Die Bonding Adhesive / Compound Thermal Compounds and Thermal Interface Materials

Black, Low Halogen, Electrically Insulating Die Attach Adhesive -- EPO-TEK® TJ1104-LH
from Epoxy Technology

A black, single component, low halogen, electrically insulating die attach adhesive with extended pot life. [See More]

  • Form / Shape: Die Bonding Adhesives; Grease, Paste; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Filled
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Form / Shape: Liquid; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Unfilled
Ceramabond -- 503
from Aremco Products, Inc.

High fired strength, dense ceramics [See More]

  • Form / Shape: Liquid; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
  • Chemical System: Ceramic
  • Type: High Dielectric
  • Composition: Filled
55 Shore D polyurethane adhesive -- 10-2055
from Epoxies Etc...

The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]

  • Form / Shape: Die Bonding Adhesives; Grease, Paste
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Polyurethane
  • Industry: OEM or Industrial
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Form / Shape: Liquid; Die Bonding Adhesives; Encapsulant or Conformal Coating
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset; Two Component  
Adhesive Paste -- No. 19
from Sauereisen, Inc.

Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]

  • Form / Shape: Die Bonding Adhesives; Grease, Paste
  • Chemical System: Ceramic
  • Type: High Dielectric
  • Composition: Unfilled