Glob Top / Daub Thermal Compounds and Thermal Interface Materials

Glob Top Epoxy -- EPO-TEK® T7139
from Epoxy Technology

EPO-TEK ® T7139 is an electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly. [See More]

  • Form / Shape: Glob Top, Daub, Doming or Overfill; Grease, Paste
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Filled
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Form / Shape: Glob Top, Daub, Doming or Overfill; Liquid; Encapsulant or Conformal Coating
  • Composition: Filled
  • Type: High Dielectric
  • Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
Epoxy Adhesive -- PNE-30270
from Protavic America, Inc.

A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]

  • Form / Shape: Glob Top, Daub, Doming or Overfill; Liquid; Die Bonding Adhesives
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component