Specialty / Other Thermal Compounds and Thermal Interface Materials
from Fujipoly® America Corp.
Fujipoly ® introduces Sarcon ® PG45A its newest high-performance, putty-like thermal interface material. This extremely low modulus gap filler exhibits a thermal resistance as low as 0.02 °C •in2/W at 43.5 PSI with a thermal conductivity of 4.5 W/m °K. Sarcon ® PG45A... [See More]
- Chemical System: Silicone
- Gap Fill: 0.0591 to 0.0984
- Form / Shape: Putty; Gap Filler, Foam in Place Gasket
- Industry: Electronics; Semiconductors, IC's
from RS Components, Ltd.
Loctite Circuit+ el conductive paint 2ml [See More]
- Form / Shape: Bottle
- Industry: Thermal Management
from Master Bond, Inc.
Master Bond EP17HTND-CCM is a single part, heat cured epoxy system for bonding, sealing and glob top applications. [See More]
- Type: High Dielectric
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Thermon, Inc
SnapTrace is a preformed flexible heat transfer compound designed for rapid, consistent installation over steam trace tubing on straight piping. SnapTrace also includes TFK channel, providing mechanical and weather protection to the installation. Thermon's heat transfer compounds provide an... [See More]
- Form / Shape: 4ft Lengths; Gap Filler, Foam in Place Gasket
- Thermal Conductivity: 34.61 to 69.23
- Use Temperature: 14 to 450
from Quantaflex Printed Electronics Inc.
A high level of custom engineering and problem solving. Designing electrical shielding components requires a high level of custom engineering and problem solving. Nothing should be left to chance because the goal is to create a part that protects the electronic device (and your customers) from the... [See More]
- Form / Shape: Liquid; Foam; Gap Filler, Foam in Place Gasket
- Features: EMI/RFI Shielding
- Industry: Electronics; Semiconductors, IC's
from Fujipoly® America Corp.
SARCON ® PG130A from Fujipoly ® is one of the industry ’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extremely... [See More]
- Type: High Dielectric
- Gap Fill: 0.0118 to 0.0787
- Form / Shape: Putty; Gap Filler, Foam in Place Gasket
- Industry: Electronics; Semiconductors, IC's
from RS Components, Ltd.
Fact cure thermally conductive aghesive [See More]
- Form / Shape: Liquid; Dual Cartridge
- Industry: Thermal Management
from Master Bond, Inc.
Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity ( <250 cps) solvent based system is easy to apply and process. It cures at room temperature or more rapidly with the addition of heat. X21Med passes... [See More]
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Form / Shape: Liquid; Primer
from Fujipoly® America Corp.
SARCON® Extremely Compressible Gap Filler Type (Putty Type) is a highly conformable, thermally conductive, non-flammable interface materials. The surface consistency is excellent for filling small air gaps and uneven mating surface, making reliable contact with various shapes and sizes of... [See More]
- Type: High Dielectric
- Industry: Electronics; Semiconductors, IC's
- Form / Shape: Putty; Gap Filler, Foam in Place Gasket
- Use Temperature: -40 to 302
from RS Components, Ltd.
Fact cure thermally conductive aghesive [See More]
- Form / Shape: Liquid; Dual Cartridge
- Industry: Thermal Management
from Fujipoly® America Corp.
SARCON ® Silicone Putty is a highly conformable, thermally conductive, non-flammable interface materials. The surface consistency is excellent for filling small air gaps and uneven mating surface, making reliable contact with various shapes and sizes of components. [See More]
- Chemical System: Silicone
- Gap Fill: 0.0394 to 0.0787
- Form / Shape: Putty; Gap Filler, Foam in Place Gasket
- Industry: Electronics; Semiconductors, IC's
from RS Components, Ltd.
Slow cure thermally conductive aghesive [See More]
- Form / Shape: Liquid; Dual Cartridge
- Industry: Thermal Management
from Fujipoly® America Corp.
SARCON ® PG65A from Fujipoly ® is one of the industry ’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extremely... [See More]
- Chemical System: Silicone
- Industry: Aerospace; Automotive; Electronics; OEM or Industrial
- Form / Shape: Pad; Putty; Gap Filler, Foam in Place Gasket
- Use Temperature: -40 to 302
from RS Components, Ltd.
Slow cure thermally conductive aghesive [See More]
- Form / Shape: Liquid; Dual Cartridge
- Industry: Thermal Management
from RS Components, Ltd.
