LGA Network and Communication Chips

8 Results
Bluetooth Chipset -- CSR1024
from QUALCOMM, Incorporated

CSR1024 LGA is a Qualcomm ® Bluetooth ® Low Energy technology single ‑mode platform device with ultra low power consumption. CSR1024 LGA enables customer applications of up to 60 KB to be stored on chip for optimal power consumption. CSR1024 Specs. Bluetooth. Bluetooth Version. [See More]

  • Package Type: LGA
  • Interface: I2C
  • Technology: Bluetooth
XFP Transceiver -- Si5040
from Silicon Labs

Features. Loss-of-signal alarm. Diagnostic and line loopbacks. SONET-compliant loop timed operation. No external loop filter components. Programmable slicing level and sample phase adjustment. LVDS Low Speed Interface. Single Supply 1.8 V Operation. Multi-rate operation. Low jitter generation. Small... [See More]

  • Package Type: LGA
  • Technology: XFP
  • Device Type: Transceiver
  • Supply Voltage: 1.8V; 3.3V
2.5G Cellular Module -- GE910-QUAD
from Telit IoT Solutions, Inc.

The GE910 is a 2.5G cellular module designed to be fully compatible with Telit ’s HSPA and EV-DO products, also member of the compact, and connector-less xE910 unified form factor family. This allows you to design your application once and take advantage of global coverage by replacing the... [See More]

  • Package Type: LGA
  • Technology: GPRS; GSM
  • Device Type: Modem
  • Interface: AAI/DVI/ADC/GPIO
3G Only Low Profile Module -- UE910 3G
from Telit IoT Solutions, Inc.

The UE910 3G is a 3G-only member of the UE910 3G Series which includes low-cost, dual-band 3.5G variants offered in the xE910 LGA unified form factor. The product is targeted at global applications requiring one-region-at-a-time. coverage, being particularly well suited for fixed-wireless such as... [See More]

  • Package Type: LGA
  • Technology: 3G Standard; HSPA
  • Device Type: Modem
  • Interface: I2C; USB; I2S
Automotive LTE HSPA+ Wireless Module -- LE920 AUTO SERIES
from Telit IoT Solutions, Inc.

The LE920 is part of Telit's xE920 form factor family conceived to address stringent requirements in the areas of quality assurance and traceability as well as extended environmental tolerance for OEM automotive and harsh environment application areas. The LE920 Series combines two high-speed... [See More]

  • Package Type: LGA
  • Technology: 4G Standard; HSPA+
  • Device Type: Modem
  • Interface: DVI/DAC/ADC/GPIO
Automotive UMTS HSPA+ Wireless Module -- HE920 AUTO SERIES
from Telit IoT Solutions, Inc.

The HE920 Series is part of the xE920, LGA form factor family conceived primarily for OEM and aftermarket automotive applications. It is a 3.5G module offering high-speed HSPA connectivity, ideally suited for automotive use and other demanding applications for harsh environments requiring assured... [See More]

  • Package Type: LGA
  • Technology: UMTS; HSPA+
  • Device Type: Modem
  • Interface: DVI/DAC/ADC/GPIO
CDMA/EV-DO Module -- DE910-DUAL
from Telit IoT Solutions, Inc.

The DE910-DUAL is recommended for CDMA/EV-DO applications also requiring or benefiting from accurate positioning information. The DE910-DUAL is designed for applications such as mobile computing and video surveillance. It is also the ideal solution for fleet management and global asset tracking,... [See More]

  • Package Type: LGA
  • Technology: CDMA
  • Device Type: Modem
  • Interface: DVI/DAC/ADC/GPIO
Compact 1xRTT Module -- CE910-DUAL
from Telit IoT Solutions, Inc.

The CE910-DUAL is Telit's first 1xRTT module designed in a compact LGA package. It enables reliable and secure CDMA cellular connectivity in any m2m application. The SMT form factor is pin-to-pin compatible with the xE910 family, allowing easy integration of different 2G-4G wireless technologies... [See More]

  • Package Type: LGA
  • Technology: CDMA
  • Device Type: Modem
  • Interface: DVI/ADC/GPIO