Aerospace Polymers and Plastic Resins
from Duvelco Limited
Ducoya® G001 is a remarkable material with unparalleled physical strength, elongation and toughness. Ducoya G001 can also continuously operate over a wide temperature range from near absolute zero to greater than 400°C in a favorable chemical environment. Its excellent electrical and thermal... [See More]
- Industry: Aerospace; Semiconductors or IC Packaging
- Chemical System: Polyimide or Bismaleimide (BMI)
- Type: Thermoplastic
- Filler: Unfilled
from ELANTAS North America LLC
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Industry: Aerospace; Electronics; OEM or Industrial; Tooling
- Chemical System: Epoxy
- Type: CastingResin; MoldingCompound; Thermally cured
- Filler: Mineral or Inorganic
from AGC Chemicals Americas, Inc.
AGC Fluor compounds Group has developed the next generation of non-conductive and anti-static compounds made with our Fluon ETFE based on the needs of our customers and OEMs. Improved adhesion, excellent conductivity levels, high temperature performance and a reliable supply chain are part of the... [See More]
- Industry: Aerospace; Co-Extrusion (Fuel Hose Applications)
- Chemical System: Fluoropolymer
- Type: MoldingCompound; Thermoplastic
- Filler: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP30M3LV is a low viscosity, two component epoxy compound for high performance, chemical resistant casting and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix ratio. This... [See More]
- Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
- Chemical System: Epoxy
- Type: CastingResin; Thermally cured
- Form / Shape: Liquid
from Victrex PLC
High performance thermoplastic material, 30% carbon fiber reinforced Poly Ether Ether Ketone (PEEK), semi crystalline, granules for injection molding, easy flow, FDA food contact compliant, color black. [See More]
- Industry: Aerospace; Automotive; Electronics; Sanitary; OEM or Industrial; Semiconductors or IC Packaging; Energy, Textile, Industrial, Food, Oil/Gas
- Chemical System: PEEK
- Type: MoldingCompound; Thermoplastic
- Filler: Carbon or Graphite
from Duvelco Limited
G021: High-performance polyimide with 15% graphite encapsulated into the polymer, combining low wear with balanced physical properties. [See More]
- Industry: Aerospace; Automotive
- Chemical System: Polyimide or Bismaleimide (BMI)
- Type: Thermoplastic
- Filler: Carbon or Graphite
from ELANTAS North America LLC
At any voltage, the quality and performance requirements that impregnating resins have to fulfill are exceedingly high, so as to exclude potential sources of danger from the outset. But in high-voltage use, these demands become many times greater. Resins for high-voltage use must be reliable so that... [See More]
- Industry: Aerospace; Electrical Power or High Voltage
- Chemical System: Epoxy; Thermoplastic Polyester (PET, PBT, etc.); Polyetherimide
- Type: Thermoplastic
from Master Bond, Inc.
Master Bond Polymer System EP30LTE-LO is a recently developed thermal shock resistant epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, sealing and casting. This new two component epoxy resin compound which cures... [See More]
- Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
- Chemical System: Epoxy
- Type: CastingResin; Optical; Thermally cured
- Form / Shape: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP21FL is a low to moderate viscosity, two component epoxy resin system for high performance casting, bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This compound... [See More]
- Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
- Chemical System: Epoxy
- Type: CastingResin; Thermally cured
- Form / Shape: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The cured... [See More]
- Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Military; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
- Chemical System: Epoxy; Polyurethane
- Type: CastingResin; Thermally cured
- Form / Shape: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP30F is a new fast curing liquid epoxy resin compound for high perform-ance abrasion and chemical resistant seamless floors. This easy-to-use two component epoxy resin system offers a uniquely attractive combination of application and performance properties including... [See More]
- Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
- Chemical System: Epoxy
- Type: CastingResin; Optical; Thermally cured
- Form / Shape: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly at elevated temperatures with a 100/10 mix ratio by weight. This resin system is 100% reactive and does... [See More]
- Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
- Chemical System: Epoxy
- Type: CastingResin; Optical; Thermally cured
- Form / Shape: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP30FL is a low viscosity, flexibilized, two component epoxy resin system for high performance potting, casting, encapsulation as well as bonding and sealing. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1)... [See More]
- Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
- Chemical System: Epoxy
- Type: CastingResin; Optical; Thermally cured
- Form / Shape: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP30-1 is a low viscosity, two component epoxy compound for high performance fiber optics bonding, coating, potting and encapsulation formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This... [See More]
- Industry: Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Tooling; Chemical/Oil Processing, Metal Working
- Chemical System: Epoxy
- Type: CastingResin; Optical; Thermally cured
- Form / Shape: Liquid
from Master Bond, Inc.