Silver loaded epoxy adhesive,10gm 2 vial [See More]
- Form / Shape: Liquid; Can
- Use Temperature: 302
- Industry: Thermal Management
from RS Components, Ltd.
DP810 LWODR ACR ADH GN 400 mL CAR 6 /CV [See More]
- Form / Shape: Liquid; Dual Cartridge
- Industry: OEM or Industrial; Industrial, Thermal Management
from RS Components, Ltd.
Silicone heat transfer compound HTSP 50T [See More]
- Form / Shape: Tube
- Use Temperature: 392
- Industry: Thermal Management
from RS Components, Ltd.
TECBOND 280 Trans Yellow glue stick 5kg [See More]
- Form / Shape: Stick
- Industry: Bonding
from RS Components, Ltd.
TECBOND LM41 White glue sticks [See More]
- Form / Shape: Stick
from RS Components, Ltd.
DP760 high temp epoxy adhesive,50ml [See More]
- Form / Shape: Liquid; Dual Cartridge
- Industry: Thermal Management
from Henkel Corporation - Electronics
Eccobond E3503-1 is optimised for SMT dispense and the manufacturing of high volume assemblies. It has high adhesion to the substrate finishes commonly used in microelectronics and will not adversely affect solder processes. [See More]
- Industry: Electronics
- Viscosity: 60000
- Thermal Conductivity: 1
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 84-1LMIT, Epoxy, Component assembly, Electrically Conductive Adhesive. LOCTITE ® ABLESTIK 84-1LMIT adhesive is designed for medium die attach applications. This adhesive is ideal for application by syringe dispensing or screen printing. Electrically conductive. High thermal... [See More]
- Chemical System: Epoxy
- Form / Shape: Paste
- Cure / Technology: Single Component
from Henkel Adhesive Technologies - Aviation, Space and Rail
BERGQUIST ® LIQUI FORM TLF 6000HG thermally conductive gel interface material is designed to meet the demanding requirements in certain telecom market applications. Its unique formulation assures a balanced mix of high thermal conductivity, good dispensing efficiency and high thermal... [See More]
- Chemical System: Silicone
- Industry: OEM or Industrial
- Form / Shape: Gel; Paste
from Shiu Li Technology Co., Ltd
LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
from Indium Corporation
The Thermal Interface Ribbon Kit includes 99.99% Indium ribbon that is 1.00" wide x thicknesses of: .002"/.006"/.010" by three feet of each. Also included is the 5RMA flux. [See More]
- Cure / Technology: Solder
- Industry: Semiconductors, IC's
- Form / Shape: Ribbon
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE ® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible. Thixotropic. High viscosity. Long work life. Easy handling. High thermal conductivity. Reduced stress [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Form / Shape: Paste
from Shiu Li Technology Co., Ltd
LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
from Henkel Corporation - Industrial
LOCTITE ABLESTIK ABP 8037TI, Acrylate, Die Attach, Silver Filled Conductive Adhesive LOCTITE ® ABLESTIK ABP 8037TI silver filled conductive adhesive is recommended for use in the attachment of integrated circuits and components onto metal leadframes and advanced substrates. Excellent electrical... [See More]
- Cure / Technology: Single Component
- CTE: 34
- Form / Shape: Paste
from Shiu Li Technology Co., Ltd
LiPOLY G566 Graphite Sheet has great thermal conductivity on the X and Y axis. The thermal conductivity is 1700W/m*K. It is flexible, which is suitable for thin products and high capability mobile devices. [See More]
- Form / Shape: Sheet Form, Die-cut Parts
- Industry: Electronics
- Gap Fill: 8.27E-4
- Thermal Conductivity: 1700
from Shiu Li Technology Co., Ltd
LiPOLY TR332CU has outstanding parallel thermal conduction and has high flexibility, which is suitable for thin products like mobile devices. [See More]
- Form / Shape: Sheet Form, Die-cut Parts
- Industry: Electronics
- Gap Fill: 0.0039 to 0.0059
- Use Temperature: -76 to 248
from Shiu Li Technology Co., Ltd
LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.1969
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Type: High Dielectric
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.3937
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Type: High Dielectric
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Gap Fill: 0.0197 to 0.3937
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Type: High Dielectric
- Form / Shape: Pad; Sheet Form, Die-cut Parts; Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Gap Fill: 0.0098 to 0.0177
from Shiu Li Technology Co., Ltd
LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It ’s suitable for high power transistors, electrical equipment,... [See More]
- Chemical System: Silicone
- Gap Fill: 0.0059
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Industry: Electronics