Electronics Polymers and Plastic Resins

114 Results
ELAN-Cast® -- P 300S-45 Resin
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Industry: Electronics; Electrical Power or High Voltage; Repair or Construction (optional feature); OEM or Industrial; Tooling; Sand-filled transformers
  • Chemical System: Polyester or Alkyd
  • Type: CastingResin; Thermally cured
  • Filler: Unfilled
Amorphous Fluoropolymers -- CYTOP™
from AGC Chemicals Americas, Inc.

CYTOP ™ amorphous fluoropolymers have the same excellent chemical, thermal, electrical and surface properties as conventional fluoropolymers like PTFEs, but also exhibit high optical transparency and good solubility in specific fluorinated solvents. CYTOP fluoropolymers are like transparent... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging; Optical Film, Antifouling Coatings for Phtomasks
  • Chemical System: Fluoropolymer
  • Type: MoldingCompound; Thermoplastic
  • Filler: Unfilled
Electrically Insulative, Two Component Epoxy System -- EP30M3LV-NV
from Master Bond, Inc.

Master Bond Polymer System EP30M3LV is a low viscosity, two component epoxy compound for high performance, chemical resistant casting and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix ratio. This... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
Engineering Plastics - Duratron® T5030 PAI
from Mitsubishi Chemical Advanced Materials AG

High temperature, very good electrical insulator, great dimensional stability for extreme applications. ,. Duratron ® T5030 PAI Polyamide-imide offers high rigidity, retention of stiffness, a low expansion rate, and outstanding load carrying capabilities. As a 30% glass reinforced material,... [See More]

  • Industry: Aerospace; Electronics; Bearing & Structural
  • Chemical System: Polyamide
  • Type: Thermoplastic
  • Filler: Glass or FRP
High Performance Polyimide Wire Enamels -- ULTRATHERM
from ELANTAS PDG, Inc.

ULTRATHERM TM resins are high performance polyimide wire enamels. Applied in the form of a polyamic acid solution, the resin is converted with heat to a continuous film coating resulting in excellent resistance to radiation, chemicals, and cryogenic temperatures. [See More]

  • Industry: Electronics; Electrical Power or High Voltage
  • Chemical System: Polyimide or Bismaleimide (BMI)
  • Type: Thermally cured
Fluon® ETFE Resin
from AGC Chemicals Americas, Inc.

Melt processable copolymers composed of tetrafluoroethylene and ethylene, Fluon ® ETFE Resins offer superior physical toughness and adaptability to meet the ranging needs of simple, high-quality, complicated and even high-performance products. The fluoropolymers maintain stable mechanical and... [See More]

  • Industry: Electronics
  • Chemical System: Fluoropolymer
  • Type: MoldingCompound; Thermoplastic
  • Filler: Unfilled
Epoxy Has Low Thermal Expansion Coefficient -- EP30LTE-LO
from Master Bond, Inc.

Master Bond Polymer System EP30LTE-LO is a recently developed thermal shock resistant epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, sealing and casting. This new two component epoxy resin compound which cures... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Form / Shape: Liquid
Engineering Plastics - Duratron® T5530 PAI
from Mitsubishi Chemical Advanced Materials AG

High temperature, good wear resistance, great dimensional stability for extreme PV applications. ,. Duratron ® T5530 PAI Polyamide-imide is a compression molded, 30% glass reinforced grade that offers high stiffness, strength, and creep resistance. Although similar in composition to Duratron... [See More]

  • Industry: Electronics; Structural
  • Chemical System: Polyamide
  • Type: Thermoplastic
  • Filler: Glass or FRP
Polyether polyols -- EXCESTAR™
from AGC Chemicals Americas, Inc.

EXCESTAR is a liquid polymer for silane modified polyether sealants and adhesives. Its unique properties such as high flexibility, heat resistance, weatherability, and stain resistance, enable EXCESTAR to be applied in various markets including construction, industrial, and electronics. EXCESTAR... [See More]

  • Industry: Automotive; Electronics; Repair or Construction
  • Chemical System: Fluoropolymer
  • Type: MoldingCompound; Thermoplastic
Flexibilized and Toughened Low Viscosity Epoxy -- EP21FL
from Master Bond, Inc.

Master Bond Polymer System EP21FL is a low to moderate viscosity, two component epoxy resin system for high performance casting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This compound... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
Engineering Plastics - Duratron® U2100 PEI
from Mitsubishi Chemical Advanced Materials AG

Great Electrical insulator, High temperature resistance, Glass filled for low CLTE, Excellent dimensional stability. ,. Duratron ® U2100 PEI Polyetherimide shapes are 10% glass-reinforced, giving them great rigidity and dimensional stability, and a low Coefficient of Linear Thermal Expansion. [See More]

  • Industry: Electronics; Structural
  • Chemical System: Polyetherimide
  • Type: Thermoplastic
  • Filler: Glass or FRP
Highly Flexible Two Part Epoxy -- EP21TDC-7
from Master Bond, Inc.

Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The cured... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Military; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
  • Chemical System: Epoxy; Polyurethane
  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
Engineering Plastics - Duratron® U2200 PEI
from Mitsubishi Chemical Advanced Materials AG

Great Electrical insulator, High temperature resistance, Glass filled for low CLTE, Excellent dimensional stability. ,. Duratron ® U2200 PEI Polyetherimide shapes are 20% glass-reinforced, giving them exceptional rigidity and dimensional stability, high temperature resistance, and a low... [See More]

  • Industry: Electronics; Structural
  • Chemical System: Polyetherimide
  • Type: Thermoplastic
  • Filler: Glass or FRP
Liquid Epoxy EP30F Resists Abrasion and Chemicals -- EP30F
from Master Bond, Inc.

Master Bond Polymer System EP30F is a new fast curing liquid epoxy resin compound for high perform-ance abrasion and chemical resistant seamless floors. This easy-to-use two component epoxy resin system offers a uniquely attractive combination of application and performance properties including... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Form / Shape: Liquid
Engineering Plastics -- Semitron®
from Mitsubishi Chemical Advanced Materials AG

Semitron ® CNT Polyoxymethylene POM-C is an extruded carbon nano tube-filled grade, developed specifically for electronic fixture applications that require a precise surface resistivity range, yet offer increased dimensional stability versus conventional POM ESd products. In addition to these... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging; Structural
  • Chemical System: Acetal or Polyoxymethylene (POM)
  • Type: ExtrusionGrade; Thermoplastic
  • Filler: extruded carbon nano tube-filled
Low Outgassing Two Component Epoxy -- EP30-2
from Master Bond, Inc.

Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly at elevated temperatures with a 100/10 mix ratio by weight. This resin system is 100% reactive and does... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Form / Shape: Liquid
Engineering Plastics -- Semitron®
from Mitsubishi Chemical Advanced Materials AG

Semitron ® Homopolymer Polypropylene PP Natural shapes have been developed specifically for demanding wet process semiconductor and electronics applications that require a high level of superior dimensional stability. In addition to these key benefits, this grade in particular offers low... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging; Structural
  • Chemical System: Polypropylene
  • Type: Thermoplastic
  • Use Temperature: 180
Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Industry: Electronics; Electrical Power or High Voltage; Optoelectronics or Photonics
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Filler: Unfilled
Engineering Plastics -- Semitron®
from Mitsubishi Chemical Advanced Materials AG

Semitron ® ESd 225 Polyoxymethylene POM shapes are characterized by their excellent wear resistance, thermal performance, and their ability to quickly dissipate static charges. Due to these properties, this grade is ideal for several applications throughout the semiconductor and electronics... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging; Structural
  • Chemical System: Acetal or Polyoxymethylene (POM)
  • Type: Thermoplastic
  • Features: Anti-static or ESD Control
Low Viscosity Thermally Conductive Epoxy -- EP112AO
from Master Bond, Inc.

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

  • Industry: Electronics; Electrical Power or High Voltage
  • Chemical System: Epoxy
  • Type: CastingResin; Thermally cured
  • Features: Thermally Conductive
Low Viscosity, Flexibilized Two Component Epoxy -- EP30FL
from Master Bond, Inc.

Master Bond Polymer System EP30FL is a low viscosity, flexibilized, two component epoxy resin system for high performance potting, casting, encapsulation as well as bonding and sealing. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1)... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Form / Shape: Liquid
Low Viscosity, Two Component Epoxy -- EP30-1NV
from Master Bond, Inc.

Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Form / Shape: Liquid
NASA Low Outgassing Approved Epoxy System -- EP30LTE
from Master Bond, Inc.

Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, coating, sealing and casting. This new two component epoxy resin compound cures readily at ambient or more... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Filler: Mineral or Inorganic
Two Component Epoxy -- EP121CL
from Master Bond, Inc.

Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation for service up to 450-500 °F. It cures... [See More]

  • Industry: Electronics; Electrical Power or High Voltage; Optoelectronics or Photonics
  • Chemical System: Epoxy
  • Type: CastingResin; Thermally cured
  • Filler: Unfilled
Two Component Optically Clear Epoxy Compound -- EP30HV
from Master Bond, Inc.

Master Bond Polymer System EP30HV is a low viscosity, two component epoxy system for high performance bonding, sealing, coating and casting. It is formulated to cure at room temperature or more rapidly at elevated temperatures. It has an easy to use, non-critical 4 to 1 mix ratio by weight. This... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Sanitary; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Form / Shape: Liquid
Two Component Polymer System -- EP21CLV
from Master Bond, Inc.

Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
Two Component, Epoxy Resin Systems -- EP21LSCL-1
from Master Bond, Inc.

Master Bond EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring superb optical clarity as well as outstanding non-yellowing properties. This system has a forgiving mix ratio of 100 to 60 by weight. It will cure readily at 75°F in 3-5 days or 3-4 hours at 150-200°F. The optimum... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Optoelectronics or Photonics; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Thermally cured
  • Filler: Metal or MIM
Two Component, Highly Flexibilized Epoxy for Bonding, Sealing and Coating -- EP21TDC-4
from Master Bond, Inc.

Master Bond Polymer System EP21TDC-4 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one-to-four mix ratio by weight. The cured... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Military; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
  • Chemical System: Epoxy; Polyurethane
  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
Two Component, Thermally Resistant Epoxy -- EP30-3
from Master Bond, Inc.

Master Bond Polymer System EP30-3 is a two component, low viscosity, epoxy resin system featuring optical clarity, high physical strength properties, outstanding chemical resistance and superior high temperature properties. Excellent mechanical strength characteristics and remarkably high heat... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Optical; Thermally cured
  • Form / Shape: Liquid
Two Part Epoxy System for Medical and Related Applications Featuring Superior Toughness -- EP21LV3/5Med
from Master Bond, Inc.

