Thermoset Polymers and Plastic Resins

45 Results
ELAN-Cast® -- E 2154 Orange Resin / C 2154 Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Type: CastingResin; Thermally cured
  • Filler: Mineral or Inorganic
  • Chemical System: Epoxy
  • Form / Shape: Liquid
Electrically Insulative, Two Component Epoxy System -- EP30M3LV-NV
from Master Bond, Inc.

Master Bond Polymer System EP30M3LV is a low viscosity, two component epoxy compound for high performance, chemical resistant casting and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix ratio. This... [See More]

  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
High Performance Polyimide Wire Enamels -- ULTRATHERM
from ELANTAS PDG, Inc.

ULTRATHERM TM resins are high performance polyimide wire enamels. Applied in the form of a polyamic acid solution, the resin is converted with heat to a continuous film coating resulting in excellent resistance to radiation, chemicals, and cryogenic temperatures. [See More]

  • Type: Thermally cured
  • Industry: Electronics; Electrical Power or High Voltage
  • Chemical System: Polyimide or Bismaleimide (BMI)
Epoxy Has Low Thermal Expansion Coefficient -- EP30LTE-LO
from Master Bond, Inc.

Master Bond Polymer System EP30LTE-LO is a recently developed thermal shock resistant epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, sealing and casting. This new two component epoxy resin compound which cures... [See More]

  • Type: CastingResin; Optical; Thermally cured
  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
Flexibilized and Toughened Low Viscosity Epoxy -- EP21FL
from Master Bond, Inc.

Master Bond Polymer System EP21FL is a low to moderate viscosity, two component epoxy resin system for high performance casting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This compound... [See More]

  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
Highly Flexible Two Part Epoxy -- EP21TDC-7
from Master Bond, Inc.

Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The cured... [See More]

  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
  • Chemical System: Epoxy; Polyurethane
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Military; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
Liquid Epoxy EP30F Resists Abrasion and Chemicals -- EP30F
from Master Bond, Inc.

Master Bond Polymer System EP30F is a new fast curing liquid epoxy resin compound for high perform-ance abrasion and chemical resistant seamless floors. This easy-to-use two component epoxy resin system offers a uniquely attractive combination of application and performance properties including... [See More]

  • Type: CastingResin; Optical; Thermally cured
  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
Low Outgassing Two Component Epoxy -- EP30-2
from Master Bond, Inc.

Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly at elevated temperatures with a 100/10 mix ratio by weight. This resin system is 100% reactive and does... [See More]

  • Type: CastingResin; Optical; Thermally cured
  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Type: CastingResin; Optical; Thermally cured
  • Filler: Unfilled
  • Chemical System: Epoxy
  • Industry: Electronics; Electrical Power or High Voltage; Optoelectronics or Photonics
Low Viscosity Thermally Conductive Epoxy -- EP112AO
from Master Bond, Inc.

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

  • Type: CastingResin; Thermally cured
  • Industry: Electronics; Electrical Power or High Voltage
  • Chemical System: Epoxy
  • Features: Thermally Conductive
Low Viscosity, Flexibilized Two Component Epoxy -- EP30FL
from Master Bond, Inc.

Master Bond Polymer System EP30FL is a low viscosity, flexibilized, two component epoxy resin system for high performance potting, casting, encapsulation as well as bonding and sealing. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1)... [See More]

  • Type: CastingResin; Optical; Thermally cured
  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
Low Viscosity, Two Component Epoxy -- EP30-1NV
from Master Bond, Inc.

Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This... [See More]

  • Type: CastingResin; Optical; Thermally cured
  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
NASA Low Outgassing Approved Epoxy System -- EP30LTE
from Master Bond, Inc.

Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, coating, sealing and casting. This new two component epoxy resin compound cures readily at ambient or more... [See More]

  • Type: CastingResin; Optical; Thermally cured
  • Filler: Mineral or Inorganic
  • Chemical System: Epoxy
  • Form / Shape: Liquid
Two Component Epoxy -- EP121CL
from Master Bond, Inc.

Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation for service up to 450-500 °F. It cures... [See More]

  • Type: CastingResin; Thermally cured
  • Filler: Unfilled
  • Chemical System: Epoxy
  • Industry: Electronics; Electrical Power or High Voltage; Optoelectronics or Photonics
Two Component Optically Clear Epoxy Compound -- EP30HV
from Master Bond, Inc.

