Grease / Paste Thermal Compounds and Thermal Interface Materials
from RS Components, Ltd.
Silicon-free heat sink compound. Easy to apply with the practical syringe. Extremely high thermal conductivity. For the thermal coupling of electronic components. Thermal Conductivity = 0.9W/m ·K. Material = Non-Silicone. Maximum Operating Temperature = +130 °C. Minimum Operating... [See More]
- Form / Shape: Grease, Paste
- Thermal Conductivity: 0.9000
- Use Temperature: -58 to 266
from Shiu Li Technology Co., Ltd
LiPOLY ’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties. It... [See More]
- Form / Shape: Gel; Die Bonding Adhesives; Grease, Paste
- Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing (optional feature); High Heat
- Chemical System: Silicone
- Industry: Electronics
from Thermon, Inc
T-3 heat transfer compound now has higher temperature ratings than ever before while still creating an efficient thermal bond between a steam or electric heater and process pipes or equipment. A single "Thermonized ™"steam tracer utilizing Thermon's heat transfer compound is more cost... [See More]
- Form / Shape: Grease, Paste; Gap Filler, Foam in Place Gasket
- Use Temperature: 32 to 850
- Cure / Technology: Single Component
- Thermal Conductivity: 34.61 to 69.23
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Fujipoly® America Corp.
Fujipoly ® America announces the release of its new SARCON ® SPG-70A. It is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0 W/m °K and has the lowest thermal resistance among our dispensable SPG products. When applied between heat-generating... [See More]
- Form / Shape: Grease, Paste; Gap Filler, Foam in Place Gasket
- Industry: Electronics
- Chemical System: Silicone
- Thermal Conductivity: 7
from RS Components, Ltd.
Silicon-free heat sink compound. Easy to apply with the practical syringe. Extremely high thermal conductivity. For the thermal coupling of electronic components. Thermal Conductivity = 0.9W/m ·K. Material = Non-Silicone. Maximum Operating Temperature = +130 °C. Minimum Operating... [See More]
- Form / Shape: Grease, Paste
- Thermal Conductivity: 0.9000
- Use Temperature: -58 to 266
from Thermon, Inc
The New & Improved T-85 is a pre-mixed epoxy-based heat transfer compound with higher temperature ratings and the highest possible bond strength for use in moist and corrosive environments. T-85 is typically utilized on pumps, valves and equipment where maximum bond strength for tracing installation... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Use Temperature: 32 to 450
- Cure / Technology: Single Component
- Thermal Conductivity: 34.61 to 69.23
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Form / Shape: Grease, Paste; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Addition Cure
from Fujipoly® America Corp.
Fujipoly ® USA introduces new 5 and 6W/m-K SARCON ® thermally conductive greases to the North American market. SARCON ® SG-50NS and SG-60NS greases offer excellent stability over wide temperature ranges with low thermal resistance. They feature exceptionally low bleed and evaporation as... [See More]
- Form / Shape: Grease, Paste
- Thermal Conductivity: 5 to 6
- Industry: Electronics
from RS Components, Ltd.
MG Chemical 8616 super thermal grease II is a synthetic oil-based low thermal resistant grease. Designed for those applications where the maximum heat flow is a must.,The thermal grease is available in a 3 ml syringe 124-7689, a 25 ml tub 124-7690 or a 85 ml tube 124-7691. Use when you want to... [See More]
- Form / Shape: Grease, Paste
- Thermal Conductivity: 1.8
- Use Temperature: -90 to 329
from Thermon, Inc
T-99 is a specialty high temperature heat transfer compound formulated to provide high thermal stability and bond strength up to 1204°C (2200°F). Unlike other grades of heat transfer compounds, it is also electrically non-conductive (when cured). It is supplied ready to use and may be applied by... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Use Temperature: 32 to 2200
- Cure / Technology: Single Component
- Thermal Conductivity: 25.96 to 51.92
from Master Bond, Inc.
Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most salient features are its high flexibility and elongation. This... [See More]
- Form / Shape: Die Bonding Adhesives; Optional Premixed and Frozen; Grease, Paste; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy; Polyurethane
- Type: High Dielectric
- Composition: Filled
from Fujipoly® America Corp.
