Specialty / Other Thermal Compounds and Thermal Interface Materials
from CHT USA Inc.
CHT's AS1707 is a 1-part, alkoxy cured, thermally conductive, low volatile, RTV silicone adhesive paste. AS1707 is formulated to meet the requirements for use as a space grade adhesive. AS1707 has low thermal outgassing properties and a wide operational temperature range. In addition to meeting... [See More]
- Cure / Technology: Single Component; Alkoxy
- Industry: Automotive; Electronics
- Chemical System: Silicone
- Features: Flame Retardant; UL Rating
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
- Chemical System: Silicone
- Type: High Dielectric; Optical
- Composition: Unfilled
from CHT USA Inc.
CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat dissipation. This silicone... [See More]
- Cure / Technology: Two Component ; Addition
- Features: Flame Retardant; UL Rating
- Industry: Automotive; Electronics
- Use Temperature: -67 to 399
from Master Bond, Inc.
Master Bond LED405Med is a one part, nano filled system that cures quickly upon exposure to a 405 nm LED light. It does not require a UV light source. It meets ISO 10993-5 for cytotoxicity and resists sterilization. It can cure up to 1/8 think and has low shrinkage upon cure. It also features... [See More]
- Cure / Technology: Thermoset; Single Component; LED Cure
- Composition: Filled
- Type: High Dielectric; Optical
- Form / Shape: Liquid
from CHT USA Inc.
CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low flammability... [See More]
- Cure / Technology: Two Component ; Addition
- Features: Flame Retardant; UL Rating
- Industry: Electronics
- Use Temperature: -94 to 482
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
- Composition: Filled
- Type: High Dielectric
- Form / Shape: Glob Top, Daub, Doming or Overfill; Liquid; Encapsulant or Conformal Coating
from CHT USA Inc.
CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow throughout components. Because of its... [See More]
- Cure / Technology: Two Component ; Addition
- Features: Flame Retardant; UL Rating
- Industry: Automotive; Electronics; OEM or Industrial
- Use Temperature: -67 to 464
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Cure / Technology: Thermoset; Two Component ; Addition Cure
- Composition: Filled
- Chemical System: Silicone
- Form / Shape: Grease, Paste; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
from Master Bond, Inc.
Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; UV curing system
- Composition: Unfilled
- Type: High Dielectric; Optical
- Form / Shape: Liquid; Encapsulant or Conformal Coating
from Sauereisen, Inc.
Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]
- Cure / Technology: Two Component ; Chemically Set
- Chemical System: Ceramic
- Type: High Dielectric
- Composition: Unfilled
from Shiu Li Technology Co., Ltd
LiPOLY ’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties. It... [See More]
- Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing (optional feature); High Heat
- Form / Shape: Gel; Die Bonding Adhesives; Grease, Paste
- Chemical System: Silicone
- Industry: Electronics
from Indium Corporation
The Thermal Interface Ribbon Kit includes 99.99% Indium ribbon that is 1.00" wide x thicknesses of: .002"/.006"/.010" by three feet of each. Also included is the 5RMA flux. [See More]
- Cure / Technology: Solder
- Industry: Semiconductors, IC's
- Form / Shape: Ribbon