Key Features. Free flowing viscosity. High temperature resistance. Exceptionally long open time. Passes NASA low outgassing. Product Description. Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation. The mix ratio is 100:80 by weight. This system has a... [See More]
- Industry: Aerospace; Electronics; Electrical Power or High Voltage; Optoelectronics or Photonics; OEM or Industrial; Semiconductors or IC Packaging
- Chemical System: Epoxy
- Type: CastingResin; Optical; Thermally cured
- Form / Shape: Liquid
from Greene, Tweed & Co.
Thermoplastic polymers are a type of plastic that softens upon heating to elevated temperatures and hardens upon cooling. Thermoplastic polymers may be amorphous or semi-crystalline, with differences in mechanical performance, chemical resistance, and service temperature capability. AETs represent a... [See More]
- Industry: Aerospace; Electrical Power or High Voltage; Semiconductors or IC Packaging
- Chemical System: Fluoropolymer; PEEK
- Type: Thermoplastic
from Wacker Chemical Corp.
One-component, acid-curing, low-modulus silicone sealant for glazing and industrial applications. ELASTOSIL ® 4100 cures at room temperature under the action of atmospheric moisture to give a permanently flexible silicone rubber. Special features. suitable for use in sanitary areas. [See More]
- Industry: Aerospace; Automotive; Marine; Repair or Construction; OEM or Industrial
- Chemical System: Silicone
- Type: ExtrusionGrade; Thermally cured
- Filler: Unfilled
from Port Plastics, Inc.
Duratron ® PAI T5030 GF PAI Extruded is 30% glass-reinforced. It offers high rigidity, retention of stiffness, a low expansion rate and improved load carrying capabilities. This grade is well suited for applications in the electrical/electronic, business equipment, aircraft and aerospace... [See More]
- Industry: Aerospace; Electronics; Electrical/electronic, business equipment, aircraft and aerospace industries
- Chemical System: Polyamide-imide
- Type: Thermoplastic
from 3M Advanced Materials Division
In 1969, astronauts boarded the Apollo 11 spacecraft wearing boots containing 3M ™ Dyneon ™ Fluoroelastomers. Today, these synthetic elastomeric materials are used in some of the toughest environments on earth. From hot-running automotive engines to harsh chemicals of semiconductor... [See More]
- Industry: Aerospace; Automotive; Electronics; Energy Conversion (Battery / Fuel Cell); Electrical Power or High Voltage; Marine; Sanitary; Military; Repair or Construction; OEM or Industrial; Semiconductors or IC Packaging; Oil &Gas Exploration
- Chemical System: Polypropylene; Polyamide; Fluoropolymer
- Type: ExtrusionGrade; FilmGrade; MoldingCompound; Optical; Thermoplastic; Thermally cured
- Filler: Unfilled
from Epoxy Technology
We have served the optical market since 301 was introduced in 1969. Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK ® fabricated components are the building blocks of camera, laser,... [See More]
- Industry: Aerospace; Optoelectronics or Photonics; Semiconductors or IC Packaging
- Chemical System: Epoxy
- Type: CastingResin; Optical; Thermally cured
- Filler: Unfilled
from Ensinger North America
This is a special 30% glass filled PEEK modification that Ensinger manufactures under the name TECAPEEK GF30 natural. In comparison to unfilled PEEK, this glass fiber reinforced material exhibits increased mechanical strength and high rigidity. Furthermore, improved creep strength and dimensional... [See More]
- Industry: Aerospace; Automotive; Electrical Power or High Voltage; Sanitary
- Chemical System: PEEK
- Type: Thermoplastic
- Filler: Glass or FRP
from Georgia-Pacific Chemicals LLC
A high temperature phenolic resin developed for use in the manufacture of fiber-reinforced polymer (FRP) that meets the requirements of Military Specification MIL-R-9299C, Type II, Class 2. The product is formulated to provide low smoke generation, flame resistance and strength as well as fire... [See More]
