Die Bonding Adhesive / Compound Thermal Compounds and Thermal Interface Materials
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Form / Shape: Liquid; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Thermon, Inc
The New & Improved T-85 is a pre-mixed epoxy-based heat transfer compound with higher temperature ratings and the highest possible bond strength for use in moist and corrosive environments. T-85 is typically utilized on pumps, valves and equipment where maximum bond strength for tracing installation... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Use Temperature: 32 to 450
- Cure / Technology: Single Component
- Thermal Conductivity: 34.61 to 69.23
from MacDermid Alpha Electronics Solutions
A silver sinter paste, providing high thermal and electrical conductivity. Product Overview. The ALPHA ® Argomax ® 2020 Paste is a high-performance silver sinter paste used in applications that require excellent thermal and electrical conductivity. This paste is particularly suited for... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Industry: Automotive; Electronics; Semiconductors, IC's
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Form / Shape: Liquid; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Composition: Filled
- Chemical System: Polyphenylene Sulfide; Epoxy
- Cure / Technology: Thermoset; Single Component
from Thermon, Inc
T-99 is a specialty high temperature heat transfer compound formulated to provide high thermal stability and bond strength up to 1204°C (2200°F). Unlike other grades of heat transfer compounds, it is also electrically non-conductive (when cured). It is supplied ready to use and may be applied by... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Use Temperature: 32 to 2200
- Cure / Technology: Single Component
- Thermal Conductivity: 25.96 to 51.92
from Master Bond, Inc.
Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most salient features are its high flexibility and elongation. This... [See More]
- Form / Shape: Die Bonding Adhesives; Optional Premixed and Frozen; Grease, Paste; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy; Polyurethane
- Type: High Dielectric
- Composition: Filled
from Master Bond, Inc.
Master Bond Polymer System EP75-1 is a two component, graphite filled, electrically conductive epoxy for high performance bonding, sealing and coating formulated to cure at room temperature or more rapidly at elevated temperatures. The mix ratio of the EP75-1 system is 100 to 15 by weight. It... [See More]
- Form / Shape: Liquid; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Filled
from Master Bond, Inc.
Supreme 12AOHT-LO is a toughened system with superior resistance to aggressive thermal cycling and shock. Cryogenically serviceable, it combines superior thermal conductivity with reliable electrical insulation properties. This dimensionally stable epoxy has formidable bond strength, particularly in... [See More]
- Form / Shape: Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Master Bond EP110F8-3 is a two component high performance epoxy resin system with a long pot life for potting, sealing, encapsulating and casting. [See More]
- Form / Shape: Liquid; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Master Bond EP70CN is a two component, epoxy system for bonding, sealing, coating and potting featuring a natural curing agent. [See More]
- Form / Shape: Liquid; Die Bonding Adhesives; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Type: High Dielectric; Optical
- Composition: Unfilled
from Master Bond, Inc.
Master Bond EP3HTS-TC is a fast curing, silver filled, one part epoxy with unparalleled electrical and thermal conductivity. [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste; Encapsulant or Conformal Coating
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond Polymer System EP21TDCSMed is a two component, silver filled, electrically conductive adhesive/sealant that meets USP Class VI specifications for medical applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part... [See More]
- Form / Shape: Die Bonding Adhesives; Optional Premixed and Frozen; Grease, Paste; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy; Polyurethane
- Type: High Dielectric
- Composition: Filled
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond MasterSil 705TC is a one component, thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It features outstanding thermal conductivity and is well suited for applications that require flexibility and high temperature resistance. It cures... [See More]
- Form / Shape: Die Bonding Adhesives
- Chemical System: Silicone
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Master Bond EP17HTND-CCM is a single part, heat cured epoxy system for bonding, sealing and glob top applications. [See More]
- Form / Shape: Die Bonding Adhesives; Flowable Paste; Grease, Paste
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]
- Form / Shape: Liquid; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing, potting and encapsulation for service up to 450-500 °F. [See More]
- Form / Shape: Liquid; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Filled
from Master Bond, Inc.
Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. EP79 offers a convenient one-to-one mix ratio by weight or... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste; Gap Filler, Foam in Place Gasket
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Shiu Li Technology Co., Ltd
LiPOLY ’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties. It... [See More]
- Form / Shape: Gel; Die Bonding Adhesives; Grease, Paste
- Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing (optional feature); High Heat
- Chemical System: Silicone
- Industry: Electronics
from Epoxies Etc...
The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Polyurethane
- Industry: OEM or Industrial
from Aremco Products, Inc.
High fired strength, dense ceramics [See More]
- Form / Shape: Liquid; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Ceramic
- Type: High Dielectric
- Composition: Filled
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Form / Shape: Liquid; Die Bonding Adhesives; Encapsulant or Conformal Coating
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component
from Epoxy Technology
EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Sauereisen, Inc.
Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Chemical System: Ceramic
- Type: High Dielectric
- Composition: Unfilled
from Epoxies Etc...
70-3800 is a low viscosity, aluminum filled, epoxy tooling resin. This system is used for making heat resistant cast tools or parts that require very good thermal conductivity. 70-3800 is easily machined, drilled, tapped, or polished, and is ideal for vacuum form molds, dies, drill jigs, injection... [See More]
- Form / Shape: Liquid; Die Bonding Adhesives
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Sauereisen, Inc.
Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]
- Form / Shape: Liquid; Powder; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
- Chemical System: Ceramic
- Type: High Dielectric
- Composition: Unfilled
from Epoxies Etc...
50-3186 is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 is a perfect choice for applications requiring high thermal conductivity, low thermal expansion, and high operating temperature performance. [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Protavic America, Inc.
Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]
- Form / Shape: Liquid; Die Bonding Adhesives
- Chemical System: Epoxy
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component
from Protavic America, Inc.
PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]
- Form / Shape: Gel; Die Bonding Adhesives; Encapsulant or Conformal Coating
- Chemical System: Silicone
- Type: High Dielectric
- Composition: Filled