Electronics (PCB, Semiconductor) Tape Thermal Insulating Tapes
from Fujipoly® America Corp.
By spiral wrapping each successive layer slightly over the previous one, the tape fuses to itself over the component. Bonding only to itself, the permanent fusion begins within three minutes after contact. Once the amalgamation is cured, the protected area withstands exposure to moisture, electrical... [See More]
- Type: Industrial Tape; Cable; Electrical; Electronics, Printed Circuit Boards or Semiconductors; Protective; Sealing, Hydraulic Line Sealing
- Type: Fusible
- Materials of Construction: Rubber; Silicone
- Temperature Resistance: -45 to 250
from Adhesive Applications
PolySil ™ SP590 offers optimum performance in electrical and thermal insulation. The continuous service temperature range is -100 °F to 500 °F (-73 °C to 260 °C) with short term, intermittent service to 600 °F (315 °C). Provides clean removal in high-temperature... [See More]
- Type: Adhesive Tape; Industrial Tape; Electronics, Printed Circuit Boards or Semiconductors
- Type: Silicone
- Materials of Construction: Polyimide (e.g., Kapton®)
- Thickness: 0.0025
from DeWAL
DW 212 is a film , skived from virgin PTFE, that has been etched on one side with sodium naphthalene. This surface treatment allows PTFE, which normally exhibits very poor adhesion, to be bonded to other materials. APPLICATION INFORMATION. The major applications for sodium etched PTFE involve... [See More]
- Type: Adhesive Tape; Electrical; Electronics, Printed Circuit Boards or Semiconductors; Skived PTFE
- Type: None
- Materials of Construction: Fluoropolymer (Teflon); Plastic / Polymer; PTFE
- Width: 12 to 38
from ICO RALLY
Produced using a high-temperature polyimide film. Suitable for various high temperature applications and commonly used in printed circuit board applications. Aside from its high-temperature characteristics, it also exhibits high mechanical and thermal stability, as well as resistance to radiation... [See More]
- Type: Adhesive Tape; Industrial Tape; Electronics, Printed Circuit Boards or Semiconductors; Single
- Type: Silicone
- Materials of Construction: Polyimide (e.g., Kapton®); Plastic / Polymer
- Thickness: 0.0025
from Sheldahl Flexible Technologies - a Flex company
Flame Retardant Modified Acrylic Unsupported Bonding Adhesive. Description. T1649 Bus Bond ® free film adhesive uses our proprietary flame retardant, RoHS compliant, high temperature, modified acrylic adhesive on a carrier with a release liner, creating an isolated adhesive suitable for use as... [See More]
- Type: Adhesive Tape; Industrial Tape; Electronics, Printed Circuit Boards or Semiconductors
- Type: Acrylic; Flame Retardant Modified Acrylic Unsupported Bonding Adhesive
- Materials of Construction: Free Film Adhesive
- Width: 24
from DeWAL
This tape consisting of a 1 mil polyimide film and silicone adhesive has been designed for high temperature masking applications. In electrical insulation applications this product does meet class H requirements. APPLICATION INFORMATION. The primary uses for this product are gold finger masking,... [See More]
- Type: Adhesive Tape; Industrial Tape; Electronics, Printed Circuit Boards or Semiconductors; Single
- Type: Silicone
- Materials of Construction: Polyimide (e.g., Kapton®); Plastic / Polymer
- Width: 0.2500 to 20
from ICO RALLY
TT1 tape is produced using a skived Teflon film. Applications include packaging equipment, heat sealing applications, graphics arts, electrical insulation, and multi-purpose industrial uses. TT2 tape is a stretchier version, with higher tensile strength. Characteristics include excellent resistance... [See More]
- Type: Adhesive Tape; Industrial Tape; Electronics, Printed Circuit Boards or Semiconductors; Single; Packaging Tape; Heat Sealing Applications, Graphics Arts
- Type: Silicone
- Materials of Construction: Fluoropolymer (Teflon); Plastic / Polymer; Teflon
- Thickness: 0.0035
from DeWAL
DW 402P is a microporous film produced from Ultra High Molecular Weight Polyethylene (UHMW). The process yields a material with highly uniform pore structure in the X, Y and Z directions. DW 402P has an open cell (tortuous path) structure with a void volume of 30 % to 50%. The material can be... [See More]
- Type: Electrical; Electronics, Printed Circuit Boards or Semiconductors; Single; Porous UHMW-PE
- Type: None
- Materials of Construction: Plastic / Polymer
- Width: 0.2500 to 28