Specialty / Other Thermal Compounds and Thermal Interface Materials
from RS Components, Ltd.
Heatsink compound DC340 [See More]
- Industry: Thermal Management
- Use Temperature: 392
from Fujipoly® America Corp.
bull; CF210A is the newest Fujipoly thermal gap filler. • CF210A incorporates carbon fibers along with traditional fillers found in thermal gap filler materials. • CF210A is rated at 21 W/m •K. • Compliance is closer to a much lower conductivity gap filler (Fujipoly- Sarcon... [See More]
- Form / Shape: Gap Filler, Foam in Place Gasket
- Use Temperature: -40 to 302
- Industry: Electronics; Semiconductors, IC's
- Thermal Conductivity: 21
from Master Bond, Inc.
Master Bond LED405Med is a one part, nano filled system that cures quickly upon exposure to a 405 nm LED light. It does not require a UV light source. It meets ISO 10993-5 for cytotoxicity and resists sterilization. It can cure up to 1/8 think and has low shrinkage upon cure. It also features... [See More]
- Type: High Dielectric; Optical
- Cure / Technology: Thermoset; Single Component; LED Cure
- Composition: Filled
- Form / Shape: Liquid
from RS Components, Ltd.
Silicone heat transfer compound HTSP 50T [See More]
- Form / Shape: Tube
- Use Temperature: 392
- Industry: Thermal Management
from Fujipoly® America Corp.
Sarcon ® SG-07SL and SG-26SL are highly thermally conductive, non-reactive silicone-based greases that offer low thermal resistance and maintain a nonflow able composition. Unique binding agents and product formulation ensure the lowest amount of bleed and evaporation. Suited for thin bond line... [See More]
- Form / Shape: Grease, Paste
- Use Temperature: -40 to 392
- Industry: Electronics; Semiconductors, IC's
- Thermal Conductivity: 0.7500
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Type: High Dielectric
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
- Composition: Filled
- Form / Shape: Glob Top, Daub, Doming or Overfill; Liquid; Encapsulant or Conformal Coating
from RS Components, Ltd.
THERMALLY ADHESIVE 5 G [See More]
- Chemical System: Epoxy
- Industry: Thermal Management
- Form / Shape: Can
- Use Temperature: 302
from Master Bond, Inc.
Master Bond EP3UF-1 is a one component, highly flowable epoxy for bonding and underfill applications. [See More]
- Type: High Dielectric
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from RS Components, Ltd.
Thermal Putty, 3.0 W/m K, non silicone, [See More]
- Use Temperature: -22 to 302
- Thermal Conductivity: 3
from Master Bond, Inc.
Master Bond X21Med is a toughened one part system that can be used for bonding and priming polyolefinic surfaces. This exceptionally low viscosity ( <250 cps) solvent based system is easy to apply and process. It cures at room temperature or more rapidly with the addition of heat. X21Med passes... [See More]
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Form / Shape: Liquid; Primer
from RS Components, Ltd.
Thermal Putty with EMI, 2.0 W/m K, 55ml [See More]
- Chemical System: Silicone
- Thermal Conductivity: 2
- Use Temperature: -58 to 392
from Master Bond, Inc.
Ideal for electromagnetic interference (EMI) and radio frequency interference (RFI) shielding applications, MB600G is an aqueous based, sodium silicate system with a graphite filler. Electrically conductive, graphite filled materials are widely used for shielding and static dissipation applications... [See More]
- Composition: Filled
- Form / Shape: Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
from RS Components, Ltd.
Thermal Putty, 2.0 W/m K, 55ml [See More]
- Chemical System: Silicone
- Thermal Conductivity: 2
- Use Temperature: -58 to 392
from Master Bond, Inc.
Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]
- Type: High Dielectric; Optical
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; UV curing system
- Composition: Unfilled
- Form / Shape: Liquid; Encapsulant or Conformal Coating
from RS Components, Ltd.
