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3M™ Thermally Conductive Tape -- 8810 [8810 from 3M Electronics Design & Manufacturing]
from bisco industries

3M ™ Thermally Conductive Adhesive Transfer Tapes 8805, 8810, 8815 and 8820 are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices (e.g., fans, heat spreaders or heat pipes). • These tapes are tacky pressure... [See More]

  • Composition: Filled
  • Cure / Technology: Single Component
  • Chemical System: Acrylic
  • Industry: Electronics
Pedigree® -- 40 VTC-40F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Composition: Filled
  • Chemical System: Alkyd
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Single Component
Emerson & Cuming 281 Encapsulant Black 1 qt Can -- 281 BLACK 2 LB.
from Ellsworth Adhesives

ECCOBOND 281 is a one component, highly filled, thixotropic paste epoxy adhesive. It will bond to a wide variety of materials such as metals, glass and plastics. ECCOBOND 281 has good chemical resistance, good electrical insulation properties, high thermal conductivity and low coefficient of thermal... [See More]

  • Composition: Filled
  • Cure / Technology: Single Component
  • Chemical System: Epoxy
  • Industry: Electronics; OEM or Industrial
Electrical -- 430
from Epoxy Technology

A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized. [See More]

  • Composition: Filled
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Die Bonding Adhesives; Grease, Paste
Hapcoat™ 3726 Aluminum Filled Gel Coat -- 3726
from Hapco, Inc.

HAPCOAT ™ 3726 is an aluminum filled, high temperature, gel coat. HAPCOAT ™ 3726 is a high heat resistant, thixotropic, gel coat that is specifically designed to reproduce surface details exactly and eliminate print through. When HAPCOAT ™ 3726 is used with HAPCURE 7 curing agent,... [See More]

  • Composition: Filled
  • Form / Shape: Gel
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Use Temperature: 350 to 400
INSULCAST 140 FR Castable Epoxy Heat Sink
from ITW Polymer Technologies - Insulcast Division

Castable Epoxy Heat Sink, UL recognized under file E86165 & meets the flammability requirement of 94 V-0. INSULCAST 140 FR is an epoxy casting system with high thermal conductivity. This system, when cured with INSULCURE 11B, also provides Class F operating properties. [See More]

  • Composition: Filled
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Die Bonding Adhesives; Grease, Paste
Flame Resistant, Two Component Epoxy -- EP21FRLVSP
from Master Bond, Inc.

Master Bond Polymer System EP21FRLVSP is a two component flame resistant compound for general purpose bonding, sealing and casting, formulated to cure at room temperature. With a one-to-one mix ratio, by weight only, it readily develops a high bonding strength of more than 2000psi at room... [See More]

  • Composition: Filled
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Cure / Technology: Two Component  
3M™ Thermally Conductive Adhesive -- TC-2707
from 3M Electronics Design & Manufacturing

3M ™ Thermally Conductive Epoxy Adhesive TC-2707 is an aluminum metal filled, two-part, thermally conductive epoxy adhesive. [See More]

  • Composition: Filled
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Liquid
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Composition: Filled
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Form / Shape: Gap Filler, Foam in Place Gasket; Grease, Paste; Encapsulant or Conformal Coating
Aluminum filled epoxy system -- 70-3800R
from Epoxies Etc...

70-3800 is a low viscosity, aluminum filled, epoxy tooling resin. This system is used for making heat resistant cast tools or parts that require very good thermal conductivity. 70-3800 is easily machined, drilled, tapped, or polished, and is ideal for vacuum form molds, dies, drill jigs, injection... [See More]

  • Composition: Filled
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Form / Shape: Liquid; Die Bonding Adhesives
GSP 1345
from GS Polymers, Inc.

Two part, 1:1, thermal conductive compound, available in cartridges [See More]

  • Composition: Filled
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Industry: OEM or Industrial
Circuit Board Protection -- US5520
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Composition: Filled
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Polyurethane
  • Form / Shape: Liquid; Encapsulant or Conformal Coating
Electro-Conductive Epoxy Adhesive -- ACE-10021 (formerly CM3270-2FC)
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachand can be dispensed, printed or pin transferred. It offer fast in-line cure. This product can produce ultra fine dots via < 30 gauge needle. The product will... [See More]

  • Composition: Filled
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Form / Shape: Die Bonding Adhesives; Grease, Paste