Master Bond Polymer System EP21LV 3/5 is a two component, low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulation and casting that cures flexible. It cures readily at room temperature and more quickly at elevated temperatures. It has a forgiving 3 to 5 mix... [See More]

  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Sanitary; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
  • Chemical System: Epoxy
  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
Silicone Elastomer Gel Encapsulant and Potting Compound -- SilGel® 611 A/B
from Wacker Chemical Corp.

WACKER SilGel ® 611 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a soft silicone gel. WACKER SilGel ® 611 A/B is a white colored modification of WACKER SilGel ® 612 with higher hardness and reactivity. Special features. two-part, 1 : 1... [See More]

  • Industry: Electronics; Energy Conversion (Battery / Fuel Cell)
  • Chemical System: Silicone
  • Type: Thermally cured
  • Filler: Unfilled
AMILAN® Nylon Resin
from Toray Industries (America), Inc.

Nylon resin is a typical engineering plastic that features superior toughness, heat-resistance, and oil-resistance. Used chiefly in automobile parts, connectors and other electronics components, and mechanical parts, AMILAN ® also finds application in packaging and construction materials. More... [See More]

  • Industry: Automotive; Electronics; Repair or Construction
  • Chemical System: Polyamide
  • Type: MoldingCompound; Thermoplastic
Di-Pak™ E-4000 Series Elastomeric Eletrical Insulating Compound -- E-4021
from Hapco, Inc.

Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]

  • Industry: Electronics
  • Filler: Unfilled
  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
Bondable PTFE
from Fluoro-Plastics, Inc.

PTFE can be etched with a sodium ammonia or sodium naphthalene etch so that its surface is chemically modified for adhesion to various substrates using ordinary commercial grade epoxies. When etched for bonding, PTFE can be used as chute liners, vessel linings, and glued to processing surfaces to... [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: ExtrusionGrade; Thermoplastic
  • Filler: Unfilled
ABS -- TECARAN ABS Black
from Ensinger North America

Ensinger TECARAN ABS is a terpolymer and an amorphous resin. It is manufactured by combining three different compounds. The three that make up TECARAN ABS are acrylonitrile, butadiene, and styrene. TECARAN ABS occupies the unique position of being a bridge between the commodity and other higher... [See More]

  • Industry: Automotive; Electronics; Sanitary
  • Chemical System: ABS
  • Type: Thermoplastic
  • Deflection Temperature: 177 to 200
Specialty Conducting Polymers -- 4001
from Rieke Metals, Inc.

Poly(3-butylthiophene-2,5-diyl), Highly regioregular Electronic Grade. Typical results are between 80% and 90% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
DuPont™ Crastin® PBT Thermoplastic Polyester Resin -- Crastin® HR5330HF BK503 -- PBT-IGF30
from DuPont Plastics, Polymers & Resins

Crastin ® HR5330HF is a 30% glass reinforced PBT with high flow (HF), moderately toughened, hydrolysis resistant (HR) resin. Excellent balance of properties between terminal pullout and impact resistance. Developed for USCAR Class 3 and 4 environments. DuPont ™ Crastin® PBT thermoplastic... [See More]

  • Industry: Electronics
  • Chemical System: Thermoplastic Polyester (PET, PBT, etc.)
  • Type: Thermoplastic
  • Filler: Glass or FRP
Electrically Conductive Epoxy -- EPO-TEK® EJ2189-LV
from Epoxy Technology

EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]

  • Industry: Electronics; Electrical Power or High Voltage; Semiconductors or IC Packaging
  • Chemical System: Epoxy
  • Type: CastingResin; Thermally cured
  • Filler: Metal or MIM; Silver
Acrylonitrile butadiene styrene (ABS)
from Sparkle Plastics Inc.

Our plastic department is focused on American chemical virgin materials, off-spec pellet engineering plastic, commodity plastic, reprocessed (A grade) and off spec pellet (PCT, PCTG, PETG, PCTA, PA, GPEEK, PEI, LCP, PPSU,PPS, PPO, PPE, PBT, POM, PMMA, PC, PA, ABS, TPU, TPE,PET, PP, PE), and provides... [See More]

  • Industry: Automotive; Electronics; Sanitary
  • Chemical System: ABS
  • Type: Thermoplastic
  • Form / Shape: Pellets
Fluoroelastomer Polymers -- 3M™ Dyneon™ Fluoropolymers
from 3M Advanced Materials Division

In 1969, astronauts boarded the Apollo 11 spacecraft wearing boots containing 3M ™ Dyneon ™ Fluoroelastomers. Today, these synthetic elastomeric materials are used in some of the toughest environments on earth. From hot-running automotive engines to harsh chemicals of semiconductor... [See More]

  • Industry: Aerospace; Automotive; Electronics; Energy Conversion (Battery / Fuel Cell); Electrical Power or High Voltage; Marine; Sanitary; Military; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Oil &Gas Exploration
  • Chemical System: Polypropylene; Polyamide; Fluoropolymer
  • Type: ExtrusionGrade; FilmGrade; MoldingCompound; Optical; Thermoplastic; Thermally cured
  • Filler: Unfilled
APEX® Flexible Polyvinyl Chloride -- 01-A0303E-95
from Teknor Apex Company