- Industry: Aerospace; Military
- Chemical System: Phenolics or Formaldehyde Resins
- Type: Thermally cured
- Filler: Unfilled
from Ensinger North America
TECANYL VH2 black is a specially formulated PPE plastic (Polyphenylene ether) designed for use in commercial aircraft interiors. It has been tested to and passed the requirements for FAR 25.853, as well as specific customer specifications for interior cabin products. The material's favorable flame... [See More]
- Industry: Aerospace
- Deflection Temperature: 252
- Type: Thermoplastic
- Tensile (Break): 7690 to 9280
from Ensinger North America
PEEK CF 30 is a 30% carbon filled PEEK material that is manufactured by Ensinger under the tradename TECAPEEK CF30 black. Its carbon fiber reinforcement lends the material a high level of rigidity and creep strength. Carbon fiber reinforced PEEK demonstrates very high mechanical strength values,... [See More]
- Industry: Aerospace; Automotive; Marine; Sanitary; OEM or Industrial
- Chemical System: PEEK
- Type: Thermoplastic
- Filler: Carbon or Graphite
from Ensinger North America
The addition of 30% carbon fibers to Solvay Torlon ® plastic is what gives TECAPAI CM XP730 black compression molded polyamide-imide its excellent combination of physical properties. It is Ensinger's version of a product commonly referred to in web searches as “torlon 7530 ”. This... [See More]
- Industry: Aerospace; OEM or Industrial
- Chemical System: Polyamide-imide
- Type: Thermoplastic
- Filler: Carbon or Graphite
from Ensinger North America
Ensinger manufactures natural acetal (POM-C) material modified by the addition of a special anti static agent. The product is sold under the trade name TECAFORM AH SD natural. The addition of this anti static agent produces a defined degree of conductivity in the anti static range. However, the... [See More]
- Industry: Aerospace
- Chemical System: Acetal or Polyoxymethylene (POM)
- Type: Thermoplastic
- Deflection Temperature: 190
from Ensinger North America
TECAMID 66 GF15 FR black is a specially formulated glass filled 66 nylon plastic designed for use in aircraft design when additional stiffness and strength might be required in a given aircraft aerospace material application. This PA66 plastic has been tested to and passed the requirements for FAR... [See More]
- Industry: Aerospace; Automotive
- Chemical System: Polyamide; Acetal or Polyoxymethylene (POM)
- Type: Thermoplastic
- Tensile (Break): 6890
from Ensinger North America
TECAPEI black Ultem is a polyetherimide material with high mechanical strength and rigidity, that is also known for its good electrical properties. This material has a remarkably high creep resistance over a wide range of temperatures and furthermore, polyetherimides have a high permanent operating... [See More]
- Industry: Aerospace; Automotive; Electronics; Sanitary; Semiconductors or IC Packaging
- Chemical System: Polyetherimide
- Type: Thermoplastic
- Filler: Unfilled
from Ensinger North America
TECASINT 2011 is one of the unfilled natural grades. It has a very high modulus of elasticity, high rigidity and hardness. Compared with TECASINT 1011 it has significantly reduced moisture absorption, higher toughness and better machining properties. Within the TECASINT 2000 series the material has... [See More]
- Industry: Aerospace; Electronics; Sanitary; Semiconductors or IC Packaging
- Chemical System: Polyimide or Bismaleimide (BMI)
- Type: Thermoplastic; Thermally cured
- Filler: Unfilled
from Ensinger North America
TECAPAI CM XP403 green is a compression molded Torlon ® plastic material that is unreinforced and delivers an excellent combination of physical properties. Made from Solvay Torlon ® powder, this PAI material offers excellent ductility and toughness as well as good strength and stiffness at... [See More]
- Industry: Aerospace; Electronics
- Chemical System: Polyamide-imide
- Type: Thermoplastic
- Deflection Temperature: 494