Electrically Conductive Thermal Compounds and Thermal Interface Materials
from MacDermid Alpha Electronics Solutions
The ATROX brand of conductive die attach pastes are designed to provide you with superior performance for today's stringent reliability requirements. Product Overview. ATROX conductive die attach products provide a comprehensive solution with a reduced total cost of ownership, ushering in a new era... [See More]
- Features: Electrically Conductive
- Industry: Electronics; Semiconductors, IC's
- Form / Shape: Die Bonding Adhesives
- Thermal Conductivity: 5
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Features: Electrically Conductive; Phase Change; Non-corrosive; Flexible; Dissimilar Substrates
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Addition Cure
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Features: Electrically Conductive; Non-corrosive; Dissimilar Substrates
- Composition: Filled
- Chemical System: Polyphenylene Sulfide; Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
EP79FL is a silver coated nickel filled polymer system that forms high strength bonds that are resistant to extreme cryogenic temperatures. It is electrically conductive and has a volume resistivity of <0.005 ohm-cm. As a silver coated nickel filled system, it is much more cost effective than... [See More]
- Features: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Non-corrosive; Flexible; Dissimilar Substrates
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most salient features are its high flexibility and elongation. This... [See More]
- Features: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Flexible; Dissimilar Substrates
- Chemical System: Epoxy; Polyurethane
- Type: High Dielectric
- Composition: Filled
from Master Bond, Inc.
Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures. The mix ratio of the EP75-1 system is 100 to 15 by weight. It... [See More]
- Features: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Filled
from Master Bond, Inc.
Master Bond EP3HTS-TC is a fast curing, silver filled, one part epoxy with unparalleled electrical and thermal conductivity. [See More]
- Features: Electrically Conductive; Non-corrosive; Dissimilar Substrates
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond EP4G-80Med is a one part epoxy designed for use in the assembly of medical devices. This system is formulated with a non-metallic, graphite filler, which leads to good thermal and electrical conductivity. [See More]
- Features: Electrically Conductive; Non-corrosive; Dissimilar Substrates
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond Polymer System EP21TDCSMed is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part... [See More]
- Features: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Flexible; Dissimilar Substrates
- Chemical System: Epoxy; Polyurethane
- Type: High Dielectric
- Composition: Filled
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Features: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room... [See More]
- Features: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Flexible; Dissimilar Substrates
- Chemical System: Polyphenylene Sulfide; Epoxy; Polyurethane
- Type: High Dielectric
- Composition: Filled
from Master Bond, Inc.
Ideal for electromagnetic interference (EMI) and radio frequency interference (RFI) shielding applications, MB600G is an aqueous based, sodium silicate system with a graphite filler. Electrically conductive, graphite filled materials are widely used for shielding and static dissipation applications... [See More]
- Features: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Non-corrosive; Water Based ; Dissimilar Substrates
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
- Composition: Filled
- Form / Shape: Gap Filler, Foam in Place Gasket
from Master Bond, Inc.
Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. EP79 offers a convenient one-to-one mix ratio by weight or... [See More]
- Features: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Featuring a low volume resistivity of 5-10 ohm-cm, EP21TDCN-LO is a nickel conductive system for high performance bonding and sealing applications. This smooth paste formulation is easy to handle and has a one to one mix ratio by weight or volume. It is a toughened system, formulated to withstand... [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Non-corrosive; Flexible; Dissimilar Substrates
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Henkel Corporation - Electronics
Liqui-Bond SA 2000 is a high performance, thermally conductive silicone adhesive that cures to a solid bonding elastomer. Liqui-Bond SA 2000 is supplied as a one-part liquid component, in either tube or mid-sized container form. Liqui-Bond SA 2000 features excellent low and high-temperature... [See More]
- Features: Electrically Conductive
- Industry: Electronics
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Features: Electrically Conductive; Flexible
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component
from Techsil Limited
Elecolit ® 6603 is a thermally conductive epoxy with very good metal adhesion and slight flexibility. This grade has very good flow behavior and can easily be processed using a dispenser, spreading knife or spatula. Although designed for bonding applications, 6603 can also be used as a potting... [See More]
- Features: Electrically Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Epoxy Technology
EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]
- Features: Electrically Conductive
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Aremco Products, Inc.
Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]
- Features: Electrically Conductive; Dissimilar Substrates
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Type: High Dielectric
- Form / Shape: Grease, Paste
from Henkel Corporation - Electronics
Liqui-Bond ® SA 3505 is a higher performance, thermally conductive, liquid adhesive. This material is supplied as a two-part material and requires no refrigeration. The mixed material cures at elevated temperatures. As cured, Liqui-Bond ® SA 3505 provides a strong bonding, form-in-place... [See More]
- Features: Electrically Conductive
- Industry: Electronics
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Features: Electrically Conductive; Flexible
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Techsil Limited
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]
- Features: Electrically Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Henkel Corporation - Electronics
Liqui-Bond ® EA 1805 is a two-component, epoxy based, liquid-dispensable adhesive. Liqui-Bond ® EA 1805 has a thermal conductivity of 1.8 W/mK. Liqui-Bond ® EA 1805 will be supplied in a two-component format, and refrigeration is not required. Liqui-Bond ® EA 1805 has a high bond... [See More]
- Features: Electrically Conductive
- Industry: Electronics
from Techsil Limited
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]
- Features: Electrically Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Henkel Corporation - Electronics
Liqui-Bond SA 1000 is a thermally conductive, one-part liquid silicone adhesive with a low viscosity for easy screenability. Liqui-Bond SA 1000 features a high thermal performance and maintains it ’s structure even in severe environment applications. Liqui-Bond SA 1000 features excellent low... [See More]
- Features: Electrically Conductive
- Industry: Electronics
from Techsil Limited
MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic assemblies; resists thermal and... [See More]
- Features: Electrically Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Henkel Corporation - Electronics
Liqui-Bond SA 1800 is a high performance, liquid silicone adhesive that cures to a solid bonding elastomer. The adhesive is supplied as a one-part liquid component, offered in a tube or mid-size container. Liqui-Bond SA 1800 features a combination of high thermal conductivity with a low viscosity... [See More]
- Features: Electrically Conductive
- Industry: Electronics
from Techsil Limited
MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]
- Features: Electrically Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Henkel Corporation - Electronics
Liqui-Form ® 2000 is a high thermal conductivity liquid formable material designed for demanding applications requiring a balance between dispensability, low component stresses during assembly and ease of rework. Liqui-Form ® 2000 is a highly conformable shear-thinning material which... [See More]
- Features: Electrically Conductive
- Industry: Electronics
from Techsil Limited
MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]
- Features: Electrically Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Henkel Corporation - Electronics
Known as Abletherm 2600AT ). LOCTITE ABLESTIK 2158 adhesive is designed for thermal management applications requiring high heat extraction from the die such as high power and discrete devices. This adhesive uses a unique suspension system containing silver adhesive has an extremely high silver... [See More]
- Features: Electrically Conductive
- Thermal Conductivity: 20
- Industry: Electronics
from Techsil Limited
MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Features: Electrically Conductive
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Industry: Electronics
from Henkel Corporation - Electronics
Poly-Pad 1000 is a fiberglass-based insulator coated with a filled polyester resin. The mterial offers superior thermal resistance for high performance applications. Polyester-based, thermally conductive insulators from Bergquist provide a complete family of materials for silicone-sensitive... [See More]
- Features: Electrically Conductive
- Industry: Electronics
from Techsil Limited
Techsil RTV 1084G is a non-corrosive, 1-part, grey silicone rubber. RTV 1084 G has amazing thermal conductivity (2.3 W/mK) and is non corrosive, fast skinning with low linear shrinkage. It is one of a new family of products called acetone cure sealants that are solvent free. It exhibits excellent... [See More]
- Features: Electrically Conductive
from Henkel Corporation - Electronics
Poly-Pad 400 is a fiberglass-reinforced insulator coated with a filled polyester resin. Poly-Pad 400 is economical and designed for most standard applications. Polyester-based, thermally conductive insulators from Bergquist provide a complete family of materials for silicone-sensitive applications. [See More]
- Features: Electrically Conductive
- Industry: Electronics
from Techsil Limited
Techsil ® TIM11123 (GB) Grey is a 200 micron, self-gapping, non-corrosive, 1-part room temperature vulcanizing (RTV) silicone rubber. It is one of a new family of products called acetone cure sealants. These products are cured rapidly in contact with atmospheric moisture to a tough rubber that... [See More]
- Features: Electrically Conductive
- Form / Shape: Gap Filler, Foam in Place Gasket
from Henkel Corporation - Electronics
Poly-Pad K-10 is a composite of film coated with a polyester resin. The material offers superior thermal performance for your most critical applications with a thermal resistance of 0.2 °C-in2/W as well as excellent dielectric strength. Polyeste- based, thermally conductive insulators from... [See More]
- Features: Electrically Conductive
- Industry: Electronics
from Henkel Corporation - Electronics
Poly-Pad K-4 is a composite of film coated with a polyester resin. The material is an economical insulator and the film carrier provides excellent dielectric and physical strength. Polyester-based, thermally conductive insulators from Bergquist provide a complete family of material for... [See More]
- Features: Electrically Conductive
- Industry: Electronics