Epoxy (EP) Thermal Compounds and Thermal Interface Materials
from Shiu Li Technology Co., Ltd
LiPOLY EP770 is a two-part epoxy material for gap filling. Extremely low viscosity and flowability. Good dispersion and no delamination. The high deformation material, which filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the peculiar... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Form / Shape: Syringe/Cartridge; Gap Filler, Foam in Place Gasket
- Use Temperature: -76 to 302
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component
from ELANTAS PDG, Inc.
Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]
- Chemical System: Epoxy
- Composition: Filled
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component
from MacDermid Alpha Electronics Solutions
Product Description. ER2188 General purpose epoxy potting compound is a two part epoxy resin for general use within the electronics industry. It ’s a good all round resin offering a cost effective solution for a wide range of applications where protection is required. ER2188 is flame retardant... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Thermoset; Two Component
- Features: Flame Retardant
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component
from MacDermid Alpha Electronics Solutions
Product Description. ER2220 Highly thermally conductive epoxy potting compound is a flame retardant, two part epoxy resin. Designed to meet increasing demands for efficient thermal dissipation, ER2220 combines ease of processing with an enhanced thermal conductivity when compared to traditional... [See More]
- Chemical System: Epoxy
- Features: Flame Retardant
- Cure / Technology: Thermoset; Two Component
- Use Temperature: -40 to 266
from Master Bond, Inc.
Master Bond EP126 withstands very high temperatures, up to +600 °F, and has a glass transistion temperature of +240 °C. This two component product features unique handling properties as Part A is a moderate viscosity liquid and Part B is a powder. It can be easily mixed using a forgiving 100... [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
from MacDermid Alpha Electronics Solutions
Product Description. Electrolubes ER6003 epoxy potting compound has been specially developed for the LED Industry in India to protect the drivers from the varying environments found on the Indian subcontinent. The Resin offers good protection against a wide range of environments as well as offering... [See More]
- Chemical System: Epoxy
- Use Temperature: -40 to 320
- Cure / Technology: Thermoset
- Thermal Conductivity: 1
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component
from MacDermid Alpha Electronics Solutions
Product Description. ER6002LV is a thermally conductive epoxy potting and encapsulation resin designed primarily for use in LED Driver units. ER6002LV has good flow characteristics which allows potting of small units or complex geometries. Featuring an off-white colour finish, ER6002LV is designed... [See More]
- Chemical System: Epoxy
- Use Temperature: -40 to 320
- Cure / Technology: Thermoset
- Thermal Conductivity: 1
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Chemical System: Polyphenylene Sulfide; Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Filled
- Form / Shape: Liquid; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
from MacDermid Alpha Electronics Solutions
Product Description. ER6007 is a two-part modified silicone potting compound / encapsulating resin designed for the protection of electronic devices or components. It has been formulated as a soft silicone resin allowing it to be easily repairable while offering the same levels of protection you... [See More]
- Chemical System: Epoxy; Silicone
- Use Temperature: -76 to 356
- Industry: Electronics
- Thermal Conductivity: 0.7000
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
from MacDermid Alpha Electronics Solutions
Product Description. ER2183 Thermally conductive epoxy potting compound is an epoxy resin which meets UL94 flame retardancy using clean technology which results in relatively low toxicity fumes and low smoke emission. It is a low viscosity alternative to ER2220 system which is ideal for potting and... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Thermoset
- Features: Flame Retardant
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from MacDermid Alpha Electronics Solutions
Product Description. ER2221 thermally conductive epoxy potting compound has been formulated as high temperature resistant and thermally conductive encapsulation resin which retains excellent characteristics throughout thermal cycling. ER2221 exhibits excellent thermal resistance up to an operating... [See More]
- Chemical System: Epoxy
- Industry: Aerospace; Automotive; Electronics; OEM or Industrial
- Cure / Technology: Thermoset; Two Component
- Use Temperature: 302
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from MacDermid Alpha Electronics Solutions
Product Description. ER2074 Thermally conductive epoxy resin is a flame retardant system with UL94 V-0 approval. The flame retardant technology used is halogen free leading to relatively low toxicity fumes and low smoke emission and the lack of abrasive fillers means that there is lower wear on... [See More]
- Chemical System: Epoxy
- Features: Flame Retardant
- Cure / Technology: Thermoset; Two Component
- Thermal Conductivity: 1.26
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: High Dielectric; Optical
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from MacDermid Alpha Electronics Solutions
Product Description. ER6010 X-Ray Shielding Potting Compound is a specialist epoxy resin which has been formulated for applications which require critical protection of the circuit design such as medical or military applications or other sensitive designs. After encapsulating the circuit, when... [See More]
- Chemical System: Epoxy
- Use Temperature: 356
- Industry: Military
from Master Bond, Inc.
Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]
- Chemical System: Epoxy
- Composition: Filled
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Chemical System: Epoxy
- Composition: Filled
- Type: High Dielectric; Optical
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Offering impressive physical strength characteristics, EP41S-F is an electrically insulative two component epoxy that cures rapidly at ambient and elevated temperatures. Typically faster curing epoxies are somewhat less chemically resistant than other types of systems, but EP41S-F is one of the few... [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Form / Shape: Die Bonding Adhesives; Grease, Paste; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
from Master Bond, Inc.
Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated storage although this is... [See More]
- Chemical System: Epoxy
- Composition: Unfilled
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component
from ACCRAbond, Inc.
INSTAbond ® 809FR. INSTAbond ® 809 FR exhibits good thermal conductivity, excellent flow properties, and low exotherm characteristics in large masses. INSTAbond ® 809 FR meets the requirements for UL-94 V-0 rating for flame retardancy. [See More]
- Chemical System: Epoxy
- Features: Flame Retardant; UL Rating
- Cure / Technology: Two Component
from Henkel Corporation - Electronics
One component, low temperature curing thermally conductive epoxy adhesive. [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Single Component
- Thermal Conductivity: 2.3
from Epoxies Etc...
70-3800 is a low viscosity, aluminum filled, epoxy tooling resin. This system is used for making heat resistant cast tools or parts that require very good thermal conductivity. 70-3800 is easily machined, drilled, tapped, or polished, and is ideal for vacuum form molds, dies, drill jigs, injection... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
- Composition: Filled
- Form / Shape: Liquid; Die Bonding Adhesives
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Type: High Dielectric; Optical
- Form / Shape: Grease, Paste
from OMEGA Engineering, Inc.
OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]
- Chemical System: Epoxy
- Cure / Technology: Two Component
- Type: High Dielectric
- Form / Shape: Liquid
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 84-1LMIT, Epoxy, Component assembly, Electrically Conductive Adhesive. LOCTITE ® ABLESTIK 84-1LMIT adhesive is designed for medium die attach applications. This adhesive is ideal for application by syringe dispensing or screen printing. Electrically conductive. High thermal... [See More]
- Chemical System: Epoxy
- Form / Shape: Paste
- Cure / Technology: Single Component
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Filled
- Form / Shape: Die Bonding Adhesives; Grease, Paste
from Techsil Limited
Elecolit ® 6603 is a thermally conductive epoxy with very good metal adhesion and slight flexibility. This grade has very good flow behavior and can easily be processed using a dispenser, spreading knife or spatula. Although designed for bonding applications, 6603 can also be used as a potting... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Thermoset
- Features: Electrically Conductive
from Epoxies Etc...
50-3122 is a one component (no mixing is necessary) epoxy adhesive with a unique combination of physical properties. This adhesive provides both high shear and high peel strengths. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205 °C. 50-3122 is... [See More]
- Chemical System: Epoxy
- Composition: Filled
- Type: High Dielectric
- Cure / Technology: Thermoset; Single Component
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive LOCTITE ® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Designed as an instrument adhesive, LOCTITE ABLESTIK 8-2 adhesive offers eight times the thermal conductivity of unfilled epoxies. [See More]
- Chemical System: Epoxy
- Cure / Technology: Single Component
- Type: High Dielectric
from Protavic America, Inc.
Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
- Type: High Dielectric
- Form / Shape: Liquid; Die Bonding Adhesives
from Techsil Limited
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Thermoset
- Features: Electrically Conductive
from Epoxies Etc...
50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Form / Shape: Liquid
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE ® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Flexible. Thixotropic. High viscosity. Long work life. Easy handling. High thermal conductivity. Reduced stress [See More]
- Chemical System: Epoxy
- Cure / Technology: Two Component
- Type: High Dielectric
- Form / Shape: Paste
from Protavic America, Inc.
A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Filled
- Form / Shape: Glob Top, Daub, Doming or Overfill; Liquid; Die Bonding Adhesives
from Techsil Limited
MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Thermoset
from Epoxies Etc...
10-3003 NS is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non critical mix ratio and adjustable flexibility. 10-3003 NS is also very safe to use due to the absence of harmful solvents and toxic chemicals in the... [See More]
- Chemical System: Epoxy
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Industry: OEM or Industrial
from Henkel Corporation - Industrial
Clear epoxy resin hardener which is one part of a two part epoxy system designed for use with a variety of LOCTITE HYSOL resins. LOCTITE ® PE 3164 is a clear epoxy resin hardener which forms a black, fast gelling, low viscosity, room temperature cure potting compound with high thermal... [See More]
- Chemical System: Epoxy
from Protavic America, Inc.
PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]
- Chemical System: Epoxy
- Composition: Filled
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
from Techsil Limited
MG Chemicals 8331 is a Silver Conductive Epoxy with a moderate cure time and high conductivity. This is an economical electronic epoxy with good electrical and thermal conductivities. The adhesive bonds very well to a variety of surfaces, it resists thermal and mechanical shocks and provides the low... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Thermoset
- Features: Electrically Conductive
from Henkel Corporation - Industrial
LOCTITE STYCAST 2762FT, Epoxy, High Temperature Resistance, High Thermal Conductivity, Potting, Encapsulant LOCTITE ® STYCAST 2762FT epoxy encapsulant is designed for potting electronic components exposed to harsh environments. This material is also ideal for large and complex castings that... [See More]
- Chemical System: Epoxy
- Viscosity: 25000
- Cure / Technology: Two Component
from Techsil Limited
MG Chemicals 8330 Silver Conductive Epoxy is a higher conductivity version of the 8331 Silver Conductive Epoxy. It is an electronic grade epoxy which combines a moderate curing rate and a high conductivity. It bonds very well to most substrates used in electronic assemblies; resists thermal and... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Thermoset
- Features: Electrically Conductive
from Henkel Corporation - Industrial
LOCTITE STYCAST 2850FTJ, Epoxy, Encapsulant. LOCTITE ® STYCAST 2850FTJ epoxy encapsulant is designed for use in high voltage applications where surface arcing or tracking is a concern. LOCTITE STYCAST 2850FTJ is recommended for encapsulation of components that require heat dissipation and... [See More]
- Chemical System: Epoxy
- Viscosity: 225000
- Cure / Technology: Two Component
from Techsil Limited
MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Thermoset
- Features: Electrically Conductive
from Henkel Corporation - Industrial
LOCTITE STYCAST 2850KT CAT 24LV, Epoxy, Encapsulant LOCTITE ® STYCAST 2850KT CAT 24LV epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies. It is also recommended for use in high voltage applications where surface arching or tracking is a... [See More]
- Chemical System: Epoxy
- Use Temperature: 85 to 221
- Cure / Technology: Two Component
- Thermal Conductivity: 2.29
from Techsil Limited
MG Chemicals 8330S is a Silver Conductive Epoxy with a slow cure time and extreme conductivity. This electronic grade epoxy combines a long working time and high conductivity. The cured conductive adhesive bonds very well to most substrates used in electronic assemblies, resists thermal and... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Thermoset
- Features: Electrically Conductive
from Henkel Corporation - Industrial
LOCTITE STYCAST 2851FT, Epoxy, Encapsulant LOCTITE ® STYCAST 2851FT is recommended for encapsulation of components that require heat dissipation and thermal shock properties . It has a low coefficient of thermal expansion and exhibits excellent resistance to a wide variety of industrial... [See More]
- Chemical System: Epoxy
- Thermal Conductivity: 1.36
- Cure / Technology: Single Component
- Tensile (Break): 7250
from Techsil Limited
MG Chemicals 8329TCS is a slow cure electrically insulating epoxy adhesive. Combines a long working 1:1 mix ratio and a 4 hour work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Thermoset
from Henkel Corporation - Industrial
LOCTITE STYCAST E 2534 FR CAT 9, Epoxy, Potting LOCTITE ® STYCAST E 2534 FR CAT 9 epoxy potting compound complies with recent demands on environmentally friendly products and does not contain brominated flame retardants. LOCTITE STYCAST E 2534 FR CAT 9 can be used with a variety of catalysts. [See More]
- Chemical System: Epoxy
- Use Temperature: 40 to 302
- Cure / Technology: Two Component
- Thermal Conductivity: 1.5
from Techsil Limited
MG Chemicals 8329TCM is a medium cure thermally conductive epoxy adhesive which has a convenient 1:1 mix ratio and a 45 minute work life. The adhesive element of this grade bonds very well to most substrates used in electronic assemblies; this grade also offers resistance to mechanical shocks and... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Cure / Technology: Thermoset
- Features: Electrically Conductive
from Henkel Corporation - Industrial
LOCTITE STYCAST EE 4215/HD 3561, Epoxy, Potting and Encapsulating. LOCTITE ® STYCAST EE 4215/HD 3561 is a filled system recommended for potting applications where rigid or flexible wire leads protrude directly from the encapsulation and where high impact strength is required. This system... [See More]
- Chemical System: Epoxy
- Cure / Technology: Two Component
from Techsil Limited
Techsil ® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure... [See More]
- Chemical System: Epoxy
- Form / Shape: Liquid
- Cure / Technology: Two Component
- Industry: Electronics
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 5025E, Epoxy Film, Die attach LOCTITE ® ABLESTIK 5025E unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. Thin, uniform bondline control. Provides RF/EMI shielding. Electrically... [See More]
- Chemical System: Epoxy
- Thermal Conductivity: 6.5
- Industry: Military
from Henkel Corporation - Industrial
LOCTITE STYCAST 2850FT BL, Epoxy, Encapsulant. LOCTITE ® STYCAST 2850FT BL epoxy is designed for applications where electrical insulation and mechanical protection must be maintained while coping with heat transfer considerations. LOCTITE STYCAST 2850FT BL can be used with a variety of... [See More]
- Chemical System: Epoxy
- Thermal Conductivity: 1.38
- Cure / Technology: Two Component
- Viscosity: 250000