Thermal Putty [See More]
- Chemical System: Silicone
- Thermal Conductivity: 2
- Use Temperature: -40 to 392
from Master Bond, Inc.
Master Bond EP3HTSDA-2 is a fast curing, one part silver filled system offering exceptionally high thermal and electrical conductivity, along with remarkably low thermal resistance. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Filled
- Form / Shape: Liquid; Gap Filler, Foam in Place Gasket
from RS Components, Ltd.
Thermal Putty [See More]
- Chemical System: Silicone
- Use Temperature: -40 to 392
- Form / Shape: Cartridge
- Thermal Conductivity: 3
from Master Bond, Inc.
Master Bond MB600S is an aqueous based sodium silicate coating formulated for applications where electromagnetic interference/radio frequency interference (EMI/RFI) shielding is required. Tested according to IEEE 299, 2006 methods, MB600S was as effective as the aluminum reference with a shielding... [See More]
- Composition: Filled
- Form / Shape: Liquid; Encapsulant or Conformal Coating
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
from RS Components, Ltd.
Thermal Putty [See More]
- Chemical System: Silicone
- Use Temperature: -40 to 392
- Form / Shape: Cartridge
- Thermal Conductivity: 5
from RS Components, Ltd.
Thermal Putty [See More]
- Chemical System: Silicone
- Thermal Conductivity: 7
- Use Temperature: -58 to 392
from RS Components, Ltd.
Thermally conductive encapsulent 2kg kit [See More]
- Form / Shape: Kit
- Thermal Conductivity: 1.17
from RS Components, Ltd.
Epox Black Therm Conduct PotEncap Comp [See More]
- Chemical System: Epoxy
- Form / Shape: Can
from RS Components, Ltd.
UR5097 Black GP PU Resin Pack, 250g [See More]
- Chemical System: Polyurethane
- Features: Flame Retardant
- Form / Shape: Pack
- Thermal Conductivity: 0.6500
from RS Components, Ltd.
QSil 553 [See More]
- Form / Shape: Kit
- Thermal Conductivity: 0.6800
- Use Temperature: 500
from RS Components, Ltd.
Loctite CAT 24 LV 100CC [See More]
- Chemical System: Epoxy
- Form / Shape: Tin
from RS Components, Ltd.
Loctite Stycast 2850 FT Bleu BE [See More]
- Chemical System: Epoxy
- Form / Shape: Tin
from RS Components, Ltd.
Loctite Stycast 2850 FT QuartKit [See More]
- Chemical System: Epoxy
- Form / Shape: Tin
from RS Components, Ltd.
QSil 553 Grey Silicone Potting Comp 250g [See More]
- Form / Shape: Dual Cartridge
- Thermal Conductivity: 0.6800
from RS Components, Ltd.
EPOXY RESIN 250 G [See More]
- Chemical System: Epoxy
- Features: Flame Retardant
- Form / Shape: Bag
- Thermal Conductivity: 1.1
from RS Components, Ltd.
Qsil 550 Silicone Potting 250g Sachet [See More]
- Form / Shape: Dual Cartridge
- Thermal Conductivity: 0.3700
from RS Components, Ltd.
Thermally conductive 2pack epoxy,250gm [See More]
- Chemical System: Epoxy
- Thermal Conductivity: 1.26
- Form / Shape: Pack
from RS Components, Ltd.
Raytech Magic Rubber 2 Part Kit 500g [See More]
- Form / Shape: Liquid; Kit
- Dielectric Strength: 508
from RS Components, Ltd.
Raytech Magic Gel 2 Part Kit I Litre [See More]
- Form / Shape: Gel; Kit
- Dielectric Strength: 508
from RS Components, Ltd.
MG thermally conductive epoxy 832TC [See More]
- Chemical System: Epoxy
- Use Temperature: -22 to 284
- Form / Shape: Can
from RS Components, Ltd.
SILICONE-FREE HEAT TRANSFER [See More]
- Form / Shape: Grease, Paste
- Thermal Conductivity: 0.9000
- Use Temperature: -58 to 266
from Protavic America, Inc.
