors or IC Packaging
  • Chemical System: PEEK
  • Type: Thermoplastic
  • Filler: Ceramic
Engineering Thermoplastics
from Greene, Tweed & Co.

Thermoplastic polymers are a type of plastic that softens upon heating to elevated temperatures and hardens upon cooling. Thermoplastic polymers may be amorphous or semi-crystalline, with differences in mechanical performance, chemical resistance, and service temperature capability. AETs represent a... [See More]

  • Industry: Aerospace; Electrical Power or High Voltage; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer; PEEK
  • Type: Thermoplastic
PEEK Polymer Resin -- VICTREX® 150CA30
from Victrex USA, Inc.

High performance thermoplastic material, 30% carbon fibre reinforced PolyEtherEtherKetone (PEEK), semi crystalline, granules for injection moulding, easy flow, FDA food contact compliant, colour black. [See More]

  • Industry: Aerospace; Automotive; Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging; Energy,Textile, Industrial,Food, Oil/Gas
  • Chemical System: PEEK
  • Type: MoldingCompound; Thermoplastic
  • Filler: Carbon or Graphite
Specialty Conducting Polymers -- 4001
from Rieke Metals, Inc.

Poly(3-butylthiophene-2,5-diyl), Highly regioregular Electronic Grade. Typical results are between 80% and 90% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Super Engineering Plastic Materials
from Toray Industries (America), Inc.

Toyo Plastic Seiko Co., Ltd. is manufacturing and marketing materials for cut and shaved processing (rods, boards and sheets) made of super engineering plastics (such as PAI, PEEK and PPS) with excellent resistance to heat, chemicals and wear. The materials are widely used in areas such as... [See More]

  • Industry: Sanitary; Semiconductors or IC Packaging
  • Type: MoldingCompound; Thermoplastic
Bronze-filled PTFE
from Fluoro-Plastics, Inc.

High percentage of bronze powder (40-60%) yields high thermal conductivity and better creep resistance. Often used in hydraulic systems, particularly superb as linear bearings, e.g. slides, gibs, guide ways. Not suited for electrical applications. Bronze is attacked by certain chemicals. Compare... [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: Thermoplastic
  • Filler: Metal or MIM
Injection Moulded PEEK -- TECAPEEK IM Natural
from Ensinger North America

Injection molded stock shapes from PEEK polymer are handled under the trade name TECAPEEK IM natural. Injection molded tubes range from 1,25 to 7 inches. OD and provide wall thicknesses up to 0,56 inches. Standard lengths are 3 and 6 inches. Main Features: Excellent chemical resistance. Excellent... [See More]

  • Industry: Aerospace; Automotive; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: PEEK
  • Type: Thermoplastic
  • CTE: 25
Specialty Conducting Polymers -- 4002
from Rieke Metals, Inc.

Poly(3-hexylthiophene-2,5-diyl ),Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity.. P3HT. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn /... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Carbon Fiber-filled PTFE
from Fluoro-Plastics, Inc.

Lower deformation under load. Higher compressive and flex modulus and increased hardness. Chemically inert –can be used in strong alkali and in HF, where glass reinforced compounds fail. Good initial wear and rubbing or sliding characteristics in both dry and water applications. Frequently... [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: Thermoplastic
  • Filler: Carbon or Graphite
Lubricated PBT Polyester -- HYDEX® 4101L
from Ensinger North America

HYDEX 4101L natural is the lubricated version of HYDEX 4101 PBT polyester. Like its un-lubricated sister resin, HYDEX 4101L is a more impact resistant polyester that is better suited to many fast paced industrial and food processing environments than other lubricated PET polyesters available. It is... [See More]

  • Industry: Automotive; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Thermoplastic Polyester (PET, PBT, etc.)
  • Type: Thermoplastic
  • Deflection Temperature: 195
Specialty Conducting Polymers -- 4002-E
from Rieke Metals, Inc.

Poly(3-hexylthiophene-2,5-diyl ),Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity.. P3HT. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn /... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Extruded Tube PTFE
from Fluoro-Plastics, Inc.