Material Status. Commercial: Active. Availability. Africa & Middle East. Asia Pacific. Europe. Latin America. North America. Uses. Automotive Electronics. Insulation. Wire & Cable Applications. Wire Types. GPT. Agency Ratings. SAE J1128. RoHS Compliance. RoHS Compliant. Forms. Pellets [See More]

  • Industry: Automotive; Electronics; Automotive Electronics, Insulation, Wire & Cable Applications
  • Chemical System: Vinyl / PVC
  • Type: Thermoplastic
  • Form / Shape: Pellets
Xarec® EA Grade -- 513
from Idemitsu Chemicals USA Corporation

Offering the ability to comply with the most stringent U.L. 94 flammability requirements the Xarec EA products offer a cost effective means to take advantage of the value that a styrenic product can offer your electronic and electrical applications: superior electrical insulation & durability. A... [See More]

  • Industry: Electronics; Electrical Power or High Voltage
  • Chemical System: Styrene or Polystyrene
  • Type: MoldingCompound; Thermoplastic
  • Filler: Glass or FRP
Grilamid® Polyamide -- Grilamid 1S XE 4224 nat | PA1010
from EMS-GRIVORY America

Characteristics. Processing. Extrusion - cast film, Other Extrusion. Delivery form. Granules. Special Characteristics. Improved UV resistance (outdoor use), Improved heat resistance. Regional Availability. North America, Europe, Asia Pacific, South and Central America, Near East/Africa. Product... [See More]

  • Industry: Automotive; Electronics
  • Chemical System: Polyamide
  • Type: ExtrusionGrade; FilmGrade; Thermoplastic
  • Filler: Unfilled
TECHNOMELT AS 8998 -- AS 8998
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Industry: Electronics
  • Form / Shape: Pellets
  • Type: MoldingCompound; Thermoplastic
  • Features: UL; Thermally Conductive
Eastar™ GN120 Copolyester
from Eastman Chemical Company

Eastar ™ GN120 Copolyester is a high flow product and contains a mold release. Other outstanding features of Eastar ™ GN120 are easily maintained such as excellent appearance and clarity, good physical properties, chemical resistance, and easy processing. Eastar ™ GN120 is for sale... [See More]

  • Industry: Electronics
  • Chemical System: Thermoplastic Polyester (PET, PBT, etc.)
  • Type: Thermoplastic
  • Deflection Temperature: 140
Meldin® Polyimide Material -- 7001
from Saint-Gobain Performance Plastics - High Performance Seals, Polymer Components and Springs

This grade offers the maximum mechanical properties and high chemical resistance. The Meldin 7001 grade is ideal for electrical and thermal insulating applications. [See More]

  • Industry: Aerospace; Automotive; Electronics; Sanitary; Military; OEM or Industrial
  • Chemical System: Polyimide or Bismaleimide (BMI)
  • Type: Thermally cured
  • Filler: Unfilled
PEEK Polymer Resin -- VICTREX® 150CA30
from Victrex USA, Inc.

High performance thermoplastic material, 30% carbon fibre reinforced PolyEtherEtherKetone (PEEK), semi crystalline, granules for injection moulding, easy flow, FDA food contact compliant, colour black. [See More]

  • Industry: Aerospace; Automotive; Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging; Energy,Textile, Industrial,Food, Oil/Gas
  • Chemical System: PEEK
  • Type: MoldingCompound; Thermoplastic
  • Filler: Carbon or Graphite
TORAYCON® Polybutylene Terephthalate (PBT) Resin
from Toray Industries (America), Inc.

TORAYCON ® PBT resin is a polyester-based thermoplastic resin developed by combining Toray's technological expertise in polyester polymerization and resin-reinforced composites. Featuring outstanding long-term heat-resistance, chemical-resistance, weather resistance and electrical... [See More]

  • Industry: Automotive; Electronics
  • Chemical System: Thermoplastic Polyester (PET, PBT, etc.)
  • Type: MoldingCompound; Thermoplastic
Di-Pak™ E-4500 Elastomeric Eletrical Insulating Compound -- E-4540
from Hapco, Inc.

Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available. [See More]

  • Industry: Electronics
  • Filler: Unfilled
  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
Bronze-filled PTFE
from Fluoro-Plastics, Inc.

High percentage of bronze powder (40-60%) yields high thermal conductivity and better creep resistance. Often used in hydraulic systems, particularly superb as linear bearings, e.g. slides, gibs, guide ways. Not suited for electrical applications. Bronze is attacked by certain chemicals. Compare... [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: Thermoplastic
  • Filler: Metal or MIM
ABS -- TECARAN ABS Natural
from Ensinger North America

Ensinger TECARAN ABS material is a terpolymer and an amorphous resin. It is manufactured by combining three different compounds. The three that make up TECARAN ABS are acrylonitrile, butadiene, and styrene. TECARAN ABS occupies the unique position of being a bridge between the general industrial and... [See More]

  • Industry: Automotive; Electronics; Sanitary
  • Chemical System: ABS
  • Type: Thermoplastic
  • Deflection Temperature: 177 to 200
Specialty Conducting Polymers -- 4002
from Rieke Metals, Inc.