The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over PROTAVIC ACH... [See More]
- Composition: Unfilled
- Form / Shape: Gel; Die Bonding Adhesives
- Cure / Technology: Thermoset; Single Component
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's; Bonding BGA Packages
from Henkel Corporation - Electronics
(Known as Hysol QMI536HT ). LOCTITE ABLESTIK QMI536HT(BORON) is a high thermal version of QMI536 and is ideal for mixed stacked die applications. Non-die damaging filler. [See More]
- Industry: Electronics
- Viscosity: 13000
- Thermal Conductivity: 0.9000
from Sauereisen, Inc.
Sauereisen Insa-Lute Hi Temp Cement No. 7 is a sodium silicate adhesive cement used by leading electrical manufacturers. The cement exhibits outstanding resistance to heat and electricity. Typical applications include instrumentation assembly, coating and embedding of resistance wires, and... [See More]
- Type: High Dielectric
- Composition: Unfilled
- Chemical System: Ceramic
- Form / Shape: Liquid; Die Bonding Adhesives; Encapsulant or Conformal Coating
from Shiu Li Technology Co., Ltd
LiPOLY G566 Graphite Sheet has great thermal conductivity on the X and Y axis. The thermal conductivity is 1700W/m*K. It is flexible, which is suitable for thin products and high capability mobile devices. [See More]
- Form / Shape: Sheet Form, Die-cut Parts
- Industry: Electronics
- Gap Fill: 8.27E-4
- Thermal Conductivity: 1700
from Indium Corporation
NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in thicknesses of 40 microns or 60 microns. The bundle kits are available in standard NanoFoil only; however,... [See More]
- Industry: Semiconductors, IC's
from Ohmite Manufacturing Co.
Ohmite thermal interface materials (TIMs) are designed for use in applications requiring reliable performance, low contact resistance, long life, low maintenance and high thermal conductivity. The flexible graphite materials are die-cut to ensure exact fit and reduce module-to-module variation... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial
- Thermal Conductivity: 800
- Use Temperature: -40 to 752
- CTE: 15
from Epoxies Etc...
20-2125 is formulated for electronic potting, encapsulating and casting applications. The 20-2125 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2125 will cushion and protect sensitive electronic... [See More]
- Type: High Dielectric
- Form / Shape: Grease, Paste
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Industry: Electronics
from Nordson EFD
Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]
- Composition: Unfilled
- Form / Shape: Grease, Paste
- Cure / Technology: Single Component
- Industry: Electronics; Semiconductors, IC's
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Type: High Dielectric
- Form / Shape: Pellets
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Industry: Electronics
from Shiu Li Technology Co., Ltd
LiPOLY TR332CU has outstanding parallel thermal conduction and has high flexibility, which is suitable for thin products like mobile devices. [See More]
- Form / Shape: Sheet Form, Die-cut Parts
- Industry: Electronics
- Gap Fill: 0.0039 to 0.0059
- Use Temperature: -76 to 248
from Indium Corporation
Thickness of NanoFoil ®: 40 microns. Size of NanoFoil ®: .5 inch squares. Qty Per Bundle: 100 each. NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in... [See More]
- Industry: Semiconductors, IC's
from Shiu Li Technology Co., Ltd
LiPOLY Non-Silicone Thermal Compound N700A/B is made of non-silicon resin material and none low-molecular-weight siloxane. N700A/B helps avoid electrical contact problems. N700 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is... [See More]
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
- Gap Fill: 0.0197 to 0.1969
- Features: UL Rating
from Indium Corporation
Several low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are non-toxic replacements for mercury. The gallium-based alloys have far lower vapor pressure than mercury, reducing both the amount and toxicity of metal vapor exposure. Excellent Thermal and... [See More]
- Form / Shape: Liquid
- Use Temperature: 257
- Industry: Semiconductors, IC's
- Thermal Conductivity: 86
from Shiu Li Technology Co., Ltd