Surf Technologies is a leader in the manufacture of heavy walled PTFE tube, both in standard inch sizes and in AWG sizes. Tube is used in fluid handling applications for high temperature acids and caustics or where contamination is an issue, such as in wire braided hose. In applications where PTFE's... [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: ExtrusionGrade; Thermoplastic
  • Filler: Unfilled
Modified PPS for Semiconductor Industry -- TECATRON SE Natural
from Ensinger North America

This polyphenylensulfide (PPS) is a high performance thermoplastic designed specifically for semiconductor applications. It combines good mechanical properties with excellent thermal and chemical resistance properties, and is manufactured by Ensinger under the tradename TECATRON SE. Its low ionic... [See More]

  • Industry: Semiconductors or IC Packaging
  • Deflection Temperature: 239 to 320
  • Type: Thermoplastic
  • CTE: 28
Specialty Conducting Polymers -- 4002-EE
from Rieke Metals, Inc.

Poly(3-hexylthiophene-2,5-diyl ),Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity.. P3HT. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn /... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Glass-filled Compounded PTFE
from Fluoro-Plastics, Inc.

Most widely used filler in various percentages (5%, 10%, 15% and 25%). Improves creep resistance, both at low and high temperatures. Chemically stable (except for strong alkalis and hydrofluoric acid (HF). Little effect on the electrical properties of PTFE, and improves wear and friction behavior. [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: ExtrusionGrade; Thermoplastic
  • Filler: Glass or FRP
PEEK with Defined Electrostatic Dissipative Properties -- TECAPEEK SD Black
from Ensinger North America

PEEK SD is an electrically modified PEEK ESD plastic material with a defined surface resistance between 106 -109 Ohm. Due to its electrostatic dissipation properties, this material is commonly used in applications within the electronics industry, test sockets being one example. Such materials are... [See More]

  • Industry: Semiconductors or IC Packaging
  • Chemical System: PEEK
  • Type: Thermoplastic
  • CTE: 28 to 39
Specialty Conducting Polymers -- 4003
from Rieke Metals, Inc.

Poly(3-octylthiophene-2,5-diyl ), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Glass-Moly-filled PTFE
from Fluoro-Plastics, Inc.

Adds to hardness and stiffness. Reduces friction, especially starting coefficient of friction and steady-state wear. Effect on electrical properties is negligible. Unreactive chemically, and dissolves only in strong oxidizing acids [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: Thermoplastic
  • Filler: Glass or FRP
PET Polyester -- TECAPET Black
from Ensinger North America

TECAPET black PET is the black pigmented version of our standard PET polyester. Among other excellent product features, Ensinger's TECAPET PET is also designed for improved machining properties. In addition, as a result of the black coloration, PET black also offers improved UV protection for... [See More]

  • Industry: OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Thermoplastic Polyester (PET, PBT, etc.)
  • Type: Thermoplastic
  • Thermal Conductivity: 0.2899
Specialty Conducting Polymers -- 4003-E
from Rieke Metals, Inc.

Poly(3-octylthiophene-2,5-diyl ), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Graphite-filled PTFE
from Fluoro-Plastics, Inc.

Crystalline modification of high purity carbon. Excellent wear properties, particularly against soft metals. High load-carrying capability in high speed contact applications. Chemically inert. Frequently used with other filler, e.g. carbon [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: Thermoplastic
  • Filler: Carbon or Graphite
Polyvinylidene Fluoride -- KYNAR® 740 PVDF Natural
from Ensinger North America

KYNAR ® PVDF is a highly chemically resistant crystalline thermoplastic. It is used extensively in the chemical processing industry by users looking for plastic chemical resistance. The material is also chosen because of its unique properties which include outstanding chemical and solvent... [See More]

  • Industry: Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: Thermoplastic
  • Deflection Temperature: 221 to 284
Specialty Conducting Polymers -- 4004
from Rieke Metals, Inc.

Poly(3-decylthiophene-2,5-diyl ), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Mineral-filled PTFE
from Fluoro-Plastics, Inc.