Master Bond Polymer System EP30HV is a low viscosity, two component epoxy system for high performance bonding, sealing, coating and casting. It is formulated to cure at room temperature or more rapidly at elevated temperatures. It has an easy to use, non-critical 4 to 1 mix ratio by weight. This... [See More]

  • Type: CastingResin; Optical; Thermally cured
  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Sanitary; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
Two Component Polymer System -- EP21CLV
from Master Bond, Inc.

Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more... [See More]

  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
  • Chemical System: Epoxy
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
Two Component, Epoxy Resin Systems -- EP21LSCL-1
from Master Bond, Inc.

Master Bond EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring superb optical clarity as well as outstanding non-yellowing properties. This system has a forgiving mix ratio of 100 to 60 by weight. It will cure readily at 75°F in 3-5 days or 3-4 hours at 150-200°F. The optimum... [See More]

  • Type: CastingResin; Thermally cured
  • Filler: Metal or MIM
  • Chemical System: Epoxy
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Optoelectronics or Photonics; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
Two Component, Highly Flexibilized Epoxy for Bonding, Sealing and Coating -- EP21TDC-4
from Master Bond, Inc.

Master Bond Polymer System EP21TDC-4 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one-to-four mix ratio by weight. The cured... [See More]

  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
  • Chemical System: Epoxy; Polyurethane
  • Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Military; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
Pre-Preg Product -- NP101B
from Norplex-Micarta

NP101B pre-preg consists of woven nylon fabric combined with a high-temperature phenolic resin system. NP101B provides excellent electrical properties under high humidity conditions, good flexural, compressive, and impact strength at elevated temperatures, but the cold flow under load (creep) is... [See More]

  • Type: MoldingCompound; Thermally cured
  • Filler: Nylon Fabric
  • Chemical System: Phenolics or Formaldehyde Resins
Composite Resins
from Georgia-Pacific Corporation

Fiber-reinforced polymer (FRP) composites are used to replace typical structural materials of steel, metal, aluminum and wood. GP Chemicals offers a complete line of products that includes GP ® and RESI-LAM ® resins for this market. In FRP applications with fire safety concerns or... [See More]

  • Type: CastingResin; Thermally cured
  • Filler: Aramid
  • Chemical System: Phenolics or Formaldehyde Resins
Fluoroelastomer Polymers -- 3M™ Dyneon™ Fluoropolymers
from 3M Advanced Materials Division

In 1969, astronauts boarded the Apollo 11 spacecraft wearing boots containing 3M ™ Dyneon ™ Fluoroelastomers. Today, these synthetic elastomeric materials are used in some of the toughest environments on earth. From hot-running automotive engines to harsh chemicals of semiconductor... [See More]

  • Type: ExtrusionGrade; FilmGrade; MoldingCompound; Optical; Thermoplastic; Thermally cured
  • Filler: Unfilled
  • Chemical System: Polypropylene; Polyamide; Fluoropolymer
  • Form / Shape: Liquid; Pellets
Microparticles, E Series
from Esprix Technologies

Melamine. Benzoguanamine. Spherical Powders. Characteristics. Thermoset spherical powders produced from Melamine and Benzoguanamine with excellent heat, solvent, alkaline, and acid resistance. High mechanical strength. Positive charge (+). Applications. Flatting agent. Anti-blocking agent. Light... [See More]

  • Type: Thermally cured
  • Form / Shape: Pellets
  • Chemical System: Phenolics or Formaldehyde Resins
Aluminum Filled Epoxy Resin -- 70-3810
from Epoxies Etc...

70-3810 is a low viscosity, aluminum filled epoxy casting and tooling resin. This system is used for making heat resistant cast tools or parts that require high heat resistance and thermal conductivity. 70-3810 utilizes a new polymer resin that offers better heat resistance than most commercially... [See More]

  • Type: CastingResin; Thermally cured
  • Filler: Metal or MIM
  • Chemical System: Epoxy
  • Form / Shape: Liquid
Biocompatible, Spectrally Transparent Epoxy -- EPO-TEK® MED-301
from Epoxy Technology

EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]

  • Type: CastingResin; Optical; Thermally cured
  • Filler: Unfilled
  • Chemical System: Epoxy
  • Form / Shape: Liquid
Thermoset Silicone Resin - Polyaddition Heat Curing - Translucent -- Bluesil™ Resin 21385 A/B
from Bluestar Silicones USA Corp.

