Thermoplastic / Hot Melt Thermal Compounds and Thermal Interface Materials
from MacDermid Alpha Electronics Solutions
A thermoplastic adhesive film that bonds at low temps with a low modulus (60,000 psi). Product Overview. STAYSTIK 472 Thermoplastic Adhesive Film is designed for a variety of electronic applications, offering excellent bonding at low process temperatures and an exceptionally low elastic modulus of... [See More]
- Cure / Technology: Thermoplastic / Hot Melt; Thermoset
- Industry: Electronics; Semiconductors, IC's
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Chemical System: Polyamide
- Type: High Dielectric
- Form / Shape: Pellets
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Cure / Technology: Thermoplastic / Hot Melt
- Chemical System: Polyamide
- Type: High Dielectric
- Form / Shape: Pellets
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Cure / Technology: Thermoplastic / Hot Melt
- Chemical System: Polyamide
- Type: High Dielectric
- Form / Shape: Pellets
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Form / Shape: Pellets
- Type: High Dielectric
- Industry: Electronics
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Chemical System: Polyamide
- Type: High Dielectric
- Form / Shape: Pellets
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Cure / Technology: Thermoplastic / Hot Melt
- Chemical System: Polyamide
- Type: High Dielectric; Optical
- Form / Shape: Pellets