PTFE with FDA compliant filler. For food processing and pharmaceutical bearing applications. Compatible with a wide variety of mating surfaces, both soft (e.g. mild steel) and harder surfaces. Compare this product to Rulon 641* [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: Thermoplastic
  • Filler: Mineral or Inorganic
PVC -- PVC Type 1 Grey
from Ensinger North America

Ensinger's type 1 grey PVC ROD is designed for machining solutions and is a cost effective solution for general industrial applications. The material offers an excellent combination of chemical resistance and mechanical strength, along with good thermal and electrical properties that are suited to a... [See More]

  • Industry: Semiconductors or IC Packaging
  • Chemical System: Vinyl / PVC
  • Type: Thermoplastic
  • Deflection Temperature: 158
Specialty Conducting Polymers -- 4005
from Rieke Metals, Inc.

Poly(3-dodecylthiophene-2,5-diyl), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / <... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Polyimide-filled PTFE
from Fluoro-Plastics, Inc.

Low Friction. Extremely low wear. Increased hardness. Operates well against soft mating surfaces like aluminum, mild steel, brass and plastics. Ideal for stop-start applications to eliminate stick-slip. Compare this product to Rulon J* [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: Thermoplastic
  • Filler: Mineral or Inorganic
Rigid Polyurethane -- HYDEX® 301
from Ensinger North America

Hydex 301 is clear totally rigid polyurethane material that is designed for use in harsher chemical environments. It combines excellent clarity when polished with a broad range of chemical resistance and outstanding practical toughness. Main Features: Broad chemical compatibility. Very good... [See More]

  • Industry: Sanitary; Semiconductors or IC Packaging
  • Chemical System: Polyurethane
  • Type: Thermally cured
  • Deflection Temperature: 170 to 280
Specialty Conducting Polymers -- 4006
from Rieke Metals, Inc.

poly(3-butylthiophene-2,5-diyl ),regiorandom [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
PTFE Plate
from Fluoro-Plastics, Inc.

Molded plate is available in thicknesses from 3/8ths of an inch up to four inches. Plate is inventoried in sizes from one-foot square to four feet square (sixteen square feet per sheet). Thickness tolerances range from plus .038" to minus .019" for 3/8th ” plate, up to plus .087", minus .043"... [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: ExtrusionGrade; Thermoplastic
  • Filler: Unfilled
Spin Molded PEEK -- TECAPEEK SM Natural
from Ensinger North America

TECAPEEK SM natural is an unmodified spin molded Victrex PEEK polymer. One strength of spin molded material is the flexibility of the wall thickness of up to 1,18 inches, whereas of course there are preferred standard sizes. Rings with outer diameters up to 21,06 inches can be produced. Pipe lengths... [See More]

  • Industry: Aerospace; Automotive; Semiconductors or IC Packaging
  • Chemical System: PEEK
  • Type: Thermoplastic
  • Tensile (Break): 14794
Specialty Conducting Polymers -- 4007
from Rieke Metals, Inc.

poly(3-hexylthiophene-2,5-diyl ),regiorandom [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
PTFE Rod
from Fluoro-Plastics, Inc.

Rod is available in both virgin grades and reprocessed (mechanical) for less demanding applications. Surf Technologies extrudes rod in all standard sizes from 1/8th inch diameter up to 4 inches in diameter. Rod is inventoried in twelve foot lengths so it can be cut into six foot lengths (UPS... [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: ExtrusionGrade; Thermoplastic
  • Filler: Unfilled
Unfilled PEEK -- TECAPEEK CM XP96 Natural
from Ensinger North America

This beige compression molded material is an unfilled Victrex ® PEEK polymer available in rods, tubes and plates. Main Features: Excellent chemical resistance. Hydrolysis and superheated steam resistant. Excellent mechanical properties. Easy to machine. High continuous use temperature. Good... [See More]

  • Industry: Sanitary; Semiconductors or IC Packaging
  • Chemical System: PEEK
  • Type: Thermoplastic
  • Filler: Unfilled
Specialty Conducting Polymers -- 4008
from Rieke Metals, Inc.

poly(3-octylthiophene-2,5-diyl ),regiorandom [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
PTFE Sheet
from Fluoro-Plastics, Inc.