Non-Silicone Thermal Compound N700C is made of non-silicon resin material and none low-molecular-weight siloxane. N700C helps avoid electrical contact problems. N700 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is 5.0W/m*K. [See More]
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
- Gap Fill: 0.0197 to 0.1969
- Use Temperature: -76 to 257
from Indium Corporation
Thermal interface materials are useful for a variety of applications, but solder thermal interface materials (sTIM) are especially suited to high-end device cooling. To improve package reliability, it is especially important to choose the right alloy. Indium, in particular, should be considered as a... [See More]
- Industry: Semiconductors, IC's
- Thermal Conductivity: 15 to 28.1
from Shiu Li Technology Co., Ltd
Non-Silicone Thermal Compound N800AH is made of non-silicon resin material and none low-molecular-weight siloxane. N800AH helps avoid electrical contact problems. N800 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity is... [See More]
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Industry: Electronics
- Gap Fill: 0.0197 to 0.1969
- Use Temperature: -76 to 257
from Indium Corporation
Several very low melting point Indalloy ® alloys are liquid at room temperature. These gallium-based alloys are finding increased use in various applications as a replacement for toxic mercury, which has a high vapor pressure at room temperature. These alloys have reduced toxicity and lower... [See More]
- Form / Shape: Liquid
- Industry: Semiconductors, IC's
from Shiu Li Technology Co., Ltd
Non-Silicone Thermal Compound N800C-s is made of non-silicon resin material. No low molecular siloxane volatilization and low total volatile gas, no electrical contact & pollution problems. N800C-s can have low thermal resistance and high thermal conductivity. [See More]
- Form / Shape: Pad; Sheet Form, Die-cut Parts
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
- Gap Fill: 0.0197 to 0.1969
- Use Temperature: -76 to 257
from Indium Corporation
Indium Corporation ’s Solder Thermal Interface Materials radically improve: Heat dissipation efficiency in electronic devices. Thermal conductance for high power devices – with densities in excess of 1000 watts. End-of-life performance at the thermal interface – to avoid failures... [See More]
- Industry: Semiconductors, IC's
from Shiu Li Technology Co., Ltd
LiPOLY N-putty series is silicone-free and dispensable thermally conductive material. With a thermal conductivity from 3.5 W/m*K, this product can be used successfully to remove manufacturing tolerances. It is ideally suited for dispensing using the N-putty dispensing robot. [See More]
- Form / Shape: Syringe/Cartridge/Pale
- Use Temperature: -76 to 302
- Industry: Electronics
- Thermal Conductivity: 3.5
from Indium Corporation
Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]
- Industry: Semiconductors, IC's
from Shiu Li Technology Co., Ltd
LiPOLY N-putty2-s series is a non-silicon thermally conductive material without volatilization of low molecular siloxane, and low total volatile gas. With a thermal conductivity of 5.0 W/m*K, the high deformation can perfectly fill small air gaps to eliminate tolerances. It also can overcome... [See More]
- Form / Shape: Syringe/Cartridge/Pale
- Use Temperature: -76 to 302
- Industry: Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial
- Thermal Conductivity: 5
from Indium Corporation
Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]
- Industry: Semiconductors, IC's
from Shiu Li Technology Co., Ltd
LiPOLY's NL-putty series is a silicone free, low-density gel filling material. Its low density and lightweight characteristics enhance product performance, reduce production costs. Commonly used in electronic products and automotive electronic devices, this series has a thermal conductivity of... [See More]
- Form / Shape: Gel; Liquid; Syringe/Cartridge/Pale; Gap Filler, Foam in Place Gasket
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Gap Fill: 0.0039 to 0.0591
- Use Temperature: -76 to 257
from Indium Corporation
Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]
- Industry: Semiconductors, IC's
from Indium Corporation
Packaged in tape & reel bundle packs and vacuum packed in a metallized bag. [See More]
- Industry: Semiconductors, IC's