from Device Technologies, Inc.
The performance of electronic devices is constantly improving but with this evolution comes greater power consumption and heat generation. If heat cannot escape efficiently, the performance of the device suffers. To transfer heat effectively, the introduction of DTIM Thermal Interface Materials... [See More]
- Composition: Filled
- Cure / Technology: Single Component; Adhesive Tape
- Chemical System: Silicone
- Form / Shape: Gel; Die Bonding Adhesives
from ELANTAS PDG, Inc.
Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]
- Composition: Filled
- Chemical System: Alkyd
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component
from Ellsworth Adhesives
ECCOBOND 281 is a one component, highly filled, thixotropic paste epoxy adhesive. It will bond to a wide variety of materials such as metals, glass and plastics. ECCOBOND 281 has good chemical resistance, good electrical insulation properties, high thermal conductivity and low coefficient of thermal... [See More]
- Composition: Filled
- Cure / Technology: Single Component
- Chemical System: Epoxy
- Industry: Electronics; OEM or Industrial
from Epoxy Technology
A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized. [See More]
- Composition: Filled
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Form / Shape: Grease, Paste
from Hapco, Inc.
HAPCOAT ™ 3726 is an aluminum filled, high temperature, gel coat. HAPCOAT ™ 3726 is a high heat resistant, thixotropic, gel coat that is specifically designed to reproduce surface details exactly and eliminate print through. When HAPCOAT ™ 3726 is used with HAPCURE 7 curing agent,... [See More]
- Composition: Filled
- Form / Shape: Gel
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Use Temperature: 350 to 400
from ITW Polymer Technologies - Insulcast Division
Castable Epoxy Heat Sink, UL recognized under file E86165 & meets the flammability requirement of 94 V-0. INSULCAST 140 FR is an epoxy casting system with high thermal conductivity. This system, when cured with INSULCURE 11B, also provides Class F operating properties. [See More]
- Composition: Filled
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Form / Shape: Die Bonding Adhesives; Grease, Paste
from Master Bond, Inc.
Master Bond Polymer System EP21FRLVSP is a two component flame resistant compound for general purpose bonding, sealing and casting, formulated to cure at room temperature. With a one-to-one mix ratio, by weight only, it readily develops a high bonding strength of more than 2000psi at room... [See More]
- Composition: Filled
- Chemical System: Epoxy
- Type: High Dielectric
- Cure / Technology: Two Component
from Quist Electronics
Enhanced puncture, shear and tear resistance, electrically isolating [See More]
- Composition: Filled
- Cure / Technology: Thermoset
- Chemical System: Silicone
- Form / Shape: Pad; Gap Filler, Foam in Place Gasket
from 3M Electronics Markets Materials Division
3M ™ Thermally Conductive Epoxy Adhesive TC-2707 is an aluminum metal filled, two-part, thermally conductive epoxy adhesive. [See More]
- Composition: Filled
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Form / Shape: Liquid
from GS Polymers, Inc.
Two part, 1:1, thermal conductive compound, available in cartridges [See More]
- Composition: Filled
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Industry: OEM or Industrial
from Henkel Corporation - Electronics
Superior environmental protection, extreme thermal cycling resistance [See More]
- Composition: Filled
- Cure / Technology: Thermoset; Single Component
- Chemical System: Polyurethane
- Form / Shape: Liquid; Encapsulant or Conformal Coating
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachand can be dispensed, printed or pin transferred. It offer fast in-line cure. This product can produce ultra fine dots via < 30 gauge needle. The product will... [See More]
- Composition: Filled
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
- Form / Shape: Die Bonding Adhesives; Grease, Paste