Poly(3-hexylthiophene-2,5-diyl ),Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity.. P3HT. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn /... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
DuPont™ ETPV Engineering Thermoplastic Vulcanizate -- 95A02HS BK001
from DuPont Plastics, Polymers & Resins

The thermoplastic rubber that resists oil and heat. DuPont ™ ETPV 95A02HS BK001 is a thermoplastic rubber with excellent oil and heat resistance with additional heat stabilizer. It can be processed by thermoplastic processing techniques such as extrusion and blow molding. DuPont ™ ETPV... [See More]

  • Industry: Electronics
  • Tensile (Break): 1958
  • Type: Thermoplastic
  • Elongation: 223.0
Elexar® Thermoplastic Elastomer -- EL-8431
from Teknor Apex Company

Material Status. Commercial: Active. Availability. Africa & Middle East. Asia Pacific. Europe. Latin America. North America. Uses. Appliance Wire Insulation. Appliance Wire Jacketing. Cable Jacketing. Connectors. Electrical/Electronic Applications. Flexible Cord Jacketing. Industrial Cable... [See More]

  • Industry: Electronics; OEM or Industrial; Appliance Wire Insulation, Appliance Wire Jacketing, Cable Jacketing, Connectors, Electrical/Electronic, Flexible Cord Jacketing, Industrial Cable ..
  • Form / Shape: Pellets
  • Type: ExtrusionGrade; Thermoplastic
  • Tensile (Break): 2800
Xarec® EA Grade -- 522
from Idemitsu Chemicals USA Corporation

Offering the ability to comply with the most stringent U.L. 94 flammability requirements the Xarec EA products offer a cost effective means to take advantage of the value that a styrenic product can offer your electronic and electrical applications: superior electrical insulation & durability. A... [See More]

  • Industry: Electronics; Electrical Power or High Voltage
  • Chemical System: Styrene or Polystyrene
  • Type: MoldingCompound; Thermoplastic
  • Filler: Glass or FRP
TECHNOMELT PA 2384 -- 8807299842049
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Industry: Electronics
  • Chemical System: Polyamide; Polyimide or Bismaleimide (BMI)
  • Type: MoldingCompound; Thermoplastic
  • Form / Shape: Pellets
TORELINA® Polyphenylene Sulfide (PPS) Resin
from Toray Industries (America), Inc.

Toray's high-performance engineering plastic TORELINA ® resin boasts excellent heat resistance, flame retardancy and chemical resistance, physical strength, and its superb fluidity leads to outstanding dimensional precision. These characteristics make it ideal for a wide range of applications:... [See More]

  • Industry: Automotive; Electronics
  • Features: Flame Retardant
  • Type: MoldingCompound; Thermoplastic
Di-Pak™ E-4600 Elastomeric Eletrical Insulating Compound -- E-4650
from Hapco, Inc.

Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented. [See More]

  • Industry: Electronics
  • Filler: Unfilled
  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
Carbon Fiber-filled PTFE
from Fluoro-Plastics, Inc.

Lower deformation under load. Higher compressive and flex modulus and increased hardness. Chemically inert –can be used in strong alkali and in HF, where glass reinforced compounds fail. Good initial wear and rubbing or sliding characteristics in both dry and water applications. Frequently... [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: Thermoplastic
  • Filler: Carbon or Graphite
Ceramic Filled PEEK -- TECAPEEK CMF White
from Ensinger North America

TECAPEEK CMF is a composite material based on Victrex ® PEEK 450G polymer, that is filled with ceramic. This materials has been specifically designed with the requirements of the semiconductor industry in mind. Because of the often intricate designs necessary for parts such as test sockets,... [See More]

  • Industry: Electronics; Electrical Power or High Voltage; Semiconductors or IC Packaging
  • Chemical System: PEEK
  • Type: Thermoplastic
  • Filler: Ceramic
Specialty Conducting Polymers -- 4002-E
from Rieke Metals, Inc.

Poly(3-hexylthiophene-2,5-diyl ),Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity.. P3HT. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn /... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Telcar® Thermoplastic Elastomer -- TL-8431
from Teknor Apex Company

Material Status. Commercial: Active. Availability. Africa & Middle East. Asia Pacific. Europe. Latin America. North America. Uses. Appliance Wire Insulation. Appliance Wire Jacketing. Cable Jacketing. Connectors. Electrical/Electronic Applications. Flexible Cord Jacketing. Industrial Cable... [See More]

  • Industry: Electronics; OEM or Industrial; Appliance Wire Insulation, Appliance Wire Jacketing, Cable Jacketing, Connectors, Electrical/Electronic, Flexible Cord Jacketing, Industrial Cable ..
  • Form / Shape: Pellets
  • Type: ExtrusionGrade; Thermoplastic
  • Tensile (Break): 2800
Xarec® EA Grade -- 533
from Idemitsu Chemicals USA Corporation

Material: Xarec EA533. Lower hydraulic pressure, better flow than PBT. Better dimensional stability than PBT. Faster cycle time than PBT. Better electrical durability than PBT. Application Requirements: UL 94 V0. Good dimensional stability. [See More]

  • Industry: Electronics; Electrical Power or High Voltage
  • Chemical System: Styrene or Polystyrene
  • Type: MoldingCompound; Thermoplastic
  • Filler: Glass or FRP
TECHNOMELT PA 2692
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Industry: Electronics
  • Chemical System: Polyamide; Polyimide or Bismaleimide (BMI)
  • Type: MoldingCompound; Thermoplastic
  • Form / Shape: Pellets
TOYOLAC® ABS Resin
from Toray Industries (America), Inc.

