Specialty / Other Thermal Compounds and Thermal Interface Materials

Thermal - Adhesives, Epoxies, Greases, Pastes -- 1168-1627-ND [TG-NSP25-60 from T-Global Technology Co., Ltd.]
from Digi-Key Electronics


  • Form / Shape: Putty
  • Thermal Conductivity: 2.5
  • Use Temperature: -58 to 302
Extremely Compressible Gap Filler -- SARCON® PG80A
from Fujipoly® America Corp.

Highly Conformable and Non-Flammable, Higher Thermal interface materials. SARCON ® Extremely Compressible Gap Filler Type (Putty Type) is a highly conformable, thermally conductive, non-flammableinterface materials. The surface consistency is excellent for filling small air gaps and uneven... [See More]

  • Type: High Dielectric
  • Form / Shape: Pad; Putty; Gap Filler, Foam in Place Gasket
  • Chemical System: Silicone
  • Gap Fill: 0.0197 to 0.0787
Hysol ECCOBOND E3503-1 -- 8799540346881
from Henkel Corporation - Electronics

Eccobond E3503-1 is optimised for SMT dispense and the manufacturing of high volume assemblies. It has high adhesion to the substrate finishes commonly used in microelectronics and will not adversely affect solder processes. [See More]

  • Industry: Electronics
  • Viscosity: 60000
  • Thermal Conductivity: 1
Die Attach Adhesives -- LOCTITE ABLESTIK 84-1LMIT
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 84-1LMIT, Epoxy, Component assembly, Electrically Conductive Adhesive. LOCTITE ® ABLESTIK 84-1LMIT adhesive is designed for medium die attach applications. This adhesive is ideal for application by syringe dispensing or screen printing. Electrically conductive. High thermal... [See More]

  • Chemical System: Epoxy
  • Form / Shape: Paste
  • Cure / Technology: Single Component
Thermal Interface Materials -- Thermal Interface Ribbon Kit
from Indium Corporation

The Thermal Interface Ribbon Kit includes 99.99% Indium ribbon that is 1.00" wide x thicknesses of: .002"/.006"/.010" by three feet of each. Also included is the 5RMA flux. [See More]

  • Cure / Technology: Solder
  • Industry: Semiconductors, IC's
  • Form / Shape: Ribbon
One Component Glob Top Epoxy Meets NASA Low Outgassing Specifications -- EP17HTND-CCM
from Master Bond, Inc.

Master Bond EP17HTND-CCM is a single part, heat cured epoxy system for bonding, sealing and glob top applications. [See More]

  • Type: High Dielectric
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
from RS Components, Ltd.

A heat curable, one part thixotropic adhesive for use in holding components in place during soldering operations of surface mount assemblies. High uncured green strength and fast cure cycle with medium bond strength. Thixotropic properties give high dot profile. Excellent mechanical strength. Not... [See More]

  • Form / Shape: Syringe
  • Thermal Conductivity: 0.2500 to 0.3000
  • Use Temperature: -40 to 266