Glob Top / Daub Thermal Compounds and Thermal Interface Materials
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Form / Shape: Glob Top, Daub, Doming or Overfill; Liquid; Encapsulant or Conformal Coating
- Composition: Filled
- Type: High Dielectric
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
from Master Bond, Inc.
Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme... [See More]
- Form / Shape: Glob Top, Daub, Doming or Overfill; Grease, Paste; Gap Filler, Foam in Place Gasket
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Epoxy Technology
Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile environments,... [See More]
- Form / Shape: Glob Top, Daub, Doming or Overfill; Die Bonding Adhesives; Grease, Paste
- Chemical System: Epoxy
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
from Protavic America, Inc.
A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]
- Form / Shape: Glob Top, Daub, Doming or Overfill; Liquid; Die Bonding Adhesives
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component