TOYOLAC ® ABS resin has an attractive appearance, well-balanced physical properties, and excellent moldability. It is used in a wide range of applications, from office equipment such as photocopiers to interior and exterior automobile components, household electrical goods, and miscellaneous... [See More]

  • Industry: Automotive; Electronics
  • Chemical System: ABS
  • Type: MoldingCompound; Thermoplastic
  • Features: Anti-static or ESD Control
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4888
from Hapco, Inc.

High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications. [See More]

  • Industry: Electronics
  • Filler: Unfilled
  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
Extruded Tube PTFE
from Fluoro-Plastics, Inc.

Surf Technologies is a leader in the manufacture of heavy walled PTFE tube, both in standard inch sizes and in AWG sizes. Tube is used in fluid handling applications for high temperature acids and caustics or where contamination is an issue, such as in wire braided hose. In applications where PTFE's... [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: ExtrusionGrade; Thermoplastic
  • Filler: Unfilled
Glass Fiber Filled PPE -- TECANYL GF30 Natural
from Ensinger North America

PPE GF30 is a special 30% glass fibre reinforced product which is manufactured by Ensinger under the trade name TECANYL GF30. In comparison to unfilled TECANYL, the glass filled modification demonstrates optimized properties in a number of areas. It has a high rigidity, high mechanical strength,... [See More]

  • Industry: Automotive; Electronics; Electrical Power or High Voltage
  • Filler: Glass or FRP
  • Type: Thermoplastic
  • Thermal Conductivity: 0.2800
Specialty Conducting Polymers -- 4002-EE
from Rieke Metals, Inc.

Poly(3-hexylthiophene-2,5-diyl ),Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity.. P3HT. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn /... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Xarec® N WA Grade -- 7020-02
from Idemitsu Chemicals USA Corporation

Material: Xarec N WA 7020, WA212. Better property retention after USCAR 3 & 4 vs. PBT. Lower hydraulic pressure, better flow than PBT. Better dimensional stability than PBT. Faster cycle time than PBT. Application Requirements: USCAR 2, 3 or 4. Good dimensional stability. [See More]

  • Industry: Automotive; Electronics
  • Chemical System: Polyamide; Styrene or Polystyrene
  • Type: MoldingCompound; Thermoplastic
  • Filler: Glass or FRP; Nylon
TECHNOMELT PA 341 -- 8802588327937
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Industry: Electronics
  • Chemical System: Polyamide; Polyimide or Bismaleimide (BMI)
  • Type: MoldingCompound; Thermoplastic
  • Form / Shape: Pellets
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4901-2
from Hapco, Inc.

Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds. [See More]

  • Industry: Electronics
  • Filler: Unfilled
  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
Glass-filled Compounded PTFE
from Fluoro-Plastics, Inc.

Most widely used filler in various percentages (5%, 10%, 15% and 25%). Improves creep resistance, both at low and high temperatures. Chemically stable (except for strong alkalis and hydrofluoric acid (HF). Little effect on the electrical properties of PTFE, and improves wear and friction behavior. [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: ExtrusionGrade; Thermoplastic
  • Filler: Glass or FRP
Polyphenylene Oxide -- TECANYL® Black
from Ensinger North America

#8203;TECANYL PPE black, (made with Noryl ® EN265) due to its inherent chemical composition, exhibits unusually low moisture absorption. Therefore, good electrical insulating properties are realized over a wide range of humidity and temperature conditions. Chemical attack from water, most salt... [See More]

  • Industry: Automotive; Electronics; Electrical Power or High Voltage; Sanitary
  • Chemical System: Polyphenylene Oxide
  • Type: Thermoplastic
  • Filler: Glass or FRP
Specialty Conducting Polymers -- 4003
from Rieke Metals, Inc.

Poly(3-octylthiophene-2,5-diyl ), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Xarec® S Grade -- 931
from Idemitsu Chemicals USA Corporation

Lower dielectric heating than PPS due to low dissipation factor. Easier processing than PPS. Lower cost than PPS. Application Requirements: Heat and chemical resistance. Dimensional stability for part flatness. [See More]

  • Industry: Electronics; OEM or Industrial
  • Chemical System: Styrene or Polystyrene
  • Type: MoldingCompound; Thermoplastic
  • Filler: Glass or FRP
TECHNOMELT PA 5375 -- 8807332478977
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Industry: Electronics
  • Form / Shape: Pellets
  • Type: MoldingCompound; Thermoplastic
  • Features: UL; Thermally Conductive
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4200
from Hapco, Inc.

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

  • Industry: Electronics
  • Filler: Unfilled
  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
Glass-Moly-filled PTFE
from Fluoro-Plastics, Inc.

Adds to hardness and stiffness. Reduces friction, especially starting coefficient of friction and steady-state wear. Effect on electrical properties is negligible. Unreactive chemically, and dissolves only in strong oxidizing acids [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: Thermoplastic
  • Filler: Glass or FRP
Polyphenylsulfone -- TECASON® P Black
from Ensinger North America

#8203;Offering a level of performance above polysulfones, Ensinger's industrial grade TECASON P has increased temperature, impact and chemical resistance properties, as well as excellent resistance to repeated steam sterilization (autoclave) cycles. Main Features: High strength. High thermal and... [See More]

  • Industry: Electronics; Sanitary
  • Deflection Temperature: 405
  • Type: Thermoplastic
  • Thermal Conductivity: 0.2510
Specialty Conducting Polymers -- 4003-E
from Rieke Metals, Inc.