Sarcon ® SG-07SL and SG-26SL are highly thermally conductive, non-reactive silicone-based greases that offer low thermal resistance and maintain a nonflow able composition. Unique binding agents and product formulation ensure the lowest amount of bleed and evaporation. Suited for thin bond line... [See More]
- Form / Shape: Grease, Paste
- Industry: Electronics; Semiconductors, IC's
- Chemical System: Silicone
- Use Temperature: -67 to 401
from RS Components, Ltd.
MG Chemical 8616 super thermal grease II is a synthetic oil-based low thermal resistant grease. Designed for those applications where the maximum heat flow is a must.,The thermal grease is available in a 3 ml syringe 124-7689, a 25 ml tub 124-7690 or a 85 ml tube 124-7691. Use when you want to... [See More]
- Form / Shape: Grease, Paste
- Thermal Conductivity: 1.8
- Use Temperature: -90 to 329
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Fujipoly® America Corp.
SARCON ® SPG-25B-NS from Fujipoly ® is an easy to dispense, low- viscosity, silicone free compound that exhibits a thermal conductivity of 2.5 W/m °K and a thermal resistance of only 2.1 °K •cm2/W. When applied between heat-generating components and a nearby heat sink or... [See More]
- Form / Shape: Grease, Paste; Gap Filler, Foam in Place Gasket
- Use Temperature: -40 to 248
- Industry: Electronics
- Thermal Conductivity: 2.5 to 25
from RS Components, Ltd.
MG Chemical 8616 super thermal grease II is a synthetic oil-based low thermal resistant grease. Designed for those applications where the maximum heat flow is a must.,The thermal grease is available in a 3 ml syringe 124-7689, a 25 ml tub 124-7690 or a 85 ml tube 124-7691. Use when you want to... [See More]
- Form / Shape: Grease, Paste
- Thermal Conductivity: 1.8
- Use Temperature: -90 to 329
from Master Bond, Inc.
Elastomeric adhesive system, X5TC delivers thermal conductivity of 10-12 BTU •in/ft2 •hr • °F [1.44-1.73 W/m •K] while maintaining excellent electrical insulation properties. It is well suited for bonding dissimilar substrates and performs well when subjected to thermal... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Elastomeric
- Type: High Dielectric
- Composition: Unfilled
from RS Components, Ltd.
MG Chemicals 8617 super thermal grease III is a non-silicone, zinc oxide free, non-corrosive grease. The thermal grease is designed to improve the thermal interface between irregular and pitted surfaces. Use the 8617 grease to improve the thermal interface contact conductivity between your heat... [See More]
- Form / Shape: Grease, Paste
- Thermal Conductivity: 1
- Use Temperature: -90 to 329
from Master Bond, Inc.
Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme... [See More]
- Form / Shape: Glob Top, Daub, Doming or Overfill; Grease, Paste; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from RS Components, Ltd.
Thermally compound intended for use as thermal interface between processors and heatsink. High thermal performance : 0.32 °C/W ( TO220 termal test @ 50 psi). Density (g/cc) : 2.1. The compound requires pressure of assembly to cause flow. Thermal Conductivity = 1.5W/m ·K. Material =... [See More]
- Form / Shape: Grease, Paste
- Thermal Conductivity: 1.5
- Use Temperature: 302
from Master Bond, Inc.
Master Bond EP62-1AO is a two component, flowable epoxy system with an exceptionally long open time at ambient temperature. [See More]
- Form / Shape: Grease, Paste
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from RS Components, Ltd.
General purpose silicone grease suitable to be used in various applications and in a wide operating temperature range. This metal oxide filled silicone oil paste, gives a superior thermal conductivity for thermal coupling of electrical and electronic components. The thermal grease is efficient and... [See More]
- Form / Shape: Grease, Paste
- Use Temperature: -40 to 392
- Chemical System: Silicone
- Thermal Conductivity: 2.9
from Master Bond, Inc.
Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. It readily develops a high bonding strength of more than 2000 psi tensile... [See More]
- Form / Shape: Grease, Paste; Gap Filler, Foam in Place Gasket
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from RS Components, Ltd.
Heat sink grease gives excellent thermal conductivity. Will not dry out, harden or melt. Maximises heat transfer between circuit components & heat sinks. Thermal Conductivity = 0.63W/m ·K. Material = Silicone. Maximum Operating Temperature = +200 °C. Minimum Operating Temperature = -73... [See More]
- Form / Shape: Grease, Paste
- Use Temperature: -99 to 392
- Chemical System: Silicone
- Thermal Conductivity: 0.6300
from Master Bond, Inc.
Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. EP79 offers a convenient one-to-one mix ratio by weight or... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste; Gap Filler, Foam in Place Gasket
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from RS Components, Ltd.
A non silicone heat transfer compound containing various metal oxide (ceramic) powders which give exceptional thermal conductivity. Excellent non creep characteristics. Excellent thermal conductivity even at high temperatures. Easy to handle. Low evaporation weight loss. White colour for ease of... [See More]
- Form / Shape: Grease, Paste
- Thermal Conductivity: 2.5
- Use Temperature: -58 to 266
from Master Bond, Inc.
Featuring a low volume resistivity of 5-10 ohm-cm, EP21TDCN-LO is a nickel conductive system for high performance bonding and sealing applications. This smooth paste formulation is easy to handle and has a one to one mix ratio by weight or volume. It is a toughened system, formulated to withstand... [See More]
- Form / Shape: Grease, Paste
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Sauereisen, Inc.
Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Chemical System: Ceramic
- Type: High Dielectric
- Composition: Unfilled
from Hi-Tech Seals, Inc.
HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]
- Form / Shape: Grease, Paste
- Cure / Technology: Two Component
- Chemical System: Acrylic
- Industry: Electronics
from Aremco Products, Inc.
High thermal conductivity, probes, sensors [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste; Gap Filler, Foam in Place Gasket
- Chemical System: Ceramic
- Type: High Dielectric
- Composition: Filled
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from OMEGA Engineering, Inc.
OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Silicone
- Type: High Dielectric
- Cure / Technology: Single Component
from Nordson EFD
Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]
- Form / Shape: Grease, Paste
- Cure / Technology: Single Component
- Composition: Unfilled
- Industry: Electronics; Semiconductors, IC's
from Bluestar Silicones USA Corp.
Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]
- Form / Shape: Grease, Paste
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics; Electric Power; Semiconductors, IC's
from Epoxies Etc...
The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Polyurethane
- Industry: OEM or Industrial
from Allied Electronics, Inc.
Ther-O-Link is a white thermal compound that cost effectively enhances the heat transfer between a semiconductor case and a heat sink. Silicone-based, and easy to apply, Ther-O-Link substantially reduces dry interface thermal resistance, while providing long life under a variety of conditions. [See More]
- Form / Shape: Grease, Paste
- Use Temperature: -40 to 392
from Wacker Chemical Corp.
Pure white, soft consistency, heat sink paste with marked thermal conductivity. Electrically insulating. Application. WACKER ® SILICONE PASTE P 12 is used especially in semiconductor technology as a heat sink paste. Wherever it is important to have good heat transfer from a semiconductor to a... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Silicone
- Type: High Dielectric
- Industry: Electronics
from Techsil Limited
Momentive TIA241GF is a 2 part, thermally conductive silicone that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, the non-slumping paste consistency of TIA214GF provides physical stability to prevent run-off after dispense. [See More]
- Form / Shape: Grease, Paste; Gap Filler, Foam in Place Gasket
- Industry: Electronics
- Chemical System: Silicone
- Features: Flame Retardant
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Epoxy
- Type: High Dielectric; Optical
- Cure / Technology: Thermoset; Two Component
from Aremco Products, Inc.
Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]
- Form / Shape: Grease, Paste
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Type: High Dielectric
- Industry: Electronics
from OMEGA Engineering, Inc.
OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]
- Form / Shape: Grease, Paste
- Chemical System: Silicone
- Type: High Dielectric
- Cure / Technology: Single Component
from Epoxies Etc...
20-2121 is formulated for electronic potting, encapsulating and casting applications. The 20-2121 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2121 will cushion and protect sensitive electronic... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Polyurethane
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Allied Electronics, Inc.
Features exceptionally low bleed and evaporation characteristics. Will not harden, dry out or melt; will not contaminate wave and solder baths. Meets or exceeds KS 21343 and MIL-C-47113. Use with both metal and plastic. Ideal for Electronic Applications. Avoids Silicone Contamination for Soldering [See More]
- Form / Shape: Grease, Paste
- Use Temperature: -40 to 392
- Chemical System: Silicone
from Aremco Products, Inc.
Used for repairing metal components, pinholes, cracks, and filling seams. [See More]
- Form / Shape: Grease, Paste; Gap Filler, Foam in Place Gasket
- Composition: Filled
- Chemical System: Ceramic
- Cure / Technology: Thermoset
from Epoxies Etc...
50-3186 is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 is a perfect choice for applications requiring high thermal conductivity, low thermal expansion, and high operating temperature performance. [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Allied Electronics, Inc.
The tube dispenser for precise application of silicone compound that facilitates heat transfer away from electronics and electrical components. Excellent Thermal Conductivity and Dielectric Properties. Will Not Dry Out, Harden or Melt. Noncorrosive and Nonflammable. Thermally Stable from –40... [See More]
- Form / Shape: Grease, Paste
from Allied Electronics, Inc.
Wrist Strap Ground Cords, Ground Cord. Non-contaminating Synthetic-Ester based, capable of moving 46% more heat than other compounds. Meets Belcore spec. K521334 and Mil spec. C-47113. All GC Aerosols, Except as noted contain no Ecology-Damaging Fluorocarbons [See More]
- Form / Shape: Grease, Paste
- Use Temperature: -22 to 390
from Allied Electronics, Inc.
The tube dispenser for precise application of silicone compound that facilitates heat transfer away from electronics and electrical components. Excellent Thermal Conductivity and Dielectric Properties. Will Not Dry Out, Harden or Melt. Noncorrosive and Nonflammable. Thermally Stable from –40... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Silicone
from Allied Electronics, Inc.
The tube dispenser for precise application of silicone compound that facilitates heat transfer away from electronics and electrical components. Excellent Thermal Conductivity and Dielectric Properties. Will Not Dry Out, Harden or Melt. Noncorrosive and Nonflammable. Thermally Stable from –40... [See More]
- Form / Shape: Grease, Paste
- Use Temperature: -40 to 342
- Chemical System: Silicone
from Allied Electronics, Inc.
Heat Sink, 2.350 Specific Gravity. Zinc oxide filled silicone grease with heat transfer properties. Does not soften under elevated temperatures. Will not dry and harden. All GC Aerosols, Except as noted contain no Ecology-Damaging Fluorocarbons [See More]
- Form / Shape: Grease, Paste
from Allied Electronics, Inc.
Wrist Strap Ground Cords, Ground Cord. Zinc oxide filled silicone grease with heat transfer properties. Does not soften under elevated temperatures. Will not dry and harden. All GC Aerosols, Except as noted contain no Ecology-Damaging Fluorocarbons [See More]
- Form / Shape: Grease, Paste
- Use Temperature: -40 to 400
from Allied Electronics, Inc.
Wrist Strap Ground Cords, Ground Cord. Higher thermal conductivity formula has all the same benefits of conventional heat sink greases, plus is exceptionally stable in high humidity applications. All GC Aerosols, Except as noted contain no Ecology-Damaging Fluorocarbons [See More]
- Form / Shape: Grease, Paste
- Use Temperature: -40 to 400
- Chemical System: Silicone
from Allied Electronics, Inc.
Ionization Test Kit, 1000 V Voltage Rating. Silicone Free Heat Sink Compound, 4 ounce Tube. Ideal for Electronic Applications. Avoids Silicone Contamination for Soldering [See More]
- Form / Shape: Grease, Paste
- Dielectric Strength: 200
- Use Temperature: -40 to 392