Unfilled Thermal Compounds and Thermal Interface Materials
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Composition: Unfilled
- Chemical System: Silicone
- Type: High Dielectric; Optical
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Composition: Unfilled
- Chemical System: Silicone
- Type: High Dielectric; Optical
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: High Dielectric; Optical
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity ( <250 cps) solvent based system is easy to apply and process. It cures at room temperature or more rapidly with the addition of heat. X21Med passes... [See More]
- Composition: Unfilled
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
- Type: High Dielectric
- Form / Shape: Liquid; Primer
from Master Bond, Inc.
Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated storage although this is... [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]
- Composition: Unfilled
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; UV curing system
- Type: High Dielectric; Optical
- Form / Shape: Liquid; Encapsulant or Conformal Coating
from Master Bond, Inc.
Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme... [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is a user friendly compound that has a non-critical ten to one mix ratio by weight. This system cures readily... [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: High Dielectric; Optical
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient of thermal expansion. [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Two component EP46HT-2AO Black is ideal for demanding bonding, sealing and encapsulation applications where thermal conductivity, electrical insulation and high temperature resistance are required. It has a service temperature range of -100 °F to +500 °F with a glass transition temperature... [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Composition: Unfilled
- Cure / Technology: Thermoset; Two Component
- Chemical System: Silicone
- Form / Shape: Liquid; Die Bonding Adhesives; Encapsulant or Conformal Coating
from Epoxies Etc...
50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]
- Composition: Unfilled
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Form / Shape: Liquid
from Nordson EFD
Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]
- Composition: Unfilled
- Form / Shape: Grease, Paste
- Cure / Technology: Single Component
- Industry: Electronics; Semiconductors, IC's
from Sauereisen, Inc.
Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]
- Composition: Unfilled
- Chemical System: Ceramic
- Type: High Dielectric
- Cure / Technology: Single Component
from Protavic America, Inc.
The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over PROTAVIC ACH... [See More]
- Composition: Unfilled
- Form / Shape: Gel; Die Bonding Adhesives
- Cure / Technology: Thermoset; Single Component
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's; Bonding BGA Packages
from Epoxies Etc...
20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Sauereisen, Inc.
Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]
- Composition: Unfilled
- Chemical System: Ceramic
- Type: High Dielectric
- Cure / Technology: Two Component ; Chemically Set
from Protavic America, Inc.
A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component
from Protavic America, Inc.
Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing. [See More]
- Composition: Unfilled
- Chemical System: Epoxy
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component