Electrically Conductive Thermal Compounds and Thermal Interface Materials

Copper-filled, Electrically And Thermally Conductive Epoxy -- EPO-TEK® 430
from Epoxy Technology

EPO-TEK ® 430 is a copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized. [See More]

  • Features: Electrically Conductive; EMI/RFI Shielding
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Liqui Bond SA 2000 (One-Part) -- 8806384795649
from Henkel Corporation - Electronics

Liqui-Bond SA 2000 is a high performance, thermally conductive silicone adhesive that cures to a solid bonding elastomer. Liqui-Bond SA 2000 is supplied as a one-part liquid component, in either tube or mid-sized container form. Liqui-Bond SA 2000 features excellent low and high-temperature... [See More]

  • Features: Electrically Conductive
  • Industry: Electronics
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Features: Electrically Conductive; Phase Change; Non-corrosive; Flexible; Dissimilar Substrates
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component  ; Addition Cure
MG Chemicals 8331 Silver Conductive Epoxy 115gm -- MGEP00007
from Techsil Limited

MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]

  • Features: Electrically Conductive
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Industry: Electronics
Ceramabond -- 890
from Aremco Products, Inc.

Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]

  • Features: Electrically Conductive; Dissimilar Substrates
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Type: High Dielectric
  • Form / Shape: Grease, Paste
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Features: Electrically Conductive; Flexible
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component  
T-3 Heat Transfer Compound -- TFK-4
from Thermon Manufacturing Co.

T-3 heat transfer compound creates an efficient thermal bond between a steam or electric heater and process pipes or equipment. A single “Thermonized ™ ”steam tracer utilizing Thermon ’s heat transfer compound is more cost effective than a contoured clamp-on jacket and has... [See More]

  • Features: Electrically Conductive
  • Form / Shape: Grease, Paste
  • Cure / Technology: Single Component
  • Industry: Electric Power