Resin - Polyaddition heat curing - Translucent. Solventless, Quick curing, Good release properties, Good bath stability. Outstanding thermal stability, High adhesion to many substrates, Engine fluids resistance (Lubricant, Cooling liquid, …). Properties. Viscosity 8500. Description. [See More]

  • Type: Thermally cured
  • Filler: Unfilled
  • Chemical System: Silicone
  • Form / Shape: Liquid
40 A Durometer Black Nitrile -- 4140
from Real Seal Company

Engineered Thermoset Rubber Components. Rubber has its own unique array of available materials and associated properties, and can be produced in almost any conceivable configuration, including bonding to metal components. Rubber materials possess some physical properties that are superior to many... [See More]

  • Type: MoldingCompound; Thermally cured
  • Form / Shape: Pellets
  • Filler: Unfilled
  • Industry: Automotive; Repair or Construction; OEM or Industrial; Tooling
Epoxy and Polyurethane Based Resin System -- VORAFORCE TR 500/1500 series
from Dow Polyurethanes

Epoxy and Polyurethane based systems for high pressure closed mold injection using glass and carbon fiber mat reinforcements. Key Benefits. – Fast cure for short cycle times. – Excellent wetting for highest strength and impact resistant parts. – Suitable for thin wall design [See More]

  • Type: CastingResin; Thermally cured
  • Filler: Unfilled
  • Chemical System: Epoxy; Polyurethane
  • Industry: Electrical Power or High Voltage; Window Liners, Electrical Encapsulation, Manhole Covers, Delivery Pallets
Meldin® Polyimide Material -- 7001
from Saint-Gobain Performance Plastics - High Performance Seals, Polymer Components and Springs

This grade offers the maximum mechanical properties and high chemical resistance. The Meldin 7001 grade is ideal for electrical and thermal insulating applications. [See More]

  • Type: Thermally cured
  • Filler: Unfilled
  • Chemical System: Polyimide or Bismaleimide (BMI)
  • Industry: Aerospace; Automotive; Electronics; Sanitary; Military; OEM or Industrial
Abrasive Adhesion Resins
from Georgia-Pacific Chemicals LLC

Urea-formaldehyde and phenol-formaldehyde resins are used for grit adhesion to various substrates in coated abrasives, bonded abrasives and wheels, and scrub pads. They are formulated to provide grain bonding in various substrates and high water tolerance with a light color that allows for the... [See More]

  • Type: Thermally cured
  • Filler: Unfilled
  • Chemical System: Phenolics or Formaldehyde Resins
  • Form / Shape: Liquid
Sanitary Silicone Glazing, Perimeter, & Joint Sealant -- ELASTOSIL® 5100
from Wacker Chemical Corp.

ELASTOSIL ® 5100 is a one-component, acid-curing, low modulus silicone sealant for sanitary applications. Special features. suitable for use in sanitary areas. non-sag. ready gunnability at low (+ 5 °C) and high (+ 40 °C) temperatures. flexible at low (- 40 °C) and high temperatures... [See More]

  • Type: ExtrusionGrade; Thermally cured
  • Filler: Unfilled
  • Chemical System: Silicone
  • Industry: Sanitary; Repair or Construction
Di-Pak™ E-4000 Series Elastomeric Eletrical Insulating Compound -- E-4021
from Hapco, Inc.

Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]

  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
  • Filler: Unfilled
  • Industry: Electronics
Plug Assist Thermoplastic -- FORMPLAST® 2000
from Ensinger North America

FORMPLAST 2000 is a thermoplastic composite material with superior properties for use in thermoforming plug assist applications. FORMPLAST 2000 has a micro-porosity of 15-19 compared to 20-30 for Syntactic Foam. FORMPLAST 2000 eliminates many of the problems associated with Syntactic Foam, machined... [See More]

  • Type: Thermally cured
  • Deflection Temperature: 241
  • Chemical System: Polyurethane
  • Thermal Conductivity: 0.3220
Epoxy Hardener Novolac Modifier Resins
from Georgia-Pacific Chemicals LLC

These phenolic novolac resins are used as curing agents for epoxy resins in molding compounds, copper clad laminates, electrical applications and potting. [See More]

  • Type: Thermally cured
  • Filler: Unfilled
  • Chemical System: Phenolics or Formaldehyde Resins
  • Form / Shape: Liquid
Di-Pak™ E-4500 Elastomeric Eletrical Insulating Compound -- E-4540
from Hapco, Inc.

Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available. [See More]

  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
  • Filler: Unfilled
  • Industry: Electronics
Rigid Polyurethane -- HYDEX® 202
from Ensinger North America

Hydex 202 is a totally rigid polyurethane product that exhibits a broad range of chemical resistance, as well as superior impact and excellent mechanical properties. It can be used for any mechanical application that requires a combination of toughness, dimensional stability and chemical resistance. [See More]

  • Type: Thermally cured
  • Industry: Sanitary; OEM or Industrial
  • Chemical System: Polyurethane
  • Deflection Temperature: 280 to 290
GP® 4003 Resin
from Georgia-Pacific Chemicals LLC

GP ® 4003 resin is an aqueous dispersion designed as a modifier for latex and phenoxy resins to improve chemical resistance and adhesion for coatings on rigid substrates. [See More]

  • Type: Thermally cured
  • Filler: Unfilled
  • Chemical System: Phenolics or Formaldehyde Resins
  • Form / Shape: Liquid
Di-Pak™ E-4600 Elastomeric Eletrical Insulating Compound -- E-4650
from Hapco, Inc.

Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented. [See More]

  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
  • Filler: Unfilled
  • Industry: Electronics
Rigid Polyurethane -- HYDEX® 301
from Ensinger North America

Hydex 301 is clear totally rigid polyurethane material that is designed for use in harsher chemical environments. It combines excellent clarity when polished with a broad range of chemical resistance and outstanding practical toughness. Main Features: Broad chemical compatibility. Very good... [See More]

  • Type: Thermally cured
  • Industry: Sanitary; Semiconductors or IC Packaging
  • Chemical System: Polyurethane
  • Deflection Temperature: 170 to 280
GP® 5700 and 6700 Wood Adhesive Resins
from Georgia-Pacific Chemicals LLC

A family of neat wood adhesives resins used for in-plant mixing. They can be adjusted to accommodate the differences in customers ' processes. Our plywood and laminated veneer (LVL) resins are supplied in liquid form. They can be used with most hardwood and softwood species and are used for... [See More]

  • Type: Thermally cured
  • Filler: Unfilled
  • Chemical System: Phenolics or Formaldehyde Resins
  • Form / Shape: Liquid
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4888
from Hapco, Inc.

High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications. [See More]

  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
  • Filler: Unfilled
  • Industry: Electronics
Unfilled Polyimide -- TECASINT 2011 Brown
from Ensinger North America

TECASINT 2011 is one of the unfilled natural grades. It has a very high modulus of elasticity, high rigidity and hardness. Compared with TECASINT 1011 it has significantly reduced moisture absorption, higher toughness and better machining properties. Within the TECASINT 2000 series the material has... [See More]

  • Type: Thermoplastic; Thermally cured
  • Filler: Unfilled
  • Chemical System: Polyimide or Bismaleimide (BMI)
  • Industry: Aerospace; Electronics; Sanitary; Semiconductors or IC Packaging
LEAF FREE™ Insulation Resins
from Georgia-Pacific Chemicals LLC

A line of patented, formaldehyde-free, water-soluble thermosetting resins specifically designed to meet individual customer needs for insulation in residential, commercial and industrial (C&I) construction. [See More]

  • Type: Thermally cured
  • Filler: Unfilled
  • Chemical System: Phenolics or Formaldehyde Resins
  • Form / Shape: Liquid
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4901-2
from Hapco, Inc.

Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds. [See More]

  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
  • Filler: Unfilled
  • Industry: Electronics
Water-Soluble UF Glass Mat Resins
from Georgia-Pacific Chemicals LLC

A line of water-soluble UF resins specifically designed to meet individual customer needs such as good tensile, good tear and low emissions. Two types are available: 1) a patented, single-package resin that will not require latex modification and 2) a conventional resin that accepts latex... [See More]

  • Type: Thermally cured
  • Filler: Unfilled
  • Chemical System: Phenolics or Formaldehyde Resins
  • Form / Shape: Liquid
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4200
from Hapco, Inc.

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

  • Type: CastingResin; Thermally cured
  • Form / Shape: Liquid
  • Filler: Unfilled
  • Industry: Electronics