Poly(3-octylthiophene-2,5-diyl ), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
TECHNOMELT PA 6208 Black -- 8799566462977
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Industry: Electronics
  • Chemical System: Polyamide; Polyimide or Bismaleimide (BMI)
  • Type: MoldingCompound; Thermoplastic
  • Form / Shape: Pellets
Graphite-filled PTFE
from Fluoro-Plastics, Inc.

Crystalline modification of high purity carbon. Excellent wear properties, particularly against soft metals. High load-carrying capability in high speed contact applications. Chemically inert. Frequently used with other filler, e.g. carbon [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: Thermoplastic
  • Filler: Carbon or Graphite
POM-H -- DELRIN 511 Series Acetal Homopolymer
from Ensinger North America

DELRIN 511P is another Homopolymer acetal from DuPont that offers enhanced crystallization characteristics. This higher level of crystallization helps to augment aspects of the physical properties such as fatigue strength, stiffness, and creep resistance. Main Features: Good Machinability. High... [See More]

  • Industry: Automotive; Electronics; Sanitary; Repair or Construction; OEM or Industrial
  • Chemical System: Acetal or Polyoxymethylene (POM)
  • Type: Thermoplastic
  • Deflection Temperature: 325
Specialty Conducting Polymers -- 4004
from Rieke Metals, Inc.

Poly(3-decylthiophene-2,5-diyl ), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / < 0.7%... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
TECHNOMELT PA 668 Clear
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Industry: Electronics
  • Chemical System: Polyamide; Polyimide or Bismaleimide (BMI)
  • Type: MoldingCompound; Thermoplastic
  • Form / Shape: Pellets
Mineral-filled PTFE
from Fluoro-Plastics, Inc.

PTFE with FDA compliant filler. For food processing and pharmaceutical bearing applications. Compatible with a wide variety of mating surfaces, both soft (e.g. mild steel) and harder surfaces. Compare this product to Rulon 641* [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: Thermoplastic
  • Filler: Mineral or Inorganic
POM-H -- DELRIN® Series Black
from Ensinger North America

Delrin 150 black is a homopolymer acetal material that is manufactured by Ensinger (using black DuPont ™ Delrin ® resin) and sold under the tradename TECAFORM AD black. Delrin 150 black exhibits a high melting point and high strength, but is sensitive to hydrolysis with continuous exposure... [See More]

  • Industry: Automotive; Electronics; Repair or Construction; OEM or Industrial
  • Chemical System: Acetal or Polyoxymethylene (POM)
  • Type: Thermoplastic
  • Deflection Temperature: 208
Specialty Conducting Polymers -- 4005
from Rieke Metals, Inc.

Poly(3-dodecylthiophene-2,5-diyl), Highly regioregular Electronic Grade. Typical results are between 90% and 93% regioregularity. The "E" series typically contains less than 0.04% Ni / < 0.02% Zn / < 0.04% Br. The "standard" series typically contains less than 0.1% Ni / < 0.5% Zn / <... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Polyimide-filled PTFE
from Fluoro-Plastics, Inc.

Low Friction. Extremely low wear. Increased hardness. Operates well against soft mating surfaces like aluminum, mild steel, brass and plastics. Ideal for stop-start applications to eliminate stick-slip. Compare this product to Rulon J* [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: Thermoplastic
  • Filler: Mineral or Inorganic
Unfilled PEI -- TECAPEI™ Black
from Ensinger North America

TECAPEI black Ultem is a polyetherimide material with high mechanical strength and rigidity, that is also known for its good electrical properties. This material has a remarkably high creep resistance over a wide range of temperatures and furthermore, polyetherimides have a high permanent operating... [See More]

  • Industry: Aerospace; Automotive; Electronics; Sanitary; Semiconductors or IC Packaging
  • Chemical System: Polyetherimide
  • Type: Thermoplastic
  • Filler: Unfilled
Specialty Conducting Polymers -- 4006
from Rieke Metals, Inc.

poly(3-butylthiophene-2,5-diyl ),regiorandom [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
PTFE Plate
from Fluoro-Plastics, Inc.

Molded plate is available in thicknesses from 3/8ths of an inch up to four inches. Plate is inventoried in sizes from one-foot square to four feet square (sixteen square feet per sheet). Thickness tolerances range from plus .038" to minus .019" for 3/8th ” plate, up to plus .087", minus .043"... [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: ExtrusionGrade; Thermoplastic
  • Filler: Unfilled
Unfilled PEI -- TECAPEI™ Natural
from Ensinger North America

TECAPEI natural (PEI) is an unreinforced polyetherimide, suitable for contact with foods, that exhibits high mechanical strength and rigidity. The characteristic profile includes very good hydrolysis resistance, and dimensional stability, combined with a relatively high long term service... [See More]

  • Industry: Aerospace; Automotive; Electronics; Energy Conversion (Battery / Fuel Cell); Semiconductors or IC Packaging
  • Chemical System: Polyetherimide
  • Type: Thermoplastic
  • Filler: Unfilled
Specialty Conducting Polymers -- 4007
from Rieke Metals, Inc.

poly(3-hexylthiophene-2,5-diyl ),regiorandom [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
PTFE Rod
from Fluoro-Plastics, Inc.

