Specialty / Other Thermal Compounds and Thermal Interface Materials

Thermal - Pads, Sheets -- 102-5127-ND
from Digi-Key Electronics

THERM PAD 10MMX10MM 1 SHT=882 PC [See More]

  • Form / Shape: Pad
  • Thermal Conductivity: 1
Non-silicone, Polysynthetic-based Thermal Grease -- SARCON ® SG 07NS
from Fujipoly® America Corp.

Sarcon ® SG-07SL and SG-26SL are highly thermally conductive, non-reactive silicone-based greases that offer low thermal resistance and maintain a nonflowable composition. Unique binding agents and product formulation ensure the lowest amount of bleed and evaporation. Suited for thin bond line... [See More]

  • Form / Shape: Grease, Paste
  • Use Temperature: -40 to 392
  • Industry: Electronics; Semiconductors, IC's
  • Thermal Conductivity: 0.7500
LOCTITE ABLESTIK QMI536HT(BORON) (Known as Hysol QMI536HT) -- 8799542116353
from Henkel Corporation - Electronics

(Known as Hysol QMI536HT ). LOCTITE ABLESTIK QMI536HT(BORON) is a high thermal version of QMI536 and is ideal for mixed stacked die applications. Non-die damaging filler. [See More]

  • Industry: Electronics
  • Viscosity: 13000
  • Thermal Conductivity: 0.9000
4.0 x 5.0 Micron Foil -- NanoFoil®
from Indium Corporation

NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in thicknesses of 40 microns or 60 microns. The bundle kits are available in standard NanoFoil only; however,... [See More]

  • Industry: Semiconductors, IC's
Biocompatible, Nanosilica Filled LED Curable Adhesive -- LED405Med
from Master Bond, Inc.

Master Bond LED405Med is a one part, nanofilled system that cures quickly upon exposure to a 405 nm LED light. It does not require a UV light source. It meets ISO 10993-5 for cytotoxicity and resists sterilization. It can cure up to 1/8 think and has low shrinkage upon cure. It also features... [See More]

  • Type: High Dielectric; Optical
  • Cure / Technology: Thermoset; Single Component; LED Cure
  • Composition: Filled
  • Form / Shape: Liquid
1127229
from RS Components, Ltd.

Silicon-free heat sink compound. Easy to apply with the practical syringe. Extremely high thermal conductivity. For the thermal coupling of electronic components. Thermal Conductivity = 0.9W/m ·K. Material = Non-Silicone. Maximum Operating Temperature = +130 °C. Minimum Operating... [See More]

  • Form / Shape: Grease, Paste
  • Thermal Conductivity: 0.9000
  • Use Temperature: -58 to 266
Elastomeric potting & encapsulating compound -- 20-2125
from Epoxies Etc...

20-2125 is formulated for electronic potting, encapsulating and casting applications. The 20-2125 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2125 will cushion and protect sensitive electronic... [See More]

  • Type: High Dielectric
  • Form / Shape: Grease, Paste
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: Electronics
Thermal Compound -- TC70
from Nordson EFD

Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]

  • Composition: Unfilled
  • Form / Shape: Grease, Paste
  • Cure / Technology: Single Component
  • Industry: Electronics; Semiconductors, IC's
Conductive Hybrid Adhesive -- ACH-20120
from Protavic America, Inc.

The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over PROTAVIC ACH... [See More]

  • Composition: Unfilled
  • Form / Shape: Gel; Die Bonding Adhesives
  • Cure / Technology: Thermoset; Single Component
  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's; Bonding BGA Packages
Insa-Lute Hi-Temp Cement -- No. 7
from Sauereisen, Inc.

Sauereisen Insa-Lute Hi Temp Cement No. 7 is a sodium silicate adhesive cement used by leading electrical manufacturers. The cement exhibits outstanding resistance to heat and electricity. Typical applications include instrumentation assembly, coating and embedding of resistance wires, and... [See More]

  • Type: High Dielectric
  • Composition: Unfilled
  • Chemical System: Ceramic
  • Form / Shape: Liquid; Die Bonding Adhesives; Encapsulant or Conformal Coating