Filled Thermal Compounds and Thermal Interface Materials Datasheets

Pedigree® -- 40 VTC-40F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Composition: Filled
  • Chemical System: Alkyd
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Single Component
Emerson & Cuming 281 Encapsulant Black 1 qt Can -- 281 BLACK 2 LB.
from Ellsworth Adhesives

ECCOBOND 281 is a one component, highly filled, thixotropic paste epoxy adhesive. It will bond to a wide variety of materials such as metals, glass and plastics. ECCOBOND 281 has good chemical resistance, good electrical insulation properties, high thermal conductivity and low coefficient of thermal... [See More]

  • Composition: Filled
  • Cure / Technology: Single Component
  • Chemical System: Epoxy
  • Industry: Electronics; OEM or Industrial
Electrical -- 430
from Epoxy Technology

A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized. [See More]

  • Composition: Filled
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Die Bonding Adhesives; Grease, Paste
Highly Thermal Conductive and Non-Flammable Silicone Putty Sheet -- SARCON ® XR-Um-AL
from Fujipoly® America Corp.

Sarcon ® XR-Um-Al has one surface with aluminum film, which enable to remove eve n after application ( before operation) and there is no-pull-out effect. Putty nature enables low contact thermal resistance. Low Molecular Siloxane content is very low. Has a flame retardancy of UL specification 94... [See More]

  • Composition: Filled
  • Form / Shape: Putty; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Gap Fill: 0.0087 to 0.0197
Flexible, Two Component Silver Conductive Epoxy -- EP21TDCSFL
from Master Bond, Inc.

Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most salient features are its high flexibility and elongation. This... [See More]

  • Composition: Filled
  • Chemical System: Epoxy; Polyurethane
  • Type: High Dielectric
  • Cure / Technology: Two Component  
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Composition: Filled
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Form / Shape: Grease, Paste; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
Aluminum filled epoxy system -- 70-3800R
from Epoxies Etc...

70-3800 is a low viscosity, aluminum filled, epoxy tooling resin. This system is used for making heat resistant cast tools or parts that require very good thermal conductivity. 70-3800 is easily machined, drilled, tapped, or polished, and is ideal for vacuum form molds, dies, drill jigs, injection... [See More]

  • Composition: Filled
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Form / Shape: Liquid; Die Bonding Adhesives
GSP 1345
from GS Polymers, Inc.

Two part, 1:1, thermal conductive compound, available in cartridges [See More]

  • Composition: Filled
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Industry: OEM or Industrial
Hapcoat™ 3726 Aluminum Filled Gel Coat -- 3726
from Hapco, Inc.

HAPCOAT ™ 3726 is an aluminum filled, high temperature, gel coat. HAPCOAT ™ 3726 is a high heat resistant, thixotropic, gel coat that is specifically designed to reproduce surface details exactly and eliminate print through. When HAPCOAT ™ 3726 is used with HAPCURE 7 curing agent,... [See More]

  • Composition: Filled
  • Form / Shape: Gel
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Use Temperature: 350 to 400
INSULCAST 140 FR Castable Epoxy Heat Sink
from ITW Polymer Technologies - Insulcast Division

Castable Epoxy Heat Sink, UL recognized under file E86165 & meets the flammability requirement of 94 V-0. INSULCAST 140 FR is an epoxy casting system with high thermal conductivity. This system, when cured with INSULCURE 11B, also provides Class F operating properties. [See More]

  • Composition: Filled
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Die Bonding Adhesives; Grease, Paste
Electro-Conductive Epoxy Adhesive -- ACE-10021 (formerly CM3270-2FC)
from Protavic America, Inc.

Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachand can be dispensed, printed or pin transferred. It offer fast in-line cure. This product can produce ultra fine dots via < 30 gauge needle. The product will... [See More]

  • Composition: Filled
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Form / Shape: Die Bonding Adhesives; Grease, Paste