Rod is available in both virgin grades and reprocessed (mechanical) for less demanding applications. Surf Technologies extrudes rod in all standard sizes from 1/8th inch diameter up to 4 inches in diameter. Rod is inventoried in twelve foot lengths so it can be cut into six foot lengths (UPS... [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: ExtrusionGrade; Thermoplastic
  • Filler: Unfilled
Unfilled Polyimide -- TECASINT 2011 Brown
from Ensinger North America

TECASINT 2011 is one of the unfilled natural grades. It has a very high modulus of elasticity, high rigidity and hardness. Compared with TECASINT 1011 it has significantly reduced moisture absorption, higher toughness and better machining properties. Within the TECASINT 2000 series the material has... [See More]

  • Industry: Aerospace; Electronics; Sanitary; Semiconductors or IC Packaging
  • Chemical System: Polyimide or Bismaleimide (BMI)
  • Type: Thermoplastic; Thermally cured
  • Filler: Unfilled
Specialty Conducting Polymers -- 4008
from Rieke Metals, Inc.

poly(3-octylthiophene-2,5-diyl ),regiorandom [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
PTFE Sheet
from Fluoro-Plastics, Inc.

Skived sheet can be made in any thickness from 15 mils up to .250 inches. Fluoro-Plastics technology makes it possible to make in-between sizes. Thickness tolerances range from .0005 for sizes from .002" thick to .005" thick up to .003" tolerance for material that is over .060" thick. Skived sheet... [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: ExtrusionGrade; Thermoplastic
  • Filler: Unfilled
Unfilled PSU -- TECASON ® S Natural
from Ensinger North America

TECASON S - PSU - is a transparent engineering plastic known for its chemical resistance, rigidity, and high-temperature performance. The polysulfone material's ability to operate in an autoclave environment while maintaining its excellent mechanical properties over a wide range of temperatures is... [See More]

  • Industry: Electronics; Sanitary; Semiconductors or IC Packaging
  • Chemical System: Polysulphone
  • Type: Thermoplastic
  • Filler: Unfilled
Specialty Conducting Polymers -- 4009
from Rieke Metals, Inc.

poly(3-decylthiophene-2,5-diyl ),regiorandom [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Stainless Steel-filled PTFE
from Fluoro-Plastics, Inc.

Extremely stiff and hard. High loading percentage (50% generally). Available in molded sheet only [See More]

  • Industry: Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging
  • Chemical System: Fluoropolymer
  • Type: Thermoplastic
  • Filler: Metal or MIM
Unreinforced Polyamide-imide -- TECAPAI® CM XP403 Green
from Ensinger North America

TECAPAI CM XP403 green is a compression molded Torlon ® plastic material that is unreinforced and delivers an excellent combination of physical properties. Made from Solvay Torlon ® powder, this PAI material offers excellent ductility and toughness as well as good strength and stiffness at... [See More]

  • Industry: Aerospace; Electronics
  • Chemical System: Polyamide-imide
  • Type: Thermoplastic
  • Deflection Temperature: 494
Specialty Conducting Polymers -- 4010
from Rieke Metals, Inc.

poly(3-dodecylthiophene-2,5-diyl ),regiorandom [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Specialty Conducting Polymers -- 4011
from Rieke Metals, Inc.

polythiophene-2,5-diyl. Please contact us at sales@riekemetals.com for ordering and bulk pricing. Our products are available in an electronic database in either .db or .sd formats. Highly regioregular (98.5% or higher) as well as the regiorandom (1:1:1:1) poly(3-alkylthiophene-2,5-diyl) polymers... [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Specialty Conducting Polymers -- 4013
from Rieke Metals, Inc.

Poly(3-pentylthiophene-2,5-diyl), Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Specialty Conducting Polymers -- 4016
from Rieke Metals, Inc.

Poly(3-heptylthiophene-2,5-diyl), Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Specialty Conducting Polymers -- 4020
from Rieke Metals, Inc.

Poly[3-(ethyl-4-butanoate)thiophene-2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Specialty Conducting Polymers -- 4021
from Rieke Metals, Inc.

Poly[3-(potassium-4-butanoate)thiophene-2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Specialty Conducting Polymers -- 4022
from Rieke Metals, Inc.

Poly[3-(potassium-5-pentanoate)thiophene-2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Specialty Conducting Polymers -- 4023
from Rieke Metals, Inc.

Poly[3-(ethyl-5-pentanoate)thiophene-2,5-diyl],Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Specialty Conducting Polymers -- 4024
from Rieke Metals, Inc.

Poly[3-(potassium -6-hexanoate)thiophene-2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Specialty Conducting Polymers -- 4025
from Rieke Metals, Inc.

Poly[3-(ethyl-6-hexanoate)thiophene-2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid
Specialty Conducting Polymers -- 4026
from Rieke Metals, Inc.

Poly[3-(potassium-7-heptanoate)thiophene-2,5-diyl], Highly regioregular. Typical results are between 90% and 93% regioregularity. [See More]

  • Industry: Electronics; Semiconductors or IC Packaging
  • Filler: Unfilled
  • Type: Thermoplastic
  • Form / Shape: Liquid