Skived sheet can be made in any thickness from 15 mils up to .250 inches. Fluoro-Plastics technology makes it possible to make in-between sizes. Thickness tolerances range from .0005 for sizes from .002" thick to .005" thick up to .003" tolerance for material that is over .060" thick. Skived sheet... [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: ExtrusionGrade; Thermoplastic
  • Filler: Unfilled
Unfilled PEI -- TECAPEI™ Black
from Ensinger North America

TECAPEI black Ultem is a polyetherimide material with high mechanical strength and rigidity, that is also known for its good electrical properties. This material has a remarkably high creep resistance over a wide range of temperatures and furthermore, polyetherimides have a high permanent operating... [See More]

  • Industry: Aerospace; Automotive; Electronics; Sanitary; Semiconductors or IC Packaging
  • Chemical System: Polyetherimide
  • Type: Thermoplastic
  • Filler: Unfilled
Specialty Conducting Polymers -- 4009
from Rieke Metals, Inc.

poly(3-decylthiophene-2,5-diyl ),regiorandom [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Stainless Steel-filled PTFE
from Fluoro-Plastics, Inc.

Extremely stiff and hard. High loading percentage (50% generally). Available in molded sheet only [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: Thermoplastic
  • Filler: Metal or MIM
Unfilled PEI -- TECAPEI™ Natural
from Ensinger North America

TECAPEI natural (PEI) is an unreinforced polyetherimide, suitable for contact with foods, that exhibits high mechanical strength and rigidity. The characteristic profile includes very good hydrolysis resistance, and dimensional stability, combined with a relatively high long term service... [See More]

  • Industry: Aerospace; Automotive; Electronics; Energy Conversion (Battery / Fuel Cell); Semiconductors or IC Packaging
  • Chemical System: Polyetherimide
  • Type: Thermoplastic
  • Filler: Unfilled
Specialty Conducting Polymers -- 4010
from Rieke Metals, Inc.

poly(3-dodecylthiophene-2,5-diyl ),regiorandom [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Unfilled Polyimide -- TECASINT 2011 Brown
from Ensinger North America

TECASINT 2011 is one of the unfilled natural grades. It has a very high modulus of elasticity, high rigidity and hardness. Compared with TECASINT 1011 it has significantly reduced moisture absorption, higher toughness and better machining properties. Within the TECASINT 2000 series the material has... [See More]

  • Industry: Aerospace; Electronics; Sanitary; Semiconductors or IC Packaging
  • Chemical System: Polyimide or Bismaleimide (BMI)
  • Type: Thermoplastic; Thermally cured
  • Filler: Unfilled
Specialty Conducting Polymers -- 4011
from Rieke Metals, Inc.

polythiophene-2,5-diyl. Please contact us at sales@riekemetals.com for ordering and bulk pricing. Our products are available in an electronic database in either .db or .sd formats. Highly regioregular (98.5% or higher) as well as the regiorandom (1:1:1:1) poly(3-alkylthiophene-2,5-diyl) polymers... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Unfilled PSU -- TECASON ® S Natural
from Ensinger North America

TECASON S - PSU - is a transparent engineering plastic known for its chemical resistance, rigidity, and high-temperature performance. The polysulfone material's ability to operate in an autoclave environment while maintaining its excellent mechanical properties over a wide range of temperatures is... [See More]

  • Industry: Electronics; Sanitary; Semiconductors or IC Packaging
  • Chemical System: Polysulphone
  • Type: Thermoplastic
  • Filler: Unfilled
Specialty Conducting Polymers -- 4013
from Rieke Metals, Inc.

Poly(3-pentylthiophene-2,5-diyl), Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Specialty Conducting Polymers -- 4016
from Rieke Metals, Inc.

Poly(3-heptylthiophene-2,5-diyl), Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Specialty Conducting Polymers -- 4020
from Rieke Metals, Inc.

Poly[3-(ethyl-4-butanoate)thiophene-2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid