Grease / Paste Thermal Compounds and Thermal Interface Materials
from Thermon, Inc
T-3 heat transfer compound now has higher temperature ratings than ever before while still creating an efficient thermal bond between a steam or electric heater and process pipes or equipment. A single "Thermonized ™"steam tracer utilizing Thermon's heat transfer compound is more cost... [See More]
- Form / Shape: Grease, Paste; Gap Filler, Foam in Place Gasket
- Use Temperature: 32 to 850
- Cure / Technology: Single Component
- Thermal Conductivity: 34.61 to 69.23
from MacDermid Alpha Electronics Solutions
A silver sinter paste, providing high thermal and electrical conductivity. Product Overview. The ALPHA ® Argomax ® 2020 Paste is a high-performance silver sinter paste used in applications that require excellent thermal and electrical conductivity. This paste is particularly suited for... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Industry: Automotive; Electronics; Semiconductors, IC's
from Master Bond, Inc.
EP3HTND-2Med Black is a one part system that combines easy processing with excellent bonding properties. It cures in 20-30 minutes at 250°F or 5-10 minutes at 300°F and adheres well to a wide variety of substrates including glass, metals, ceramics and most plastics. This paste compound meets USP... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Dongguan Sheen Electronic Technology Co., Ltd.
The SHEEN's SG560 Series Thermal Grease are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, available in options ranging from 1.0 to 5.0 W/m ·K. ◆ Low thermal impedance, with a minimum of 0.015 ℃*in ²/W at 30psi. ◆ Minimum... [See More]
- Form / Shape: Grease, Paste
- Use Temperature: ? to 302
- Industry: Electronics
- Thermal Conductivity: 4
from Fujipoly® America Corp.
Fujipoly ® America announces the release of its new SARCON ® SPG-70A. It is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0 W/m °K and has the lowest thermal resistance among our dispensable SPG products. When applied between heat-generating... [See More]
- Form / Shape: Grease, Paste; Gap Filler, Foam in Place Gasket
- Industry: Electronics
- Chemical System: Silicone
- Thermal Conductivity: 7
from RS Components, Ltd.
SILICONE-FREE HEAT TRANSFER [See More]
- Form / Shape: Grease, Paste
- Thermal Conductivity: 0.9000
- Use Temperature: -58 to 266
from Thermon, Inc
The New & Improved T-85 is a pre-mixed epoxy-based heat transfer compound with higher temperature ratings and the highest possible bond strength for use in moist and corrosive environments. T-85 is typically utilized on pumps, valves and equipment where maximum bond strength for tracing installation... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Use Temperature: 32 to 450
- Cure / Technology: Single Component
- Thermal Conductivity: 34.61 to 69.23
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Form / Shape: Grease, Paste; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Addition Cure
from Fujipoly® America Corp.
Fujipoly ® USA introduces new 5 and 6W/m-K SARCON ® thermally conductive greases to the North American market. SARCON ® SG-50NS and SG-60NS greases offer excellent stability over wide temperature ranges with low thermal resistance. They feature exceptionally low bleed and evaporation as... [See More]
- Form / Shape: Grease, Paste
- Thermal Conductivity: 5 to 6
- Industry: Electronics
from RS Components, Ltd.
THERM GREASE NON SILIC. [See More]
- Form / Shape: Grease, Paste
- Thermal Conductivity: 0.9000
- Use Temperature: -58 to 266
from Thermon, Inc
T-99 is a specialty high temperature heat transfer compound formulated to provide high thermal stability and bond strength up to 1204°C (2200°F). Unlike other grades of heat transfer compounds, it is also electrically non-conductive (when cured). It is supplied ready to use and may be applied by... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Use Temperature: 32 to 2200
- Cure / Technology: Single Component
- Thermal Conductivity: 25.96 to 51.92
from Master Bond, Inc.
Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. Its most salient features are its high flexibility and elongation. This... [See More]
- Form / Shape: Die Bonding Adhesives; Optional Premixed and Frozen; Grease, Paste; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy; Polyurethane
- Type: High Dielectric
- Composition: Filled
from Fujipoly® America Corp.
Sarcon ® SG-07SL and SG-26SL are highly thermally conductive, non-reactive silicone-based greases that offer low thermal resistance and maintain a nonflow able composition. Unique binding agents and product formulation ensure the lowest amount of bleed and evaporation. Suited for thin bond line... [See More]
- Form / Shape: Grease, Paste
- Industry: Electronics; Semiconductors, IC's
- Chemical System: Silicone
- Use Temperature: -67 to 401
from RS Components, Ltd.
MG Super Thermal grease II 3ml [See More]
- Form / Shape: Grease, Paste
- Thermal Conductivity: 1.8
- Use Temperature: -90 to 329
from Master Bond, Inc.
Master Bond EP3HTS-TC is a fast curing, silver filled, one part epoxy with unparalleled electrical and thermal conductivity. [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste; Encapsulant or Conformal Coating
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Fujipoly® America Corp.
SARCON ® SPG-25B-NS from Fujipoly ® is an easy to dispense, low- viscosity, silicone free compound that exhibits a thermal conductivity of 2.5 W/m °K and a thermal resistance of only 2.1 °K •cm2/W. When applied between heat-generating components and a nearby heat sink or... [See More]
- Form / Shape: Grease, Paste; Gap Filler, Foam in Place Gasket
- Use Temperature: -40 to 248
- Industry: Electronics
- Thermal Conductivity: 2.5 to 25
from RS Components, Ltd.
MG Super Thermal grease II 25ml [See More]
- Form / Shape: Grease, Paste
- Thermal Conductivity: 1.8
- Use Temperature: -90 to 329
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from RS Components, Ltd.
MG Super Thermal grease II 85ml [See More]
- Form / Shape: Grease, Paste
- Thermal Conductivity: 1.8
- Use Temperature: -90 to 329
from Master Bond, Inc.
Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme... [See More]
- Form / Shape: Glob Top, Daub, Doming or Overfill; Grease, Paste; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from RS Components, Ltd.
Heat Sink Compound tube 100g [See More]
- Form / Shape: Grease, Paste
from Master Bond, Inc.
Master Bond EP62-1AO is a two component, flowable epoxy system with an exceptionally long open time at ambient temperature. [See More]
- Form / Shape: Grease, Paste
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from RS Components, Ltd.
Heat Sink Compound seringue 20g [See More]
- Form / Shape: Grease, Paste
from Master Bond, Inc.
Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. It readily develops a high bonding strength of more than 2000 psi tensile... [See More]
- Form / Shape: Grease, Paste; Gap Filler, Foam in Place Gasket
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from RS Components, Ltd.
860 60G Tub of Heat Trans Comp Silicone [See More]
- Form / Shape: Grease, Paste
- Use Temperature: -40 to 392
- Chemical System: Silicone
- Thermal Conductivity: 0.7000
from Master Bond, Inc.
Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. EP79 offers a convenient one-to-one mix ratio by weight or... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste; Gap Filler, Foam in Place Gasket
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from RS Components, Ltd.
860 150G Tube Silicone Heat Trans Compd [See More]
- Form / Shape: Grease, Paste
- Use Temperature: -40 to 392
- Chemical System: Silicone
- Thermal Conductivity: 0.7000
from Master Bond, Inc.
Featuring a low volume resistivity of 5-10 ohm-cm, EP21TDCN-LO is a nickel conductive system for high performance bonding and sealing applications. This smooth paste formulation is easy to handle and has a one to one mix ratio by weight or volume. It is a toughened system, formulated to withstand... [See More]
- Form / Shape: Grease, Paste
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
SILICON COMPOUND [See More]
- Form / Shape: Grease, Paste
- Use Temperature: -58 to 482
- Chemical System: Silicone
- Thermal Conductivity: 0.4100
from Shiu Li Technology Co., Ltd
LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures. [See More]
- Form / Shape: Liquid; Grease, Paste; Gap Filler, Foam in Place Gasket
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Sauereisen, Inc.
Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Chemical System: Ceramic
- Type: High Dielectric
- Composition: Unfilled
from Aremco Products, Inc.
High thermal conductivity, probes, sensors [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste; Gap Filler, Foam in Place Gasket
- Chemical System: Ceramic
- Type: High Dielectric
- Composition: Filled
from Nordson EFD
Our innovative, non-silicone thermal compounds provide an ideal thermal solution by ensuring reliable heat transfer over a longer time than most industrial thermal interface materials. Conventional, silicone-based heat sink compounds and thermal greases tend to spread after a number of heating and... [See More]
- Form / Shape: Grease, Paste
- Cure / Technology: Single Component
- Composition: Unfilled
- Industry: Electronics; Semiconductors, IC's
from Protavic America, Inc.
Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast in-line cure and high strength. It is available in various viscosities for production needs. One... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Hi-Tech Seals, Inc.
HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]
- Form / Shape: Grease, Paste
- Cure / Technology: Two Component
- Chemical System: Acrylic
- Industry: Electronics
from OMEGA Engineering, Inc.
OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Silicone
- Type: High Dielectric
- Cure / Technology: Single Component
from Wacker Chemical Corp.
Pure white, soft consistency, heat sink paste with marked thermal conductivity. Electrically insulating. Application. WACKER ® SILICONE PASTE P 12 is used especially in semiconductor technology as a heat sink paste. Wherever it is important to have good heat transfer from a semiconductor to a... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Silicone
- Type: High Dielectric
- Industry: Electronics
from Epoxies Etc...
The 10-2055 and 10-2055 HV were developed to produce a general purpose, semi flexible polyurethane adhesive for bonding a wide variety of plastic and metal substrates. The flexibility of these adhesives allows bonding to substrates with high coefficients of thermal expansion (CTE) and substrates... [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Polyurethane
- Industry: OEM or Industrial
from Techsil Limited
Momentive TIA241GF is a 2 part, thermally conductive silicone that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, the non-slumping paste consistency of TIA214GF provides physical stability to prevent run-off after dispense. [See More]
- Form / Shape: Grease, Paste; Gap Filler, Foam in Place Gasket
- Industry: Electronics
- Chemical System: Silicone
- Features: Flame Retardant
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Epoxy
- Type: High Dielectric; Optical
- Cure / Technology: Thermoset; Two Component
from Bluestar Silicones USA Corp.
Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]
- Form / Shape: Grease, Paste
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics; Electric Power; Semiconductors, IC's
from Shiu Li Technology Co., Ltd
LiPOLY ’s TIM12/TIM14 is a one-part silicon-based thermally conductive adhesive that can be cured at room temperature or high temperature. It not only produces low stress, low thermal resistance, low viscosity, and good adhesion to components, but also maintains insulating properties. It... [See More]
- Form / Shape: Gel; Die Bonding Adhesives; Grease, Paste
- Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing (optional feature); High Heat
- Chemical System: Silicone
- Industry: Electronics
from Aremco Products, Inc.
Aremco ’s high temperature ceramic adhesives are unique inorganic formulations for bonding and sealing ceramics, metals, quartz, graphites, textiles, and composite materials used in design, process and maintenance applications to 3200 °F. These advanced materials, which exhibit high... [See More]
- Form / Shape: Grease, Paste
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Type: High Dielectric
- Industry: Electronics
from OMEGA Engineering, Inc.
OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]
- Form / Shape: Grease, Paste
- Chemical System: Silicone
- Type: High Dielectric
- Cure / Technology: Single Component
from Epoxies Etc...
20-2121 is formulated for electronic potting, encapsulating and casting applications. The 20-2121 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2121 will cushion and protect sensitive electronic... [See More]
- Form / Shape: Grease, Paste
- Chemical System: Polyurethane
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Aremco Products, Inc.
Used for repairing metal components, pinholes, cracks, and filling seams. [See More]
- Form / Shape: Grease, Paste; Gap Filler, Foam in Place Gasket
- Composition: Filled
- Chemical System: Ceramic
- Cure / Technology: Thermoset
from Epoxies Etc...
50-3186 is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 is a perfect choice for applications requiring high thermal conductivity, low thermal expansion, and high operating temperature performance. [See More]
- Form / Shape: Die Bonding Adhesives; Grease, Paste
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component